JPH0642810Y2 - 内周刃切断機の材料固定装置 - Google Patents
内周刃切断機の材料固定装置Info
- Publication number
- JPH0642810Y2 JPH0642810Y2 JP11362389U JP11362389U JPH0642810Y2 JP H0642810 Y2 JPH0642810 Y2 JP H0642810Y2 JP 11362389 U JP11362389 U JP 11362389U JP 11362389 U JP11362389 U JP 11362389U JP H0642810 Y2 JPH0642810 Y2 JP H0642810Y2
- Authority
- JP
- Japan
- Prior art keywords
- inner peripheral
- extension jig
- cutting
- fixing device
- cutting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000463 material Substances 0.000 title claims description 52
- 238000005520 cutting process Methods 0.000 title claims description 50
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 239000006061 abrasive grain Substances 0.000 claims description 4
- 229910003460 diamond Inorganic materials 0.000 claims description 4
- 239000010432 diamond Substances 0.000 claims description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11362389U JPH0642810Y2 (ja) | 1989-09-28 | 1989-09-28 | 内周刃切断機の材料固定装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11362389U JPH0642810Y2 (ja) | 1989-09-28 | 1989-09-28 | 内周刃切断機の材料固定装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0352111U JPH0352111U (enrdf_load_stackoverflow) | 1991-05-21 |
| JPH0642810Y2 true JPH0642810Y2 (ja) | 1994-11-09 |
Family
ID=31662031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11362389U Expired - Fee Related JPH0642810Y2 (ja) | 1989-09-28 | 1989-09-28 | 内周刃切断機の材料固定装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0642810Y2 (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993810A (ja) * | 1982-11-17 | 1984-05-30 | Kawasaki Steel Corp | 溶融スラグ薄層固化装置 |
| JP2015109378A (ja) * | 2013-12-05 | 2015-06-11 | 信越半導体株式会社 | 切断治具及びワークの切断方法 |
-
1989
- 1989-09-28 JP JP11362389U patent/JPH0642810Y2/ja not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5993810A (ja) * | 1982-11-17 | 1984-05-30 | Kawasaki Steel Corp | 溶融スラグ薄層固化装置 |
| JP2015109378A (ja) * | 2013-12-05 | 2015-06-11 | 信越半導体株式会社 | 切断治具及びワークの切断方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0352111U (enrdf_load_stackoverflow) | 1991-05-21 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |