JPH0713221Y2 - 半導体ウェハー用キャリア - Google Patents
半導体ウェハー用キャリアInfo
- Publication number
- JPH0713221Y2 JPH0713221Y2 JP1989002504U JP250489U JPH0713221Y2 JP H0713221 Y2 JPH0713221 Y2 JP H0713221Y2 JP 1989002504 U JP1989002504 U JP 1989002504U JP 250489 U JP250489 U JP 250489U JP H0713221 Y2 JPH0713221 Y2 JP H0713221Y2
- Authority
- JP
- Japan
- Prior art keywords
- carrier
- carrier body
- wafer
- wafers
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 10
- 235000012431 wafers Nutrition 0.000 claims description 38
- 230000003014 reinforcing effect Effects 0.000 claims description 8
- 238000005520 cutting process Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 230000010354 integration Effects 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000012050 conventional carrier Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989002504U JPH0713221Y2 (ja) | 1989-01-12 | 1989-01-12 | 半導体ウェハー用キャリア |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1989002504U JPH0713221Y2 (ja) | 1989-01-12 | 1989-01-12 | 半導体ウェハー用キャリア |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0292931U JPH0292931U (enrdf_load_stackoverflow) | 1990-07-24 |
JPH0713221Y2 true JPH0713221Y2 (ja) | 1995-03-29 |
Family
ID=31203323
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1989002504U Expired - Lifetime JPH0713221Y2 (ja) | 1989-01-12 | 1989-01-12 | 半導体ウェハー用キャリア |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0713221Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6384045A (ja) * | 1986-09-26 | 1988-04-14 | Nec Corp | 半導体ウエハ−の収納容器 |
-
1989
- 1989-01-12 JP JP1989002504U patent/JPH0713221Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0292931U (enrdf_load_stackoverflow) | 1990-07-24 |
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