JPH069499Y2 - 半導体材料の水切乾燥装置 - Google Patents
半導体材料の水切乾燥装置Info
- Publication number
- JPH069499Y2 JPH069499Y2 JP1987096440U JP9644087U JPH069499Y2 JP H069499 Y2 JPH069499 Y2 JP H069499Y2 JP 1987096440 U JP1987096440 U JP 1987096440U JP 9644087 U JP9644087 U JP 9644087U JP H069499 Y2 JPH069499 Y2 JP H069499Y2
- Authority
- JP
- Japan
- Prior art keywords
- cradle
- rotor
- restraining
- draining
- carrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 title claims description 15
- 230000000452 restraining effect Effects 0.000 claims description 18
- 238000001035 drying Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 8
- 230000013011 mating Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000837 restrainer Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B5/00—Drying solid materials or objects by processes not involving the application of heat
- F26B5/08—Drying solid materials or objects by processes not involving the application of heat by centrifugal treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Molecular Biology (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Drying Of Solid Materials (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Centrifugal Separators (AREA)
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987096440U JPH069499Y2 (ja) | 1987-06-23 | 1987-06-23 | 半導体材料の水切乾燥装置 |
| US07/207,504 US4907349A (en) | 1987-06-23 | 1988-06-16 | Spin drier for semiconductor materials |
| DE3821067A DE3821067A1 (de) | 1987-06-23 | 1988-06-22 | Rotationstrockner fuer halbleitermaterialien |
| KR1019880007684A KR950012659B1 (ko) | 1987-06-23 | 1988-06-23 | 반도체 재료의 물기를 빼는 건조장치 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987096440U JPH069499Y2 (ja) | 1987-06-23 | 1987-06-23 | 半導体材料の水切乾燥装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS642438U JPS642438U (US20020051482A1-20020502-M00057.png) | 1989-01-09 |
| JPH069499Y2 true JPH069499Y2 (ja) | 1994-03-09 |
Family
ID=14165077
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987096440U Expired - Lifetime JPH069499Y2 (ja) | 1987-06-23 | 1987-06-23 | 半導体材料の水切乾燥装置 |
Country Status (4)
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4777732A (en) * | 1986-06-12 | 1988-10-18 | Oki Electric Industry Co., Ltd. | Wafer centrifugal drying apparatus |
| US5174045A (en) * | 1991-05-17 | 1992-12-29 | Semitool, Inc. | Semiconductor processor with extendible receiver for handling multiple discrete wafers without wafer carriers |
| JP3190929B2 (ja) * | 1992-10-26 | 2001-07-23 | 保 目崎 | 半導体材料の水切乾燥装置 |
| US5664337A (en) * | 1996-03-26 | 1997-09-09 | Semitool, Inc. | Automated semiconductor processing systems |
| US5784797A (en) * | 1994-04-28 | 1998-07-28 | Semitool, Inc. | Carrierless centrifugal semiconductor processing system |
| JP2709568B2 (ja) * | 1994-06-30 | 1998-02-04 | 日本プレシジョン・サーキッツ株式会社 | ダウンフロー型スピンドライヤ |
| US6645355B2 (en) | 1996-07-15 | 2003-11-11 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US6091498A (en) | 1996-07-15 | 2000-07-18 | Semitool, Inc. | Semiconductor processing apparatus having lift and tilt mechanism |
| US8028978B2 (en) * | 1996-07-15 | 2011-10-04 | Semitool, Inc. | Wafer handling system |
| US6536131B2 (en) * | 1996-07-15 | 2003-03-25 | Semitool, Inc. | Wafer handling system |
| US6062239A (en) * | 1998-06-30 | 2000-05-16 | Semitool, Inc. | Cross flow centrifugal processor |
| US6125863A (en) * | 1998-06-30 | 2000-10-03 | Semitool, Inc. | Offset rotor flat media processor |
| JP5505340B2 (ja) * | 2011-03-11 | 2014-05-28 | 大日本印刷株式会社 | 力学量センサ及びその製造方法 |
| CN102679714A (zh) * | 2012-05-30 | 2012-09-19 | 无锡市优耐特石化装备有限公司 | 一种带连接圈的甩干机内桶 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525938A (en) * | 1984-01-09 | 1985-07-02 | Seiichiro Aigo | Spin drier for semiconductor material |
| JPS61179741U (US20020051482A1-20020502-M00057.png) * | 1985-04-25 | 1986-11-10 | ||
| JPS629635A (ja) * | 1985-07-08 | 1987-01-17 | Oki Electric Ind Co Ltd | 半導体ウエハの回転乾燥装置 |
| US4777732A (en) * | 1986-06-12 | 1988-10-18 | Oki Electric Industry Co., Ltd. | Wafer centrifugal drying apparatus |
-
1987
- 1987-06-23 JP JP1987096440U patent/JPH069499Y2/ja not_active Expired - Lifetime
-
1988
- 1988-06-16 US US07/207,504 patent/US4907349A/en not_active Expired - Fee Related
- 1988-06-22 DE DE3821067A patent/DE3821067A1/de not_active Withdrawn
- 1988-06-23 KR KR1019880007684A patent/KR950012659B1/ko not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR950012659B1 (ko) | 1995-10-19 |
| JPS642438U (US20020051482A1-20020502-M00057.png) | 1989-01-09 |
| KR890001158A (ko) | 1989-03-18 |
| DE3821067A1 (de) | 1989-01-05 |
| US4907349A (en) | 1990-03-13 |
