JP4210543B2 - Solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a solid-state imaging device that is mounted on a portable device such as a mobile phone or a notebook personal computer and captures an image using an imaging element.
[0002]
[Prior art]
As an example of a conventional solid-state imaging device, in Patent Document 1 below, an imaging element is provided on a substrate, and a holder for holding a lens is mounted so as to surround the imaging element. An optical filter is bonded to the holder so as to face the imaging element. The optical filter has a rectangular shape or a square shape and is slightly larger like the light receiving portion of the image sensor, and is disposed and bonded in the same direction as the light receiving portion in the direction perpendicular to the optical axis of the light receiving portion. Yes. An adhesive for adhering the optical filter is applied to the outer peripheral portion of the upper surface of the optical filter and adhered to the holder.
[0003]
[Patent Document 1]
JP 2002-374438 A [0004]
[Problems to be solved by the invention]
In the thing of the said patent document 1, an adhesive agent is apply | coated to the upper surface outer peripheral part of an optical filter, and it adheres to a holder, and in order to improve adhesive strength, an adhesive agent will be applied in large quantities. Has a problem that it flows down and adheres to the light receiving portion of the image sensor. Further, when the adhesive flows along the inner wall of the holder, the adhesive may flow into the recess that houses the image pickup device. In this case, there is a problem that the image pickup device cannot be accurately positioned.
[0005]
Accordingly, the present invention provides a solid-state imaging device capable of preventing an adhesive used for adhering an optical filter from adhering to a light receiving portion of an image sensor and preventing the image sensor from being accurately positioned by the adhesive. The purpose is to provide.
[0006]
[Means for Solving the Problems]
In the solid-state imaging device of the present invention, an image sensor having a light receiving unit and a holder for holding the image sensor are mounted on a circuit board, and an optical filter is bonded to the holder at a position facing the light receiving unit. ing. The adhesive part of the optical filter of the holder is located outward from a position facing the imaging element, and the optical filter is formed in a square shape larger than the outer shape of the light receiving part, In the direction perpendicular to the optical axis of the light receiving portion, the light receiving portion is disposed in a direction different from that of the light receiving portion, and the corner portion is bonded to the holder . For this reason, when the optical filter is bonded, even if the adhesive flows down, it does not adhere to the light receiving portion.
[0007]
Also, the optical filter is Yes in a square shape, it is preferable that the corner portions thereof which face each other are adhered to the holder. In any case, even when the optical filter is bonded in the same manner as described above, it does not adhere to the light receiving portion even if the adhesive flows down.
[0008]
Moreover, it is preferable that the adhesion part of the said optical filter of the said holder is provided with the recessed part for apply | coating an adhesive agent. With this configuration, even when a strong bond is obtained using a large amount of adhesive, the amount of the adhesive that flows down is small and does not adhere to the light receiving portion.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
[0010]
As shown in FIG. 1, an image pickup device 2 and a holder 3 are mounted on the surface of the circuit board 1 so as to surround the image pickup device 2.
[0011]
The side of the holder 3 that contacts the circuit board 1 is a rectangular portion 3a as shown in FIG. The imaging element 2 is fitted and held in a rectangular recess 3b provided on the lower end side of the rectangular portion 3a. Convex portions 3c for positioning and holding the image sensor 2 are provided at the four corners of the concave portion 3b. On the surface of the image sensor 2, a light receiving portion 2 a is provided at a position offset from the center. An opening 3d serving as a light path is provided at the upper portion of the light receiving portion 2a. An attachment portion 3e for attaching an optical filter 4 such as an infrared cut filter is provided on the lower surface of the peripheral portion of the opening 3d. As shown in FIG. 3, the mounting portion 3e has a square shape in a direction perpendicular to the optical axis of the light receiving portion 2a, different from the direction of the light receiving portion 2a, in this example, rotated by 45 degrees. A pair of opposite corners is provided with a recess 3 f for applying the adhesive 5 to serve as an adhesive part of the optical filter 4. One of the recesses 3 f is located outward from the position facing the image sensor 2, and the other is located at a position facing a space between the light receiving unit 2 a and the end face of the image sensor 2. A cylindrical portion 3g concentric with the opening 3d is provided on the upper side of the holder 3 so as to protrude. An internal thread portion 3h is formed on the inner peripheral surface of the cylindrical portion 3g.
[0012]
A lens holder 6 is located above the holder 3. An opening 6 a for introducing light is provided on the upper surface of the lens holder 6, and a cylindrical portion 6 b is protruded downward. On the outer peripheral surface of the cylindrical portion 6b, a male screw portion 6c screwed with the female screw portion 3h is provided. A lens 7 is fixed by a lens presser 8 in the cylindrical portion 6b. The lens holder 6 is connected to the holder 3 by screwing the male screw portion 6c of the lens holder 6 to which the lens 7 is fixed and the female screw portion 3h of the holder 3 together.
[0013]
In a state where the lens holder 6 is connected to the holder 3, the opening 6a, the lens 7, the opening 3d, the optical filter 4, and the light receiving unit 2a are set so that their centers coincide with the optical axis. . The distance between the lens 7 and the light receiving portion 2a can be finely adjusted in the optical axis direction by adjusting the screwing amount between the male screw portion 6c and the female screw portion 3h, and so-called focusing is possible. .
[0014]
Further, the optical filter 4 is arranged in a direction different from the direction of the light receiving unit 2a in the direction orthogonal to the optical axis of the light receiving unit 2a. In this example, the optical filter 4 is arranged in a direction different from the plane by 45 degrees as shown in FIG. It is. Therefore, the opposite corners, which are the bonding parts for bonding the optical filter 4 to the holder 3, are located outside the position facing the image sensor 2 without facing the image sensor 2 as shown in FIG. 2. Yes. For this reason, even if the adhesive 5 is sufficiently applied to the upper surface of the corner portion of the optical filter 4 in order to bond the optical filter 4 to the holder 3, the adhesive is recessed. The corners of the optical filter 4 remain firmly in 3f and are firmly bonded to the holder 3. Even if the adhesive drops from the recess 3f, the amount of the adhesive is small, and there is no inconvenience such as adhesion of the adhesive on the image sensor 2, particularly the light receiving portion 2a.
[0015]
When the holder 3 holding the image pickup device 2 is bonded to the circuit board 1, the image pickup device 2 is bonded to the circuit board 1 by a flip chip method or the like, and then the lower end surface of the holder 3 is circled in FIG. As shown, an adhesive is applied and adhered to the circuit board 1 to form a solid-state imaging device as shown in FIG.
[0016]
As described above, since the bonding portion 3f of the optical filter 4 of the holder 3 is located outside the imaging device 2 in the direction orthogonal to the optical axis, even if the adhesive 5 for bonding the optical filter flows down. Thus, it is possible to prevent the light receiving unit 2a or the image pickup element 2 and the holder 3 from adhering to the positioning portion.
[0017]
Further, since the optical filter 4 has a rectangular shape larger than the outer shape of the light receiving portion 2a and is disposed and bonded in a direction different from the light receiving portion 2a in the direction orthogonal to the optical axis, the optical filter 4 is disposed in the same direction as the light receiving portion 2a. The adhesive 5 can be applied to the outside of the light receiving part 2a more reliably than the case where it adheres to the light receiving part 2a.
[0018]
Further, since the optical filter 4 is square and is bonded to the holder 2 at the corners facing each other, the adhesive 5 can be applied more outwardly from the light receiving part 2a and adhered to the light receiving part 2a. It can be prevented more reliably. Furthermore, the optical filter 4 can be stably bonded to the holder 2.
[0019]
Further, since the recess 3f for applying the adhesive 5 for adhering the optical filter 4 to the holder 2 is formed, even when a large amount of the adhesive 5 is applied to enhance the adhesive strength, the adhesive 5 captures an image. It is possible to prevent the element 2 from flowing down.
[0020]
In the present invention, the optical filter 4 is bonded to the holder 2 with a pair of opposite corners. However, the position and number of the bonded portions of the optical filter 4 are not limited to this. For example, the concave portions 3f may be provided in all the corners of the attachment portion 3e, and all the corners of the optical filter 4 may be used as the adhesive portions.
[0021]
【The invention's effect】
In the solid-state imaging device of the present invention, since the adhesive portion of the optical filter of the holder is located outward from the position facing the imaging device, the adhesive used to bond the optical filter to the holder is used for the imaging device. It can be prevented from flowing down and adhering to the light receiving part. Since the concave portion for applying the adhesive to the adhesive portion is provided, a large amount of adhesive can be used, and the adhesive force can be improved. Moreover, it can prevent that exact positioning of an image pick-up element is prevented by an adhesive agent adhering to the mounting position of an image pick-up element.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of the present invention.
FIG. 2 is a bottom view taken along line 1A-A in FIG.
FIG. 3 is a cross-sectional view taken along the line 1B-B in FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Circuit board 2 Image pick-up element 2a Light-receiving part 3 Holder 3f Bonding part (concave part)

Claims (3)

An image sensor having a light receiving portion and a holder for holding the image sensor are mounted on the circuit board,
An optical filter is bonded to the holder at a position facing the light receiving unit,
The adhesive part of the optical filter of the holder is located outward from the position facing the image sensor ,
The optical filter is formed in a rectangular shape that is larger than the outer shape of the light receiving unit, and is arranged in a direction different from the direction of the light receiving unit in a direction orthogonal to the optical axis of the light receiving unit. A solid-state imaging device which is bonded to the holder . 2. The solid-state imaging device according to claim 1 , wherein the optical filter is formed in a square shape, and is bonded to the holder at corners facing each other. 3. The solid-state imaging device according to claim 1, wherein a concave portion for applying an adhesive is provided in an adhesive portion of the optical filter of the holder.

Images