JPH0328755U - - Google Patents

Info

Publication number
JPH0328755U
JPH0328755U JP1989088725U JP8872589U JPH0328755U JP H0328755 U JPH0328755 U JP H0328755U JP 1989088725 U JP1989088725 U JP 1989088725U JP 8872589 U JP8872589 U JP 8872589U JP H0328755 U JPH0328755 U JP H0328755U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
lead frame
mounting piece
semiconductor element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1989088725U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0648875Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1989088725U priority Critical patent/JPH0648875Y2/ja
Publication of JPH0328755U publication Critical patent/JPH0328755U/ja
Application granted granted Critical
Publication of JPH0648875Y2 publication Critical patent/JPH0648875Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/541—Dispositions of bond wires
    • H10W72/547—Dispositions of multiple bond wires
    • H10W72/5475—Dispositions of multiple bond wires multiple bond wires connected to common bond pads at both ends of the wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP1989088725U 1989-07-27 1989-07-27 半導体装置 Expired - Fee Related JPH0648875Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1989088725U JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1989088725U JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Publications (2)

Publication Number Publication Date
JPH0328755U true JPH0328755U (enExample) 1991-03-22
JPH0648875Y2 JPH0648875Y2 (ja) 1994-12-12

Family

ID=31638321

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1989088725U Expired - Fee Related JPH0648875Y2 (ja) 1989-07-27 1989-07-27 半導体装置

Country Status (1)

Country Link
JP (1) JPH0648875Y2 (enExample)

Also Published As

Publication number Publication date
JPH0648875Y2 (ja) 1994-12-12

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees