JPH0642342Y2 - 半導体装置封止用キヤツプ - Google Patents

半導体装置封止用キヤツプ

Info

Publication number
JPH0642342Y2
JPH0642342Y2 JP65587U JP65587U JPH0642342Y2 JP H0642342 Y2 JPH0642342 Y2 JP H0642342Y2 JP 65587 U JP65587 U JP 65587U JP 65587 U JP65587 U JP 65587U JP H0642342 Y2 JPH0642342 Y2 JP H0642342Y2
Authority
JP
Japan
Prior art keywords
groove
adhesive
adhesive layer
container
cap
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP65587U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63108638U (enrdf_load_stackoverflow
Inventor
晴美 水梨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP65587U priority Critical patent/JPH0642342Y2/ja
Publication of JPS63108638U publication Critical patent/JPS63108638U/ja
Application granted granted Critical
Publication of JPH0642342Y2 publication Critical patent/JPH0642342Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP65587U 1987-01-06 1987-01-06 半導体装置封止用キヤツプ Expired - Lifetime JPH0642342Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP65587U JPH0642342Y2 (ja) 1987-01-06 1987-01-06 半導体装置封止用キヤツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP65587U JPH0642342Y2 (ja) 1987-01-06 1987-01-06 半導体装置封止用キヤツプ

Publications (2)

Publication Number Publication Date
JPS63108638U JPS63108638U (enrdf_load_stackoverflow) 1988-07-13
JPH0642342Y2 true JPH0642342Y2 (ja) 1994-11-02

Family

ID=30777822

Family Applications (1)

Application Number Title Priority Date Filing Date
JP65587U Expired - Lifetime JPH0642342Y2 (ja) 1987-01-06 1987-01-06 半導体装置封止用キヤツプ

Country Status (1)

Country Link
JP (1) JPH0642342Y2 (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS63108638U (enrdf_load_stackoverflow) 1988-07-13

Similar Documents

Publication Publication Date Title
US5455462A (en) Plastic molded package with heat sink for integrated circuit devices
JP2670408B2 (ja) 樹脂封止型半導体装置及びその製造方法
US6281566B1 (en) Plastic package for electronic devices
JPH08288776A (ja) プラスチック封止ｓａｗ装置および方法
JPH043450A (ja) 樹脂封止型半導体装置
JPH0642342Y2 (ja) 半導体装置封止用キヤツプ
JPH0378236A (ja) キャリアテープ及びこれを用いた半導体装置の製造方法
JP2564104Y2 (ja) 半導体装置封止用キヤツプ
JP2000150844A (ja) 固体撮像装置の製造方法
JP3141634B2 (ja) 半導体装置の製造方法及び樹脂封止用金型
JPS5923525A (ja) 半導体装置
CN115732340B (zh) 封装方法及封装结构
JPS5923550A (ja) 樹脂封止半導体装置
JPS6329960A (ja) 樹脂封止型半導体装置用リ−ドフレ−ム
JPH04246847A (ja) 半導体集積回路のパッケージ
JPH04129253A (ja) 半導体パッケージ
JPH03114247A (ja) パッケージ型半導体装置
JPH01319970A (ja) 半導体装置封止用容器
JP3337526B2 (ja) パッケージ型半導体部品の構造
JPH0337235Y2 (enrdf_load_stackoverflow)
JPS6059759A (ja) リ−ドフレ−ム
JPS6350049A (ja) 樹脂封止型半導体装置
JPS5981126A (ja) レジンモ−ルド製品の製造方法
JPS62202544A (ja) 半導体装置
JPS635251Y2 (enrdf_load_stackoverflow)