JPH0176041U - - Google Patents
Info
- Publication number
- JPH0176041U JPH0176041U JP1987171854U JP17185487U JPH0176041U JP H0176041 U JPH0176041 U JP H0176041U JP 1987171854 U JP1987171854 U JP 1987171854U JP 17185487 U JP17185487 U JP 17185487U JP H0176041 U JPH0176041 U JP H0176041U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- bonding wire
- terminal
- bonded
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- H10W72/90—
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- H10W70/682—
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- H10W72/07551—
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- H10W72/07554—
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- H10W72/50—
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- H10W72/5445—
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- H10W72/5449—
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- H10W72/585—
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- H10W72/926—
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- H10W72/932—
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- H10W74/00—
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- H10W90/754—
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171854U JPH0176041U (enExample) | 1987-11-09 | 1987-11-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987171854U JPH0176041U (enExample) | 1987-11-09 | 1987-11-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0176041U true JPH0176041U (enExample) | 1989-05-23 |
Family
ID=31463859
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987171854U Pending JPH0176041U (enExample) | 1987-11-09 | 1987-11-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0176041U (enExample) |
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1987
- 1987-11-09 JP JP1987171854U patent/JPH0176041U/ja active Pending