JPH0377461U - - Google Patents
Info
- Publication number
- JPH0377461U JPH0377461U JP1989138376U JP13837689U JPH0377461U JP H0377461 U JPH0377461 U JP H0377461U JP 1989138376 U JP1989138376 U JP 1989138376U JP 13837689 U JP13837689 U JP 13837689U JP H0377461 U JPH0377461 U JP H0377461U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- electronic component
- lead terminal
- semiconductor element
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/0198—
-
- H10W72/5363—
-
- H10W72/5475—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138376U JPH0648877Y2 (ja) | 1989-11-28 | 1989-11-28 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989138376U JPH0648877Y2 (ja) | 1989-11-28 | 1989-11-28 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0377461U true JPH0377461U (enExample) | 1991-08-05 |
| JPH0648877Y2 JPH0648877Y2 (ja) | 1994-12-12 |
Family
ID=31685480
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989138376U Expired - Fee Related JPH0648877Y2 (ja) | 1989-11-28 | 1989-11-28 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0648877Y2 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243626A (ja) * | 2010-05-14 | 2011-12-01 | Mitsubishi Electric Corp | 半導体モジュールとその製造方法 |
-
1989
- 1989-11-28 JP JP1989138376U patent/JPH0648877Y2/ja not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011243626A (ja) * | 2010-05-14 | 2011-12-01 | Mitsubishi Electric Corp | 半導体モジュールとその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0648877Y2 (ja) | 1994-12-12 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |