JPH07153825A - 静電チャック及びこの静電チャックを用いた被吸着体の処理方法 - Google Patents

静電チャック及びこの静電チャックを用いた被吸着体の処理方法

Info

Publication number
JPH07153825A
JPH07153825A JP29838893A JP29838893A JPH07153825A JP H07153825 A JPH07153825 A JP H07153825A JP 29838893 A JP29838893 A JP 29838893A JP 29838893 A JP29838893 A JP 29838893A JP H07153825 A JPH07153825 A JP H07153825A
Authority
JP
Japan
Prior art keywords
electrostatic chuck
dielectric layer
less
area
protrusions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29838893A
Other languages
English (en)
Japanese (ja)
Inventor
Tetsuo Kitabayashi
徹夫 北林
Atsushi Obara
淳 小原
Atsushi Miyaji
淳 宮地
Yasumi Sago
康実 佐護
Masami Sasaki
正己 佐々木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Toto Ltd
Original Assignee
Toto Ltd
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toto Ltd, Anelva Corp filed Critical Toto Ltd
Priority to JP29838893A priority Critical patent/JPH07153825A/ja
Priority to US08/341,001 priority patent/US5530616A/en
Priority to TW083110747A priority patent/TW258827B/zh
Priority to KR1019940031042A priority patent/KR0142055B1/ko
Publication of JPH07153825A publication Critical patent/JPH07153825A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
    • H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
    • H01L21/6833—Details of electrostatic chucks

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Jigs For Machine Tools (AREA)
JP29838893A 1993-11-29 1993-11-29 静電チャック及びこの静電チャックを用いた被吸着体の処理方法 Pending JPH07153825A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP29838893A JPH07153825A (ja) 1993-11-29 1993-11-29 静電チャック及びこの静電チャックを用いた被吸着体の処理方法
US08/341,001 US5530616A (en) 1993-11-29 1994-11-17 Electrostastic chuck
TW083110747A TW258827B (enExample) 1993-11-29 1994-11-18
KR1019940031042A KR0142055B1 (ko) 1993-11-29 1994-11-24 정전 척

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29838893A JPH07153825A (ja) 1993-11-29 1993-11-29 静電チャック及びこの静電チャックを用いた被吸着体の処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2003177771A Division JP3862676B2 (ja) 2003-06-23 2003-06-23 プラズマエッチング方法

Publications (1)

Publication Number Publication Date
JPH07153825A true JPH07153825A (ja) 1995-06-16

Family

ID=17859060

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29838893A Pending JPH07153825A (ja) 1993-11-29 1993-11-29 静電チャック及びこの静電チャックを用いた被吸着体の処理方法

Country Status (4)

Country Link
US (1) US5530616A (enExample)
JP (1) JPH07153825A (enExample)
KR (1) KR0142055B1 (enExample)
TW (1) TW258827B (enExample)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0764979A3 (en) * 1995-09-20 1998-07-15 Hitachi, Ltd. Electrostatically attracting electrode and a method of manufacture thereof
JP2000106392A (ja) * 1998-09-29 2000-04-11 Ngk Insulators Ltd 静電チャック
JP2000340640A (ja) * 1999-05-31 2000-12-08 Toto Ltd 非接触型静電吸着装置
JP2002076105A (ja) * 2000-06-14 2002-03-15 Anelva Corp 静電吸着機構及び表面処理装置
JP2002222851A (ja) * 2001-01-29 2002-08-09 Ngk Insulators Ltd 静電チャックおよび基板処理装置
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
US6556414B2 (en) 2000-06-02 2003-04-29 Sumitomo Osaka Cement Co., Ltd. Electrostatic and vacuum chucking holding apparatus
JP2003249542A (ja) * 2001-12-20 2003-09-05 Nikon Corp 基板保持装置、露光装置及びデバイス製造方法
JP2004128019A (ja) * 2002-09-30 2004-04-22 Applied Materials Inc プラズマ処理方法及び装置
US6863281B2 (en) 2001-09-13 2005-03-08 Sumitomo Osaka Cement Co., Ltd. Chucking apparatus and production method for the same
JP2006303514A (ja) * 2006-05-01 2006-11-02 Fujitsu Ltd 静電チャック、成膜方法及びエッチング方法
KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US7214271B2 (en) 2001-09-27 2007-05-08 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer process apparatus, silicon single crystal wafer, and manufacturing method of silicon epitaxial wafer
JP2007511900A (ja) * 2003-10-10 2007-05-10 アクセリス テクノロジーズ インコーポレーテッド Ｍｅｍｓベースの接触伝導型静電チャック
US7248456B2 (en) 2003-01-29 2007-07-24 Kyocera Corporation Electrostatic chuck
US7586734B2 (en) 2004-06-28 2009-09-08 Kyocera Corporation Electrostatic chuck
US7646580B2 (en) 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
KR20140095430A (ko) * 2013-01-24 2014-08-01 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 탑재대
JP2016509688A (ja) * 2013-01-22 2016-03-31 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ
JP2023031456A (ja) * 2021-08-25 2023-03-09 日本特殊陶業株式会社 基板保持部材、およびその製造方法

Families Citing this family (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6278600B1 (en) 1994-01-31 2001-08-21 Applied Materials, Inc. Electrostatic chuck with improved temperature control and puncture resistance
US5631803A (en) * 1995-01-06 1997-05-20 Applied Materials, Inc. Erosion resistant electrostatic chuck with improved cooling system
JP3457477B2 (ja) * 1995-09-06 2003-10-20 日本碍子株式会社 静電チャック
JPH09172055A (ja) * 1995-12-19 1997-06-30 Fujitsu Ltd 静電チャック及びウエハの吸着方法
US5841623A (en) * 1995-12-22 1998-11-24 Lam Research Corporation Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system
JPH09213777A (ja) * 1996-01-31 1997-08-15 Kyocera Corp 静電チャック
US5810933A (en) * 1996-02-16 1998-09-22 Novellus Systems, Inc. Wafer cooling device
US5656093A (en) * 1996-03-08 1997-08-12 Applied Materials, Inc. Wafer spacing mask for a substrate support chuck and method of fabricating same
US5761023A (en) * 1996-04-25 1998-06-02 Applied Materials, Inc. Substrate support with pressure zones having reduced contact area and temperature feedback
US5986873A (en) * 1996-07-01 1999-11-16 Packard Hughes Interconnect Co. Creating surface topography on an electrostatic chuck with a mandrel
US6217655B1 (en) * 1997-01-31 2001-04-17 Applied Materials, Inc. Stand-off pad for supporting a wafer on a substrate support chuck
US5870271A (en) * 1997-02-19 1999-02-09 Applied Materials, Inc. Pressure actuated sealing diaphragm for chucks
US5986874A (en) * 1997-06-03 1999-11-16 Watkins-Johnson Company Electrostatic support assembly having an integral ion focus ring
US5978202A (en) * 1997-06-27 1999-11-02 Applied Materials, Inc. Electrostatic chuck having a thermal transfer regulator pad
US5903428A (en) * 1997-09-25 1999-05-11 Applied Materials, Inc. Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same
US6219219B1 (en) * 1998-09-30 2001-04-17 Applied Materials, Inc. Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system
US6320736B1 (en) 1999-05-17 2001-11-20 Applied Materials, Inc. Chuck having pressurized zones of heat transfer gas
US6373679B1 (en) 1999-07-02 2002-04-16 Cypress Semiconductor Corp. Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same
KR20010018837A (ko) * 1999-08-23 2001-03-15 김영환 반도체 식각장비의 정전척
TW473792B (en) * 2000-01-20 2002-01-21 Ngk Insulators Ltd Electrostatic chuck
JP3626933B2 (ja) * 2001-02-08 2005-03-09 東京エレクトロン株式会社 基板載置台の製造方法
TWI272689B (en) * 2001-02-16 2007-02-01 Tokyo Electron Ltd Method and apparatus for transferring heat from a substrate to a chuck
JP3758979B2 (ja) * 2001-02-27 2006-03-22 京セラ株式会社 静電チャック及び処理装置
US6628503B2 (en) * 2001-03-13 2003-09-30 Nikon Corporation Gas cooled electrostatic pin chuck for vacuum applications
DE60225135T2 (de) * 2001-05-31 2009-02-26 Shin-Etsu Handotai Co., Ltd. Verfahren zur herstellung eines halbleiterswafers
US6506291B2 (en) * 2001-06-14 2003-01-14 Applied Materials, Inc. Substrate support with multilevel heat transfer mechanism
US6490145B1 (en) 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2003224180A (ja) * 2002-01-28 2003-08-08 Kyocera Corp ウエハ支持部材
KR100511854B1 (ko) * 2002-06-18 2005-09-02 아네르바 가부시키가이샤 정전 흡착 장치
US20040055709A1 (en) * 2002-09-19 2004-03-25 Applied Materials, Inc. Electrostatic chuck having a low level of particle generation and method of fabricating same
TWI254841B (en) * 2002-12-23 2006-05-11 Asml Netherlands Bv Lithographic apparatus
US7033443B2 (en) * 2003-03-28 2006-04-25 Axcelis Technologies, Inc. Gas-cooled clamp for RTP
EP1498777A1 (en) * 2003-07-15 2005-01-19 ASML Netherlands B.V. Substrate holder and lithographic projection apparatus
JP4309714B2 (ja) * 2003-08-27 2009-08-05 信越化学工業株式会社 静電吸着機能を有する加熱装置
EP1510868A1 (en) * 2003-08-29 2005-03-02 ASML Netherlands B.V. Lithographic apparatus and device manufacturing method
US7245357B2 (en) * 2003-12-15 2007-07-17 Asml Netherlands B.V. Lithographic apparatus and device manufacturing method
KR100709589B1 (ko) * 2005-11-14 2007-04-20 (주)소슬 웨이퍼를 용이하게 탈착시킬 수 있는 엠보싱 척
USD561206S1 (en) * 2005-11-25 2008-02-05 Momentive Performance Materials Inc. Electrostatic chuck
JP2007173596A (ja) * 2005-12-22 2007-07-05 Ngk Insulators Ltd 静電チャック
US20070217119A1 (en) * 2006-03-17 2007-09-20 David Johnson Apparatus and Method for Carrying Substrates
US8226769B2 (en) * 2006-04-27 2012-07-24 Applied Materials, Inc. Substrate support with electrostatic chuck having dual temperature zones
JP4864757B2 (ja) * 2007-02-14 2012-02-01 東京エレクトロン株式会社 基板載置台及びその表面処理方法
US7580238B2 (en) * 2007-05-18 2009-08-25 Dongbu Hitek Co., Ltd. Electrostatic chuck structure for semiconductor manufacturing apparatus
US7558045B1 (en) * 2008-03-20 2009-07-07 Novellus Systems, Inc. Electrostatic chuck assembly with capacitive sense feature, and related operating method
US8139340B2 (en) * 2009-01-20 2012-03-20 Plasma-Therm Llc Conductive seal ring electrostatic chuck
USD708651S1 (en) * 2011-11-22 2014-07-08 Applied Materials, Inc. Electrostatic chuck
US10557190B2 (en) * 2013-01-24 2020-02-11 Tokyo Electron Limited Substrate processing apparatus and susceptor
JP6649689B2 (ja) * 2015-03-16 2020-02-19 株式会社ディスコ 減圧処理装置及びウエーハの保持方法
US20170069518A1 (en) * 2015-09-04 2017-03-09 Globalfoundries Inc. Electrostatic substrate holder with non-planar surface and method of etching
US20180148835A1 (en) 2016-11-29 2018-05-31 Lam Research Corporation Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricating
US11152238B2 (en) * 2017-11-30 2021-10-19 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing stage profiler jig
KR20200130743A (ko) * 2018-04-04 2020-11-19 램 리써치 코포레이션 시일 표면을 갖는 정전 척
US11133212B2 (en) * 2018-05-16 2021-09-28 Applied Materials, Inc. High temperature electrostatic chuck
US10663871B2 (en) * 2018-07-30 2020-05-26 Taiwan Semiconductor Manufacturing Co., Ltd. Reticle stage and method for using the same
JP6705551B1 (ja) * 2019-03-22 2020-06-03 Toto株式会社 静電チャック
US20230395359A1 (en) * 2020-10-20 2023-12-07 Lam Research Corporation Cold edge low temperature electrostatic chuck

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JPH01313954A (ja) * 1988-06-14 1989-12-19 Fujitsu Ltd 静電チャック
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JP2902677B2 (ja) * 1989-08-14 1999-06-07 三洋電機株式会社 磁気記録再生装置
JP3129452B2 (ja) * 1990-03-13 2001-01-29 富士電機株式会社 静電チャック
EP1120817B8 (en) * 1991-03-26 2007-10-10 Ngk Insulators, Ltd. Use of a corrosion-resistant member
US5191506A (en) * 1991-05-02 1993-03-02 International Business Machines Corporation Ceramic electrostatic chuck
US5267607A (en) * 1991-05-28 1993-12-07 Tokyo Electron Limited Substrate processing apparatus
US5213349A (en) * 1991-12-18 1993-05-25 Elliott Joe C Electrostatic chuck
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JP2854453B2 (ja) * 1992-03-27 1999-02-03 京セラ株式会社 半導体ウェハ保持装置
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Cited By (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0764979A3 (en) * 1995-09-20 1998-07-15 Hitachi, Ltd. Electrostatically attracting electrode and a method of manufacture thereof
JP2000106392A (ja) * 1998-09-29 2000-04-11 Ngk Insulators Ltd 静電チャック
JP2000340640A (ja) * 1999-05-31 2000-12-08 Toto Ltd 非接触型静電吸着装置
US6556414B2 (en) 2000-06-02 2003-04-29 Sumitomo Osaka Cement Co., Ltd. Electrostatic and vacuum chucking holding apparatus
JP2002076105A (ja) * 2000-06-14 2002-03-15 Anelva Corp 静電吸着機構及び表面処理装置
JP2002222851A (ja) * 2001-01-29 2002-08-09 Ngk Insulators Ltd 静電チャックおよび基板処理装置
JP2002270681A (ja) * 2001-03-07 2002-09-20 Anelva Corp 基板処理用静電吸着機構
US6863281B2 (en) 2001-09-13 2005-03-08 Sumitomo Osaka Cement Co., Ltd. Chucking apparatus and production method for the same
US7214271B2 (en) 2001-09-27 2007-05-08 Shin-Etsu Handotai Co., Ltd. Silicon single crystal wafer process apparatus, silicon single crystal wafer, and manufacturing method of silicon epitaxial wafer
JP2003249542A (ja) * 2001-12-20 2003-09-05 Nikon Corp 基板保持装置、露光装置及びデバイス製造方法
JP2004128019A (ja) * 2002-09-30 2004-04-22 Applied Materials Inc プラズマ処理方法及び装置
US7457098B2 (en) 2003-01-29 2008-11-25 Kyocera Corporation Electrostatic chuck
US7248456B2 (en) 2003-01-29 2007-07-24 Kyocera Corporation Electrostatic chuck
JP2007511900A (ja) * 2003-10-10 2007-05-10 アクセリス テクノロジーズ インコーポレーテッド Ｍｅｍｓベースの接触伝導型静電チャック
KR100666039B1 (ko) * 2003-12-05 2007-01-10 동경 엘렉트론 주식회사 정전척
US7663860B2 (en) 2003-12-05 2010-02-16 Tokyo Electron Limited Electrostatic chuck
US7586734B2 (en) 2004-06-28 2009-09-08 Kyocera Corporation Electrostatic chuck
US7646580B2 (en) 2005-02-24 2010-01-12 Kyocera Corporation Electrostatic chuck and wafer holding member and wafer treatment method
JP2006303514A (ja) * 2006-05-01 2006-11-02 Fujitsu Ltd 静電チャック、成膜方法及びエッチング方法
JP2016509688A (ja) * 2013-01-22 2016-03-31 エーエスエムエル ネザーランズ ビー．ブイ． 静電クランプ
US9939737B2 (en) 2013-01-22 2018-04-10 Asml Netherlands B.V. Electrostatic clamp
KR20140095430A (ko) * 2013-01-24 2014-08-01 도쿄엘렉트론가부시키가이샤 기판 처리 장치 및 탑재대
JP2023031456A (ja) * 2021-08-25 2023-03-09 日本特殊陶業株式会社 基板保持部材、およびその製造方法

Also Published As

Publication number Publication date
US5530616A (en) 1996-06-25
KR950015708A (ko) 1995-06-17
TW258827B (enExample) 1995-10-01
KR0142055B1 (ko) 1998-07-15

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Effective date: 20040402