JPH0650993Y2 - 半導体パッケージ装置 - Google Patents
半導体パッケージ装置Info
- Publication number
- JPH0650993Y2 JPH0650993Y2 JP1988036539U JP3653988U JPH0650993Y2 JP H0650993 Y2 JPH0650993 Y2 JP H0650993Y2 JP 1988036539 U JP1988036539 U JP 1988036539U JP 3653988 U JP3653988 U JP 3653988U JP H0650993 Y2 JPH0650993 Y2 JP H0650993Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- recess
- package body
- window glass
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 20
- 239000000853 adhesive Substances 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000005357 flat glass Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 2
- 239000011521 glass Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 2
- 238000003384 imaging method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036539U JPH0650993Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体パッケージ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036539U JPH0650993Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体パッケージ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01140850U JPH01140850U (enrdf_load_stackoverflow) | 1989-09-27 |
| JPH0650993Y2 true JPH0650993Y2 (ja) | 1994-12-21 |
Family
ID=31263137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036539U Expired - Lifetime JPH0650993Y2 (ja) | 1988-03-18 | 1988-03-18 | 半導体パッケージ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650993Y2 (enrdf_load_stackoverflow) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4525000B2 (ja) * | 2003-05-09 | 2010-08-18 | ソニー株式会社 | 光学装置、レンズ鏡筒及び撮像装置 |
| JP4409338B2 (ja) * | 2004-03-31 | 2010-02-03 | パナソニック株式会社 | 固体撮像装置及びその製造方法 |
| JP2007074066A (ja) * | 2005-09-05 | 2007-03-22 | Seiko Epson Corp | 圧電デバイス |
| JP2012103206A (ja) * | 2010-11-12 | 2012-05-31 | Panasonic Corp | 赤外線センサモジュールおよびその製造方法 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6220358A (ja) * | 1985-07-18 | 1987-01-28 | Nec Corp | 半導体固体撮像装置 |
-
1988
- 1988-03-18 JP JP1988036539U patent/JPH0650993Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01140850U (enrdf_load_stackoverflow) | 1989-09-27 |
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