JPH0650993Y2 - Semiconductor package equipment - Google Patents
Semiconductor package equipmentInfo
- Publication number
- JPH0650993Y2 JPH0650993Y2 JP1988036539U JP3653988U JPH0650993Y2 JP H0650993 Y2 JPH0650993 Y2 JP H0650993Y2 JP 1988036539 U JP1988036539 U JP 1988036539U JP 3653988 U JP3653988 U JP 3653988U JP H0650993 Y2 JPH0650993 Y2 JP H0650993Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- recess
- package body
- window glass
- notch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Solid State Image Pick-Up Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Description
【考案の詳細な説明】 （イ）産業上の利用分野 本考案は、固体撮像素子用のパッケージ装置に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a package device for a solid-state image sensor.
（ロ）従来の技術 従来の固体撮像素子のパッケージ装置は、第４図に示す
如く、パッケージ本体（１）の上面にウインドガラス
（２）がはめ込み位置決めするための枠部材（10）が設
けられている。この様な半導体パッケージでは、ウイン
ドガラス（２）の接着工程時に接着剤（３）がウインド
ガラス（２）の周辺からはみ出すおそれがあった。この
様に接着剤（３）が半導体パッケージの上面にはみ出す
と、この半導体パッケージの上部に搭載されるレンズ機
構の正確な位置決めを阻害して、撮像画像を歪ませる原
因となっていた。(B) Conventional Technology As shown in FIG. 4, a conventional solid-state image pickup device package device is provided with a frame member (10) for positioning by fitting a window glass (2) on the upper surface of a package body (1). ing. In such a semiconductor package, the adhesive (3) may be squeezed out from the periphery of the wind glass (2) during the step of adhering the wind glass (2). If the adhesive (3) squeezes out on the upper surface of the semiconductor package as described above, it hinders the accurate positioning of the lens mechanism mounted on the upper part of the semiconductor package, which causes the captured image to be distorted.
（ハ）考案が解決しようとする課題 本考案は、上述の点に鑑みてなされたものであって、パ
ッケージ本体（１）へのウインドガラス（２）の接着時
の接着剤（３）のはみ出しを防止するものである。(C) Problems to be Solved by the Invention The present invention has been made in view of the above points, and the protrusion of the adhesive (3) when the window glass (2) is bonded to the package body (1). Is to prevent.
（ニ）課題を解決するための手段 本考案の半導体パッケージ装置は、固体撮像素子を収納
する凹所を有するパッケージ本体の上面にウインドガラ
スが接着されて凹所が塞がれるものであって、ウインド
ガラスのはめ込み位置を決定する枠部材を少なくともパ
ッケージ本体の上面の凹所を取り囲む周辺部の対向する
２辺に配置し、該枠部材に凹所側からパッケージ本体の
側面側まで延在する接着剤逃がし用の切り欠きを設けて
なる。(D) Means for Solving the Problems A semiconductor package device of the present invention is one in which a window glass is adhered to an upper surface of a package body having a recess for accommodating a solid-state image sensor to close the recess. A frame member that determines the fitting position of the window glass is arranged at least on two opposite sides of a peripheral portion surrounding the recess on the upper surface of the package body, and is bonded to the frame member from the recess side to the side surface side of the package body. A notch for releasing the agent is provided.
（ホ）作用 本考案の半導体パッケージ装置は、ウインドガラスのは
め込み位置を決定するための枠部材に切り欠きを設けて
いるために、ウインドガラスをパッケージ本体に接着す
るための接着剤の過剰な分は、この切り欠きからパッケ
ージ本体の側面方向に回避される。(E) Action Since the semiconductor package device of the present invention is provided with a notch in the frame member for determining the fitting position of the window glass, an excessive amount of adhesive for adhering the window glass to the package body is not provided. Are avoided from this notch in the lateral direction of the package body.
（ヘ）実施例 第１図に本考案を採用する半導体パッケージ装置の構成
を示す、同図に於て、（12）は枠部材（10）の４辺の略
中間位置に設けられた切り欠きであり、パッケージ本体
（１）とウインドガラス（２）との接着を行う接着剤
（３）がこの切り欠き（12）内に流れ込むことになる。(F) Embodiment FIG. 1 shows the configuration of a semiconductor package device adopting the present invention. In FIG. 1, (12) is a notch provided at a substantially intermediate position of four sides of a frame member (10). The adhesive agent (3) for adhering the package body (1) and the window glass (2) flows into the notch (12).
従って、第１図の半導体パッケージ装置では、その上面
に接着剤（３）がはみ出すことはない。Therefore, in the semiconductor package device of FIG. 1, the adhesive (3) does not squeeze out on the upper surface thereof.
第２図に本考案の半導体パッケージ装置の他の実施例を
示す。同図の半導体パッケージが第１図と異なるところ
は、ウインドガラス（２）をはめ込み位置決めするため
の枠部材（10）を対向する２辺にのみ設けた点にある。
第２図の本考案装置の場合、左右２辺に枠部材（10）が
ないので、この左右間の幅が小さくなり、半導体パッケ
ージ装置全体の小型化を図りながら、存在する２辺の枠
部材（10）で上下方向だけでも十分正確な位置決めを行
いつつ、切り欠き（12）が接着剤（３）の逃げ場所とな
り、この接着剤（３）がパッケージ本体（１）上面には
み出すことはない。FIG. 2 shows another embodiment of the semiconductor package device of the present invention. The semiconductor package shown in the figure is different from that shown in FIG. 1 in that a frame member (10) for fitting and positioning the wind glass (2) is provided only on two opposite sides.
In the case of the device of the present invention shown in FIG. 2, since the frame members (10) are not provided on the left and right sides, the width between the left and right sides is reduced, and the frame members on the existing two sides are provided while the overall size of the semiconductor package device is reduced. The notch (12) serves as an escape area for the adhesive (3) while the positioning is sufficiently accurate only in the vertical direction with the (10), and the adhesive (3) does not protrude to the upper surface of the package body (1). .
第３図のパッケージ本体（１）は、第２図の実施例を具
体的に採用したものであり、セラミックベース（1B）と
セラミックフレーム（1A）との積層体からなり、接着さ
れた両者間からは端子（4A）が伸びている。この端子
（4A）と共にリードフレームにて同時に形成され、固体
撮像素子チップ（５）が搭載される金属ベース（4B）の
左右延長部は、左右２辺の枠部材（10′）の各切り欠き
（12′）部分に延びて、金属ベース（4B）のパッケージ
位置決め用の穴（4C）がこの切り欠き（12′）に一致し
ている。尚、図中（4D）は、金属ベース（4B）と固体撮
像素子チップ（５）との位置合わせマークであり、金属
ベース（4B）の３ケ所に刻印されている。The package body (1) shown in FIG. 3 is a concrete application of the embodiment shown in FIG. 2, and is composed of a laminated body of a ceramic base (1B) and a ceramic frame (1A), and is bonded between the both. The terminal (4A) extends from. The left and right extension parts of the metal base (4B), which are formed at the same time as the lead frame with this terminal (4A) and on which the solid-state imaging device chip (5) is mounted, are notches of the frame members (10 ') on the left and right sides. A hole (4C) for extending the metal base (4B) for locating the package extends to the portion (12 ') and coincides with the notch (12'). Incidentally, (4D) in the figure is an alignment mark between the metal base (4B) and the solid-state image pickup element chip (5), which is engraved at three places on the metal base (4B).
以上の構成の半導体パッケージ装置では、パッケージ本
体（１）の上面にウインドガラス（２）を接着するとき
の接着剤（３）を逃がすための切り欠き（12′）と半導
体パッケージ装置を基板に位置決めするときの穴（4C）
〔レンズ機構に絡る基板から植立するピンがガイドとし
て挿入される〕とが兼用され、小型の半導体パッケージ
装置が実現されている。In the semiconductor package device having the above structure, the notch (12 ') for releasing the adhesive (3) when the window glass (2) is bonded to the upper surface of the package body (1) and the semiconductor package device are positioned on the substrate. Hole when doing (4C)
A small semiconductor package device is realized by also being used as [a pin that stands up from a substrate that is entangled in the lens mechanism is inserted as a guide].
（ト）考案の効果 本考案の半導体パッケージ装置は、以上の説明から明ら
かな如く、ウインドガラス（２）のはめ込み位置決めす
るための枠部材（10）に切り欠き（12）を設けているた
めに、ウインドガラス（２）を接着するための接着剤
（３）は、この切り欠き（12）からパッケージ本体
（１）の側面方向に回避できる。従って、半導体パッケ
ージ上に接着剤等の不要物が付着して光学的、機械的に
固体撮像素子の機能障害を防止し得る。(G) Effect of the Invention As is apparent from the above description, the semiconductor package device of the present invention is provided with the notch (12) in the frame member (10) for fitting and positioning the window glass (2). The adhesive (3) for adhering the window glass (2) can be avoided from the notch (12) in the lateral direction of the package body (1). Therefore, it is possible to prevent unnecessary substances such as an adhesive from adhering to the semiconductor package and optically and mechanically prevent the functional failure of the solid-state imaging device.
第１図（ａ）及び（ｂ）は本考案の半導体パッケージ装
置の一実施例の平面図及び断面図、第２図は本考案装置
の他の実施例の平面図、第３図（ａ）（ｂ）並びに
（ｃ）は本考案装置の具体的構成図、第４図（ａ）及び
（ｂ）は従来の半導体パッケージ装置の平面図及び断面
図。 （１）はパッケージ本体、（２）はウインドガラス、
（３）は接着剤、（4C）は穴、（10）（10′）は枠部
材、（12）（12′）は切り欠き。1 (a) and 1 (b) are a plan view and a sectional view of an embodiment of the semiconductor package device of the present invention, FIG. 2 is a plan view of another embodiment of the device of the present invention, and FIG. 3 (a). (B) and (c) are concrete configuration diagrams of the device of the present invention, and FIGS. 4 (a) and (b) are a plan view and a sectional view of a conventional semiconductor package device. (1) is the package body, (2) is wind glass,
(3) is an adhesive, (4C) is a hole, (10) and (10 ') are frame members, and (12) and (12') are notches.
Claims (1)
ケージ本体の上面にウインドガラスが接着されて上記凹
所が塞がれる半導体パッケージ装置であって、上記ウイ
ンドガラスのはめ込み位置を決定する枠部材を少なくと
も上記パッケージ本体の上面の上記凹所を取り囲む周辺
部の対向する２辺に配置し、該枠部材に上記凹所側から
上記パッケージ本体の側面側まで延在する接着剤逃がし
用の切り欠きを設けてなる半導体パッケージ装置。1. A semiconductor package device in which a window glass is adhered to an upper surface of a package body having a recess for accommodating a solid-state image sensor to close the recess, and a frame for determining a fitting position of the window glass. The members are arranged at least on two opposite sides of a peripheral portion surrounding the recess on the upper surface of the package body, and the frame member has an adhesive escape cut extending from the recess side to the side surface side of the package body. A semiconductor package device having a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036539U JPH0650993Y2 (en) | 1988-03-18 | 1988-03-18 | Semiconductor package equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988036539U JPH0650993Y2 (en) | 1988-03-18 | 1988-03-18 | Semiconductor package equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01140850U JPH01140850U (en) | 1989-09-27 |
| JPH0650993Y2 true JPH0650993Y2 (en) | 1994-12-21 |
Family
ID=31263137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988036539U Expired - Lifetime JPH0650993Y2 (en) | 1988-03-18 | 1988-03-18 | Semiconductor package equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0650993Y2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4525000B2 (en) * | 2003-05-09 | 2010-08-18 | ソニー株式会社 | Optical device, lens barrel and imaging device |
| JP4409338B2 (en) * | 2004-03-31 | 2010-02-03 | パナソニック株式会社 | Solid-state imaging device and manufacturing method thereof |
| JP2007074066A (en) * | 2005-09-05 | 2007-03-22 | Seiko Epson Corp | Piezoelectric device |
| JP2012103206A (en) * | 2010-11-12 | 2012-05-31 | Panasonic Corp | Infrared sensor module and method of manufacturing the same |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6220358A (en) * | 1985-07-18 | 1987-01-28 | Nec Corp | Semiconductor solid-state image sensor |
-
1988
- 1988-03-18 JP JP1988036539U patent/JPH0650993Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01140850U (en) | 1989-09-27 |
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