JPH0648877Y2 - 半導体装置 - Google Patents

半導体装置

Info

Publication number
JPH0648877Y2
JPH0648877Y2 JP1989138376U JP13837689U JPH0648877Y2 JP H0648877 Y2 JPH0648877 Y2 JP H0648877Y2 JP 1989138376 U JP1989138376 U JP 1989138376U JP 13837689 U JP13837689 U JP 13837689U JP H0648877 Y2 JPH0648877 Y2 JP H0648877Y2
Authority
JP
Japan
Prior art keywords
lead
lead terminal
semiconductor element
mounting
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1989138376U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0377461U (enExample
Inventor
享 藤原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP1989138376U priority Critical patent/JPH0648877Y2/ja
Publication of JPH0377461U publication Critical patent/JPH0377461U/ja
Application granted granted Critical
Publication of JPH0648877Y2 publication Critical patent/JPH0648877Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H10W72/0198—
    • H10W72/5363—
    • H10W72/5475—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP1989138376U 1989-11-28 1989-11-28 半導体装置 Expired - Fee Related JPH0648877Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989138376U JPH0648877Y2 (ja) 1989-11-28 1989-11-28 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989138376U JPH0648877Y2 (ja) 1989-11-28 1989-11-28 半導体装置

Publications (2)

Publication Number Publication Date
JPH0377461U JPH0377461U (enExample) 1991-08-05
JPH0648877Y2 true JPH0648877Y2 (ja) 1994-12-12

Family

ID=31685480

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989138376U Expired - Fee Related JPH0648877Y2 (ja) 1989-11-28 1989-11-28 半導体装置

Country Status (1)

Country Link
JP (1) JPH0648877Y2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5566181B2 (ja) * 2010-05-14 2014-08-06 三菱電機株式会社 パワー半導体モジュールとその製造方法

Also Published As

Publication number Publication date
JPH0377461U (enExample) 1991-08-05

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees