TW258827B - - Google Patents
Info
- Publication number
- TW258827B TW258827B TW083110747A TW83110747A TW258827B TW 258827 B TW258827 B TW 258827B TW 083110747 A TW083110747 A TW 083110747A TW 83110747 A TW83110747 A TW 83110747A TW 258827 B TW258827 B TW 258827B
- Authority
- TW
- Taiwan
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02N—ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR
- H02N13/00—Clutches or holding devices using electrostatic attraction, e.g. using Johnson-Rahbek effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Jigs For Machine Tools (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP29838893A JPH07153825A (ja) | 1993-11-29 | 1993-11-29 | 静電チャック及びこの静電チャックを用いた被吸着体の処理方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW258827B true TW258827B (zh) | 1995-10-01 |
Family
ID=17859060
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW083110747A TW258827B (zh) | 1993-11-29 | 1994-11-18 |
Country Status (4)
Country | Link |
---|---|
US (1) | US5530616A (zh) |
JP (1) | JPH07153825A (zh) |
KR (1) | KR0142055B1 (zh) |
TW (1) | TW258827B (zh) |
Families Citing this family (71)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6278600B1 (en) | 1994-01-31 | 2001-08-21 | Applied Materials, Inc. | Electrostatic chuck with improved temperature control and puncture resistance |
US5631803A (en) * | 1995-01-06 | 1997-05-20 | Applied Materials, Inc. | Erosion resistant electrostatic chuck with improved cooling system |
JP3457477B2 (ja) * | 1995-09-06 | 2003-10-20 | 日本碍子株式会社 | 静電チャック |
US5781400A (en) * | 1995-09-20 | 1998-07-14 | Hitachi, Ltd. | Electrostatically attracting electrode and a method of manufacture thereof |
JPH09172055A (ja) * | 1995-12-19 | 1997-06-30 | Fujitsu Ltd | 静電チャック及びウエハの吸着方法 |
US5841623A (en) * | 1995-12-22 | 1998-11-24 | Lam Research Corporation | Chuck for substrate processing and method for depositing a film in a radio frequency biased plasma chemical depositing system |
JPH09213777A (ja) * | 1996-01-31 | 1997-08-15 | Kyocera Corp | 静電チャック |
US5810933A (en) * | 1996-02-16 | 1998-09-22 | Novellus Systems, Inc. | Wafer cooling device |
US5656093A (en) * | 1996-03-08 | 1997-08-12 | Applied Materials, Inc. | Wafer spacing mask for a substrate support chuck and method of fabricating same |
US5761023A (en) * | 1996-04-25 | 1998-06-02 | Applied Materials, Inc. | Substrate support with pressure zones having reduced contact area and temperature feedback |
US5986873A (en) * | 1996-07-01 | 1999-11-16 | Packard Hughes Interconnect Co. | Creating surface topography on an electrostatic chuck with a mandrel |
US6217655B1 (en) | 1997-01-31 | 2001-04-17 | Applied Materials, Inc. | Stand-off pad for supporting a wafer on a substrate support chuck |
US5870271A (en) * | 1997-02-19 | 1999-02-09 | Applied Materials, Inc. | Pressure actuated sealing diaphragm for chucks |
US5986874A (en) * | 1997-06-03 | 1999-11-16 | Watkins-Johnson Company | Electrostatic support assembly having an integral ion focus ring |
US5978202A (en) * | 1997-06-27 | 1999-11-02 | Applied Materials, Inc. | Electrostatic chuck having a thermal transfer regulator pad |
US5903428A (en) * | 1997-09-25 | 1999-05-11 | Applied Materials, Inc. | Hybrid Johnsen-Rahbek electrostatic chuck having highly resistive mesas separating the chuck from a wafer supported thereupon and method of fabricating same |
JP3983387B2 (ja) * | 1998-09-29 | 2007-09-26 | 日本碍子株式会社 | 静電チャック |
US6219219B1 (en) * | 1998-09-30 | 2001-04-17 | Applied Materials, Inc. | Cathode assembly containing an electrostatic chuck for retaining a wafer in a semiconductor wafer processing system |
US6320736B1 (en) * | 1999-05-17 | 2001-11-20 | Applied Materials, Inc. | Chuck having pressurized zones of heat transfer gas |
JP2000340640A (ja) * | 1999-05-31 | 2000-12-08 | Toto Ltd | 非接触型静電吸着装置 |
US6373679B1 (en) | 1999-07-02 | 2002-04-16 | Cypress Semiconductor Corp. | Electrostatic or mechanical chuck assembly conferring improved temperature uniformity onto workpieces held thereby, workpiece processing technology and/or apparatus containing the same, and method(s) for holding and/or processing a workpiece with the same |
KR20010018837A (ko) * | 1999-08-23 | 2001-03-15 | 김영환 | 반도체 식각장비의 정전척 |
TW473792B (en) * | 2000-01-20 | 2002-01-21 | Ngk Insulators Ltd | Electrostatic chuck |
JP3859937B2 (ja) | 2000-06-02 | 2006-12-20 | 住友大阪セメント株式会社 | 静電チャック |
JP4697833B2 (ja) * | 2000-06-14 | 2011-06-08 | キヤノンアネルバ株式会社 | 静電吸着機構及び表面処理装置 |
JP4312394B2 (ja) * | 2001-01-29 | 2009-08-12 | 日本碍子株式会社 | 静電チャックおよび基板処理装置 |
JP3626933B2 (ja) * | 2001-02-08 | 2005-03-09 | 東京エレクトロン株式会社 | 基板載置台の製造方法 |
TWI272689B (en) * | 2001-02-16 | 2007-02-01 | Tokyo Electron Ltd | Method and apparatus for transferring heat from a substrate to a chuck |
JP3758979B2 (ja) * | 2001-02-27 | 2006-03-22 | 京セラ株式会社 | 静電チャック及び処理装置 |
JP2002270681A (ja) * | 2001-03-07 | 2002-09-20 | Anelva Corp | 基板処理用静電吸着機構 |
US6628503B2 (en) * | 2001-03-13 | 2003-09-30 | Nikon Corporation | Gas cooled electrostatic pin chuck for vacuum applications |
US6890383B2 (en) * | 2001-05-31 | 2005-05-10 | Shin-Etsu Handotai Co., Ltd. | Method of manufacturing semiconductor wafer and susceptor used therefor |
US6506291B2 (en) * | 2001-06-14 | 2003-01-14 | Applied Materials, Inc. | Substrate support with multilevel heat transfer mechanism |
US6490145B1 (en) | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
JP4094262B2 (ja) | 2001-09-13 | 2008-06-04 | 住友大阪セメント株式会社 | 吸着固定装置及びその製造方法 |
JP2003100855A (ja) | 2001-09-27 | 2003-04-04 | Shin Etsu Handotai Co Ltd | シリコン単結晶ウェーハ処理装置、シリコン単結晶ウェーハおよびシリコンエピタキシャルウェーハの製造方法 |
JP4288694B2 (ja) * | 2001-12-20 | 2009-07-01 | 株式会社ニコン | 基板保持装置、露光装置及びデバイス製造方法 |
JP2003224180A (ja) * | 2002-01-28 | 2003-08-08 | Kyocera Corp | ウエハ支持部材 |
KR100511854B1 (ko) * | 2002-06-18 | 2005-09-02 | 아네르바 가부시키가이샤 | 정전 흡착 장치 |
US20040055709A1 (en) * | 2002-09-19 | 2004-03-25 | Applied Materials, Inc. | Electrostatic chuck having a low level of particle generation and method of fabricating same |
JP2004128019A (ja) * | 2002-09-30 | 2004-04-22 | Applied Materials Inc | プラズマ処理方法及び装置 |
CN1311301C (zh) * | 2002-12-23 | 2007-04-18 | Asml荷兰有限公司 | 一种光刻投影装置 |
KR20040070008A (ko) | 2003-01-29 | 2004-08-06 | 쿄세라 코포레이션 | 정전척 |
US7033443B2 (en) * | 2003-03-28 | 2006-04-25 | Axcelis Technologies, Inc. | Gas-cooled clamp for RTP |
EP1498777A1 (en) * | 2003-07-15 | 2005-01-19 | ASML Netherlands B.V. | Substrate holder and lithographic projection apparatus |
JP4309714B2 (ja) * | 2003-08-27 | 2009-08-05 | 信越化学工業株式会社 | 静電吸着機能を有する加熱装置 |
EP1510868A1 (en) * | 2003-08-29 | 2005-03-02 | ASML Netherlands B.V. | Lithographic apparatus and device manufacturing method |
US6905984B2 (en) * | 2003-10-10 | 2005-06-14 | Axcelis Technologies, Inc. | MEMS based contact conductivity electrostatic chuck |
KR100666039B1 (ko) * | 2003-12-05 | 2007-01-10 | 동경 엘렉트론 주식회사 | 정전척 |
US7245357B2 (en) * | 2003-12-15 | 2007-07-17 | Asml Netherlands B.V. | Lithographic apparatus and device manufacturing method |
TWI267940B (en) | 2004-06-28 | 2006-12-01 | Kyocera Corp | Electrostatic chuck |
US7646580B2 (en) | 2005-02-24 | 2010-01-12 | Kyocera Corporation | Electrostatic chuck and wafer holding member and wafer treatment method |
KR100709589B1 (ko) * | 2005-11-14 | 2007-04-20 | (주)소슬 | 웨이퍼를 용이하게 탈착시킬 수 있는 엠보싱 척 |
JP2007173596A (ja) * | 2005-12-22 | 2007-07-05 | Ngk Insulators Ltd | 静電チャック |
US20070217119A1 (en) * | 2006-03-17 | 2007-09-20 | David Johnson | Apparatus and Method for Carrying Substrates |
US8226769B2 (en) * | 2006-04-27 | 2012-07-24 | Applied Materials, Inc. | Substrate support with electrostatic chuck having dual temperature zones |
JP2006303514A (ja) * | 2006-05-01 | 2006-11-02 | Fujitsu Ltd | 静電チャック、成膜方法及びエッチング方法 |
JP4864757B2 (ja) * | 2007-02-14 | 2012-02-01 | 東京エレクトロン株式会社 | 基板載置台及びその表面処理方法 |
US7580238B2 (en) * | 2007-05-18 | 2009-08-25 | Dongbu Hitek Co., Ltd. | Electrostatic chuck structure for semiconductor manufacturing apparatus |
US7558045B1 (en) * | 2008-03-20 | 2009-07-07 | Novellus Systems, Inc. | Electrostatic chuck assembly with capacitive sense feature, and related operating method |
US8139340B2 (en) * | 2009-01-20 | 2012-03-20 | Plasma-Therm Llc | Conductive seal ring electrostatic chuck |
JP6359565B2 (ja) * | 2013-01-22 | 2018-07-18 | エーエスエムエル ネザーランズ ビー.ブイ. | 静電クランプ |
CN103972132B (zh) * | 2013-01-24 | 2017-07-11 | 东京毅力科创株式会社 | 基板处理装置和载置台 |
JP6100564B2 (ja) * | 2013-01-24 | 2017-03-22 | 東京エレクトロン株式会社 | 基板処理装置及び載置台 |
JP6649689B2 (ja) * | 2015-03-16 | 2020-02-19 | 株式会社ディスコ | 減圧処理装置及びウエーハの保持方法 |
US20170069518A1 (en) * | 2015-09-04 | 2017-03-09 | Globalfoundries Inc. | Electrostatic substrate holder with non-planar surface and method of etching |
US11152238B2 (en) * | 2017-11-30 | 2021-10-19 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing stage profiler jig |
US20210013080A1 (en) * | 2018-04-04 | 2021-01-14 | Lam Research Corporation | Electrostatic chuck with seal surface |
US11133212B2 (en) * | 2018-05-16 | 2021-09-28 | Applied Materials, Inc. | High temperature electrostatic chuck |
US10663871B2 (en) * | 2018-07-30 | 2020-05-26 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reticle stage and method for using the same |
JP6705550B1 (ja) * | 2019-03-22 | 2020-06-03 | Toto株式会社 | 静電チャック |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2106325A (en) * | 1981-09-14 | 1983-04-07 | Philips Electronic Associated | Electrostatic chuck |
JPS6060060A (ja) * | 1983-09-12 | 1985-04-06 | 株式会社日立製作所 | 鉄道車両の扉開閉装置 |
US4724510A (en) * | 1986-12-12 | 1988-02-09 | Tegal Corporation | Electrostatic wafer clamp |
JPS6456933A (en) * | 1987-08-27 | 1989-03-03 | Japan Electronic Control Syst | Deceleration controller for internal combustion engine |
ATE95513T1 (de) * | 1988-04-26 | 1993-10-15 | Toto Ltd | Verfahren zur herstellung dielektrischer keramik fuer elektrostatische haltevorrichtungen. |
JPH01313954A (ja) * | 1988-06-14 | 1989-12-19 | Fujitsu Ltd | 静電チャック |
US4962441A (en) * | 1989-04-10 | 1990-10-09 | Applied Materials, Inc. | Isolated electrostatic wafer blade clamp |
JP2902677B2 (ja) * | 1989-08-14 | 1999-06-07 | 三洋電機株式会社 | 磁気記録再生装置 |
JP3129452B2 (ja) * | 1990-03-13 | 2001-01-29 | 富士電機株式会社 | 静電チャック |
US5306895A (en) * | 1991-03-26 | 1994-04-26 | Ngk Insulators, Ltd. | Corrosion-resistant member for chemical apparatus using halogen series corrosive gas |
US5191506A (en) * | 1991-05-02 | 1993-03-02 | International Business Machines Corporation | Ceramic electrostatic chuck |
KR100188454B1 (ko) * | 1991-05-28 | 1999-06-01 | 이노우에 아키라 | 기판 처리 장치 |
US5213349A (en) * | 1991-12-18 | 1993-05-25 | Elliott Joe C | Electrostatic chuck |
US5315473A (en) * | 1992-01-21 | 1994-05-24 | Applied Materials, Inc. | Isolated electrostatic chuck and excitation method |
JP2854453B2 (ja) * | 1992-03-27 | 1999-02-03 | 京セラ株式会社 | 半導体ウェハ保持装置 |
JP2798570B2 (ja) * | 1992-12-01 | 1998-09-17 | 京セラ株式会社 | 静電チャック |
US5350479A (en) * | 1992-12-02 | 1994-09-27 | Applied Materials, Inc. | Electrostatic chuck for high power plasma processing |
-
1993
- 1993-11-29 JP JP29838893A patent/JPH07153825A/ja active Pending
-
1994
- 1994-11-17 US US08/341,001 patent/US5530616A/en not_active Expired - Lifetime
- 1994-11-18 TW TW083110747A patent/TW258827B/zh not_active IP Right Cessation
- 1994-11-24 KR KR1019940031042A patent/KR0142055B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JPH07153825A (ja) | 1995-06-16 |
KR950015708A (ko) | 1995-06-17 |
KR0142055B1 (ko) | 1998-07-15 |
US5530616A (en) | 1996-06-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |