JPH069519Y2 - 高周波回路の実装構造 - Google Patents

高周波回路の実装構造

Info

Publication number
JPH069519Y2
JPH069519Y2 JP15064387U JP15064387U JPH069519Y2 JP H069519 Y2 JPH069519 Y2 JP H069519Y2 JP 15064387 U JP15064387 U JP 15064387U JP 15064387 U JP15064387 U JP 15064387U JP H069519 Y2 JPH069519 Y2 JP H069519Y2
Authority
JP
Japan
Prior art keywords
frequency
integrated circuit
mounting structure
soldered
high frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP15064387U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6457657U (cs
Inventor
文則 石塚
治彦 加藤
洋 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Nippon Telegraph and Telephone Corp
Original Assignee
Mitsubishi Electric Corp
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp, Nippon Telegraph and Telephone Corp filed Critical Mitsubishi Electric Corp
Priority to JP15064387U priority Critical patent/JPH069519Y2/ja
Publication of JPS6457657U publication Critical patent/JPS6457657U/ja
Application granted granted Critical
Publication of JPH069519Y2 publication Critical patent/JPH069519Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate

Landscapes

  • Waveguide Connection Structure (AREA)
  • Waveguides (AREA)
JP15064387U 1987-10-01 1987-10-01 高周波回路の実装構造 Expired - Lifetime JPH069519Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15064387U JPH069519Y2 (ja) 1987-10-01 1987-10-01 高周波回路の実装構造

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15064387U JPH069519Y2 (ja) 1987-10-01 1987-10-01 高周波回路の実装構造

Publications (2)

Publication Number Publication Date
JPS6457657U JPS6457657U (cs) 1989-04-10
JPH069519Y2 true JPH069519Y2 (ja) 1994-03-09

Family

ID=31423970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15064387U Expired - Lifetime JPH069519Y2 (ja) 1987-10-01 1987-10-01 高周波回路の実装構造

Country Status (1)

Country Link
JP (1) JPH069519Y2 (cs)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6043018B2 (ja) 2014-03-25 2016-12-14 デーウォン カン アップ カンパニー リミテッド 熱間コイルばねの製造装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6043018B2 (ja) 2014-03-25 2016-12-14 デーウォン カン アップ カンパニー リミテッド 熱間コイルばねの製造装置

Also Published As

Publication number Publication date
JPS6457657U (cs) 1989-04-10

Similar Documents

Publication Publication Date Title
JP2001196488A (ja) 電子部品装置及びその製造方法
JPH03225854A (ja) 半導体デバイス及びその製造方法
JP3201681B2 (ja) 表面実装型混成集積回路装置
JP3816821B2 (ja) 高周波用パワーモジュール基板及びその製造方法
JP2861956B2 (ja) 高周波デバイスパッケージ及びその製造方法
JP2534881B2 (ja) 気密封止回路装置
US5243496A (en) Molded case integrated circuit with a dynamic impedance reducing device
JPH069519Y2 (ja) 高周波回路の実装構造
JPS6348901A (ja) マイクロ波デバイス
JPH0794619A (ja) 混成集積回路装置
JP2792377B2 (ja) 半導体装置
JP3445761B2 (ja) 電子デバイス用セラミックパッケージ
US5475567A (en) Method for hermetically sealing a single layer ceramic thick film electronic module
JPH01213018A (ja) 弾性表面波ディバイスの構造
JP3191413B2 (ja) 固体電解コンデンサ
JPS61198656A (ja) 半導体装置
JP2669310B2 (ja) 半導体集積回路装置およびその実装方法
JP2533997B2 (ja) 半導体装置用ケ―ス
JP2879503B2 (ja) 面実装型電子回路装置
JPH0457357A (ja) 集積回路装置
JPH0115144B2 (cs)
JPH0247109B2 (ja) Jushifushigatamojuuru
JP3051225B2 (ja) 集積回路用パッケージ
JP2975783B2 (ja) リードフレームおよび半導体装置
JPH1041416A (ja) 電子部品