JPH06268362A - Structure of circuit board for electronic component soldering mount - Google Patents

Structure of circuit board for electronic component soldering mount

Info

Publication number
JPH06268362A
JPH06268362A JP5709593A JP5709593A JPH06268362A JP H06268362 A JPH06268362 A JP H06268362A JP 5709593 A JP5709593 A JP 5709593A JP 5709593 A JP5709593 A JP 5709593A JP H06268362 A JPH06268362 A JP H06268362A
Authority
JP
Japan
Prior art keywords
circuit board
electrode pads
lead terminals
electronic component
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5709593A
Other languages
Japanese (ja)
Inventor
Shigeyuki Ueda
茂幸 上田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd filed Critical Rohm Co Ltd
Priority to JP5709593A priority Critical patent/JPH06268362A/en
Publication of JPH06268362A publication Critical patent/JPH06268362A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3452—Solder masks

Landscapes

  • Jigs For Machine Tools (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the occurrence of a solder bridge between respective lead terminals and at the same time to prevent electronic parts from being displaced by providing a swollen part made of a heat resistance insulator and having a suitable height in a position between at least respective electrode pads in the upper surface of a circuit board. CONSTITUTION:Only the peripheral part of the respective electrode pads A1 in a photoresist film 2 is left for exposure to light after the other part is asked, and is removed by developing treatment after exposure to light, thereby forming swollen parts 2a, 2b of the photoresist film 2 in the part between the respective electrode pads Ax and in both end parts of the respective electrode pads A1. Thereby, the melted solder can be prevented from flowing into the adjacent electrode pads in the surface of the respective electrode pads A1. Therefore, the generation of a solder bridge between the respective lead terminals B2 and the displacement of electronic parts B in the direction of the row of the electrode pads A1 can be surely prevented.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、図１０及び図１１に示
すように、回路基板Ａの上面に対して、モールド部Ｂ1
の一方の側面又は左右両側面から複数本のリード端子Ｂ
2 を適宜ピッチの間隔で突出して成る電子部品Ｂを、半
田付けにて実装する場合において、前記回路基板Ａの構
造に関するものである。BACKGROUND OF THE INVENTION The present invention, as shown in FIGS. 10 and 11, the upper surface of the circuit board A, the mold section B 1
Multiple lead terminals B from one side surface or both left and right side surfaces
The present invention relates to the structure of the circuit board A when the electronic component B formed by projecting 2 at an appropriate pitch is mounted by soldering.

【０００２】[0002]

【従来の技術】一般に、複数本のリード端子Ｂ2 を備え
た電子部品Ｂを、回路基板Ａに対して半田付けにて実装
するには、従来から良く知られているように、回路基板
Ａの表面に、前記電子部品Ｂにおける各リード端子Ｂ2
を電気的に接続するための電極パッドＡ1 を、前記各リ
ード端子Ｂ2 の箇所に形成し、この各電極パッドＡ1 の
表面に、半田層をメッキ等に形成するか、或いはクリー
ム半田を塗布し、次いで、電子部品Ｂを、回路基板Ａの
上面に対して、各リード端子Ｂ2 の各々が前記各電極パ
ッドＡ1 の上面に密接するように載せたのち、回路基板
Ａの全体を、リフロー炉に入れて半田の溶融点以上の温
度に加熱して、前記半田を溶融することによって、各リ
ード端子Ｂ2 の各々を、各電極パッドＡ1 に対して半田
付けしている。2. Description of the Related Art Generally, in order to mount an electronic component B having a plurality of lead terminals B 2 on a circuit board A by soldering, as well known in the art, the circuit board A On the surface of each of the lead terminals B 2 in the electronic component B.
An electrode pad A 1 for electrically connecting to each of the lead terminals B 2 is formed, and a solder layer is formed on the surface of each electrode pad A 1 by plating or cream solder is applied. After coating, the electronic component B is placed on the upper surface of the circuit board A so that each lead terminal B 2 is in close contact with the upper surface of each electrode pad A 1 , and then the entire circuit board A is placed. , The lead terminals B 2 are soldered to the electrode pads A 1 by heating the solder in a reflow furnace to a temperature above the melting point of the solder to melt the solder.

【０００３】ところで、この半田付けによる実装に際し
ては、前記各電極パッドＡ1 における幅寸法Ｗ1 を、リ
ード端子Ｂ2 における幅寸法Ｗ2 よりも適宜寸法だけ大
きくして、リード端子Ｂ2 の左右両側面に、図１１に二
点鎖線で示すように、半田フレットＣを形成することに
より、半田付け強度のアップを図るようにしている。[0003] In the implementation of this soldering, the width dimension W 1 in each of the electrode pads A 1, as large as appropriate than the width W 2 of the lead terminals B 2, the left and right lead terminals B 2 As shown by the chain double-dashed line in FIG. 11, solder frets C are formed on both side surfaces to increase the soldering strength.

【０００４】[0004]

【発明が解決しようとする課題】しかし、各電極パッド
Ａ1 における幅寸法Ｗ1 を、リード端子Ｂ2 における幅
寸法Ｗ2 よりも適宜寸法だけ大きくすると、リード端子
Ｂ2 の両側面に半田フレットＣを形成することができる
ことにより、半田付けの確実性を向上できるものの、溶
融した半田が隣接するリード端子Ｂ2 の相互間において
互いに繋がり、各リード端子Ｂ2 の相互間に半田ブリッ
ジが形成されることが多発するばかりか、回路基板Ａに
載せた電子部品Ｂが、回路基板Ａにおける各電極パッド
Ａ1 の列方向にずれ動くことにより、リード端子Ｂ
2 が、その電極パッドＡ1 に対してずれた状態で半田付
けされることが多発するから、半田付け不良の発生率が
高いと言う問題があった。[0008] However, the width W 1 at each electrode pads A 1, by increasing only appropriate than the width W 2 of the lead terminals B 2, solder frets on both sides of the lead terminal B 2 Although it is possible to improve the reliability of soldering by being able to form C, the molten solder is connected to each other between the adjacent lead terminals B 2 and a solder bridge is formed between the lead terminals B 2. Not only frequently, but also when the electronic component B mounted on the circuit board A shifts in the column direction of each electrode pad A 1 on the circuit board A, the lead terminal B
2 is often soldered in a state of being displaced from the electrode pad A 1 , so that there is a problem that the occurrence rate of defective soldering is high.

【０００５】特に、前者の半田ブリッジの発生率は、リ
ード端子Ｂ2 の間隔ピッチが狭い程、高いのである。本
発明は、このような半田付け不良の発生を大幅に低減で
きるようにした回路基板の構造を提供することを技術的
課題とするものである。In particular, the former solder bridge occurrence rate is higher as the pitch of the lead terminals B 2 is narrower. An object of the present invention is to provide a circuit board structure capable of significantly reducing the occurrence of such soldering failure.

【０００６】[0006]

【課題を解決するための手段】この技術的課題を達成す
るため本発明は、上面に、電子部品におけるリード端子
を半田付けするための電極パッドの複数個を、適宜ピッ
チの間隔で列状に形成して成る回路基板において、前記
回路基板の上面のうち少なくとも前記各電極パッド間の
部位に、適宜高さの耐熱絶縁体製の隆起部を設けると言
う構成にした。In order to achieve this technical object, the present invention provides a plurality of electrode pads for soldering lead terminals in an electronic component on the upper surface in rows at appropriate pitch intervals. In the formed circuit board, a raised portion made of a heat-resistant insulator having an appropriate height is provided on at least a portion of the upper surface of the circuit board between the electrode pads.

【０００７】[0007]

【作 用】このように、回路基板の上面のうち少なく
とも各電極パッド間の部位に、適宜高さの耐熱絶縁体製
の隆起部を設けることにより、半田付けに際しての溶融
半田が、隣接の電極パッドに流れることを、前記隆起部
によって防止でき、換言すると、各電極パッドの表面に
おける溶融半田は、当該電極パッドの両側における隆起
部の間から流出することなく凝固するから、前記各リー
ド端子の各電極パッドに対する高い半田付け強度を保持
した状態で、その相互間に半田ブリッジが形成されるこ
とを確実に防止できるのである。[Operation] As described above, by providing a raised portion made of a heat-resistant insulating material of an appropriate height on at least a portion between the respective electrode pads on the upper surface of the circuit board, molten solder during soldering is prevented from adjoining the adjacent electrodes. It can be prevented from flowing to the pad by the raised portion, in other words, the molten solder on the surface of each electrode pad is solidified without flowing out between the raised portions on both sides of the electrode pad. It is possible to reliably prevent formation of solder bridges between the electrode pads while maintaining high soldering strength.

【０００８】しかも、回路基板の上面に載せた電子部品
が、電極パッドの列方向にずれ動くことを、前記隆起部
によって、確実に防止できるのである。なお、前記各隆
起部は、回路基板に対するスクリーン印刷によって形成
することができるほか、回路基板の上面に、耐熱性合成
樹脂によるホトレジスト膜を適宜厚さに形成し、このホ
トレジスト膜のうち少なくとも回路基板における各電極
パッドの間の部分に隆起部を残しその他の部分をマスク
露光・現像にて除去することによって形成することがで
きるのである。Moreover, the electronic parts mounted on the upper surface of the circuit board can be surely prevented from shifting in the column direction of the electrode pads by the raised portions. Each of the raised portions can be formed by screen printing on a circuit board, and a photoresist film made of a heat-resistant synthetic resin is formed on the upper surface of the circuit board to an appropriate thickness, and at least the circuit board of the photoresist film is formed. Can be formed by leaving a raised portion between the respective electrode pads in and the other portions by mask exposure and development.

【０００９】また、前記隆起部は、回路基板の上面に、
耐熱性の合成樹脂膜を適宜厚さに形成し、この合成樹脂
膜の上面にホトレジスト膜を形成し、このホトレジスト
膜のうち少なくとも回路基板における各電極パッドの間
の部分を残しその他の部分をマスク露光・現像によって
除去し、更に、前記合成樹脂膜のうち少なくとも回路基
板における各電極パッドの間の部分に隆起部を残しその
他の部分を、前記レジスト膜を溶かすことなく前記合成
樹脂膜のみを溶かすようなエッチング液によるエッチン
グにて除去することによっても形成することができる。The raised portion is provided on the upper surface of the circuit board.
A heat-resistant synthetic resin film is formed to an appropriate thickness, a photoresist film is formed on the upper surface of this synthetic resin film, and at least a portion of this photoresist film between the electrode pads on the circuit board is left and the other portion is masked. It is removed by exposure / development, and further, only the synthetic resin film is melted without dissolving the resist film in the synthetic resin film, leaving a raised portion at least in a portion between the electrode pads on the circuit board. It can also be formed by removing by etching with such an etching solution.

【００１０】更にまた、前記隆起部を、各電極パッド間
の部分に設けることに加えて、各電極パッドにおける両
端のうちいずれか一方又は両方の部分にも設けることに
より、回路基板の上面に載せた電子部品が、電極パッド
の列方向と直角の方向にずれ動くことをも防止できるの
である。Furthermore, in addition to providing the raised portion at a portion between the electrode pads, it is also provided at one or both of both ends of each electrode pad so that the raised portion is mounted on the upper surface of the circuit board. It is also possible to prevent the electronic component from moving in the direction perpendicular to the row direction of the electrode pads.

【００１１】[0011]

【発明の効果】従って、本発明によると、回路基板に対
する電子部品の半田付けに際して、各リード端子の相互
間に半田ブリッジが発生したり、リード端子が電極パッ
ドに対してずれた状態で半田付けされたりすることを確
実に防止できるから、半田付け不良の発生率を大幅に低
減できて、コストの低減を達成できるのである。Therefore, according to the present invention, when soldering an electronic component to a circuit board, a solder bridge is generated between the lead terminals or the lead terminals are displaced with respect to the electrode pads. Since it can be reliably prevented from occurring, the rate of occurrence of defective soldering can be significantly reduced, and the cost can be reduced.

【００１２】[0012]

【実施例】以下、本発明の実施例を、図面（図１〜図
９）について説明する。先づ、図１及び図２に示すよう
に、回路基板Ａの上面には、電子部品Ｂにおける各リー
ド端子Ｂ2 の個所に当該各リード端子Ｂ2 を電気的に接
続するための複数個の電極パッドＡ1 を列状に形成され
ていると共に、この各電極パッドＡ1 の相互間を接続す
る配線パターン（図示せず）が形成されている。更に、
回路基板Ａの上面のうち前記各電極パッドＡ1 を除く部
分には絶縁膜Ａ2 が形成されている。Embodiments of the present invention will be described below with reference to the drawings (FIGS. 1 to 9). Previously Dzu, as shown in FIGS. 1 and 2, the circuit on the upper surface of the substrate A, a plurality for electrically connecting an electronic component such respective lead terminals B 2 at a location of each lead terminals B 2 in B The electrode pads A 1 are formed in rows, and a wiring pattern (not shown) that connects the electrode pads A 1 to each other is formed. Furthermore,
An insulating film A 2 is formed on the upper surface of the circuit board A except the electrode pads A 1 .

【００１３】そして、前記回路基板Ａにおける各電極パ
ッドＡ1 の表面に、図３及び図４に示すように、半田層
１を半田メッキ等によって形成したのち、前記回路基板
Ａの上面に、図５及び図６に示すように、感光性ポリイ
ミド樹脂等の耐熱絶縁性材料によるホトレジスト膜２を
適宜厚さに形成する。次いで、前記ホトレジスト膜２の
うち各電極パッドＡ1 の周囲の部分のみを残しその他の
部分を、マスクしての露光、及びこの露光後における現
像処理によって除去することによって、図７及び図８に
示すように、前記各電極パッドＡ1 の相互間の部分、及
び各電極パッドＡ1 の両端の部分に、前記ホトレジスト
膜２による隆起部２ａ，２ｂ，２ｃを形成するのであ
る。Then, as shown in FIGS. 3 and 4, a solder layer 1 is formed on the surface of each electrode pad A 1 on the circuit board A by solder plating or the like, and then the upper surface of the circuit board A As shown in FIGS. 5 and 6, a photoresist film 2 made of a heat-resistant insulating material such as a photosensitive polyimide resin is formed to an appropriate thickness. Next, by removing only the peripheral portion of each electrode pad A 1 of the photoresist film 2 by masking exposure and developing treatment after the exposure, the photoresist film 2 is removed as shown in FIGS. as shown, the portion between each other the respective electrode pads a 1, and the both end portions of the respective electrode pads a 1, raised portions 2a by the photoresist film 2, 2b, it is to form a 2c.

【００１４】このように、各電極パッドＡ1 の相互間の
部分に、ホトレジスト膜２による隆起部２ａを形成する
ことにより、回路基板Ａに対して電子部品Ｂを、各リー
ド端子Ｂ2 の各々が前記各電極パッドＡ1 の上面に密接
するように載せたのち、回路基板Ａの全体を、リフロー
炉に入れて半田の溶融点以上の温度に加熱することによ
って、各リード端子Ｂ2 の各々を、各電極パッドＡ1 に
対して半田付けする場合において、各電気パッドＡ1 の
表面において溶融した半田が、隣接の電極パッドに流れ
ることを、前記隆起部２ａによって防止でき、換言する
と、各電極パッドＡ1 の表面における溶融半田１は、図
９に示すように、当該電極パッドＡ1 の両側における隆
起部２ａの間から流出することなく凝固するから、前記
各リード端子Ｂ2 の各電極パッドＡ1 に対する高い半田
付け強度を保持した状態で、各リード端子Ｂ2 の相互間
に半田ブリッジが発生することを確実に防止できるので
ある。As described above, by forming the raised portion 2a of the photoresist film 2 between the electrode pads A 1 , the electronic component B is attached to the circuit board A, and the lead terminals B 2 are attached to the circuit board A. After There topped in intimate on the upper surface of the respective electrode pads a 1, by heating the whole of the circuit board a, to a temperature above the melting point of the solder is put into a reflow furnace, each of the lead terminals B 2 When soldering to each electrode pad A 1 , it is possible to prevent the solder melted on the surface of each electric pad A 1 from flowing to the adjacent electrode pad by the raised portion 2a. fused solder 1 in the surface of the electrode pads a 1, as shown in FIG. 9, since solidifies without flowing out from between the ridges 2a on both sides of the electrode pads a 1, wherein each power of each lead terminals B 2 While maintaining a high soldering strength for pads A 1, it can reliably prevent the solder bridge is generated between each other of the respective lead terminals B 2.

【００１５】しかも、回路基板Ａの上面に載せた電子部
品Ｂが、電極パッドＡ1 の列方向にずれ動くことを、前
記各電気パッドＡ1 の相互間に形成した隆起部２ａによ
って、確実に防止できるのである。また、前記実施例の
ように、各電極パッドＡ1 の相互間の部分に隆起部２ａ
を形成することに加えて、各電極パッドＡ1 の両端部に
隆起部２ｂ，２ｃを形成するか、各電極パッドＡ1 にお
ける両端のうちいずれか一方の部分に隆起部を形成する
ことにより、回路基板Ａの上面に載せた電子部品Ｂが、
電極パッドＡ1 の列方向と直角の方向にずれ動くことを
も防止できるのである。Moreover, the electronic parts B mounted on the upper surface of the circuit board A are surely displaced from each other in the column direction of the electrode pads A 1 by the raised portions 2a formed between the electric pads A 1 without fail. It can be prevented. In addition, as in the above-described embodiment, the ridges 2a are formed at the portions between the electrode pads A 1.
In addition to forming both ends in the raised portion 2b of the electrode pads A 1, or to form a 2c, by forming a raised portion on one of portions of the both ends in the respective electrode pads A 1, The electronic component B mounted on the upper surface of the circuit board A
It is also possible to prevent the electrode pads A 1 from shifting in the direction perpendicular to the column direction.

【００１６】なお、前記実施例のように、回路基板Ａの
上面にホトレジスト膜２を形成する前に、各電極パッド
Ａ1 の表面に半田層１を形成することに代えて、回路基
板Ａの上面にホトレジスト膜２を形成した後において、
各電極パッドＡ1 の表面にクリーム半田を塗布するよう
にしても良いのである。また、前記各隆起部２ａ，２
ｂ，２ｃは、回路基板Ａに対するスクリーン印刷によっ
て形成することができる。Incidentally, instead of forming the solder layer 1 on the surface of each electrode pad A 1 before forming the photoresist film 2 on the upper surface of the circuit board A as in the above embodiment, the circuit board A is replaced with the solder layer 1. After forming the photoresist film 2 on the upper surface,
It is also possible to apply cream solder to the surface of each electrode pad A 1 . In addition, each of the raised portions 2a, 2
b and 2c can be formed by screen printing on the circuit board A.

【００１７】更にまた、前記各隆起部２ａ，２ｂ，２ｃ
は、回路基板の上面に、耐熱性の合成樹脂膜を適宜厚さ
に形成し、この合成樹脂膜の上面にホトレジスト膜を形
成し、このホトレジスト膜のうち少なくとも回路基板に
おける各電極パッドの周囲の部分を残しその他の部分を
マスク露光・現像によって除去し、更に、前記合成樹脂
膜のうち少なくとも回路基板における各電極パッドの周
囲の部分に隆起部を残しその他の部分を、前記レジスト
膜を溶かすことなく前記合成樹脂膜のみを溶かすような
エッチング液によるエッチングにて除去したのち、前記
ホトレジスト膜を剥離することによっても形成すること
ができるのである。Furthermore, each of the raised portions 2a, 2b, 2c.
Form a heat-resistant synthetic resin film on the upper surface of the circuit board to an appropriate thickness, form a photoresist film on the upper surface of this synthetic resin film, and cover at least the periphery of each electrode pad on the circuit board of the photoresist film. Leaving a portion and removing the other portion by mask exposure / development, and further dissolving the resist film in the synthetic resin film, leaving a raised portion at least at a portion around each electrode pad in the circuit board. Alternatively, it can also be formed by removing the photoresist film by etching with an etching solution that dissolves only the synthetic resin film, and then peeling off the photoresist film.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明における回路基板の斜視図である。FIG. 1 is a perspective view of a circuit board according to the present invention.

【図２】図１のII−II視拡大断面図である。FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

【図３】前記回路基板における各電極パッドの表面に半
田層を形成した状態の斜視図である。FIG. 3 is a perspective view showing a state in which a solder layer is formed on the surface of each electrode pad on the circuit board.

【図４】図３のIV−IV視拡大断面図である。FIG. 4 is an enlarged sectional view taken along line IV-IV of FIG.

【図５】前記回路基板の上面にホトレジスト膜を形成し
た状態の斜視図である。FIG. 5 is a perspective view showing a state where a photoresist film is formed on the upper surface of the circuit board.

【図６】図５のVI−VI視拡大断面図である。6 is an enlarged sectional view taken along line VI-VI of FIG.

【図７】前記ホトレジスト膜に対してマスク露光したの
ち現像処理したあとの状態を示す斜視図てある。FIG. 7 is a perspective view showing a state after the photoresist film is mask-exposed and then developed.

【図８】図７のVIII−VIII視拡大断面図である。FIG. 8 is an enlarged sectional view taken along line VIII-VIII of FIG. 7.

【図９】半田付けを完了した状態の拡大断面図である。FIG. 9 is an enlarged sectional view showing a state where soldering is completed.

【図１０】従来における回路基板を示す斜視図である。FIG. 10 is a perspective view showing a conventional circuit board.

【図１１】図１０のXI−XI視拡大断面図である。11 is an enlarged sectional view taken along line XI-XI of FIG.

【符号の説明】[Explanation of symbols]

Ａ 回路基板 Ａ1 電極パッド Ｂ 電子部品 Ｂ1 モールド部 Ｂ2 リード端子 １ 半田層 ２ ホトレジスト膜 ２ａ，２ｂ，２ｃ 隆起部A Circuit board A 1 Electrode pad B Electronic component B 1 Mold part B 2 Lead terminal 1 Solder layer 2 Photoresist film 2a, 2b, 2c Raised part

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】上面に、電子部品におけるリード端子を半
田付けするための電極パッドの複数個を、適宜ピッチの
間隔で列状に形成して成る回路基板において、前記回路
基板の上面のうち少なくとも前記各電極パッド間の部位
に、適宜高さの耐熱絶縁体製の隆起部を設けることを特
徴とする電子部品半田実装用回路基板の構造。1. A circuit board having a plurality of electrode pads for soldering lead terminals of an electronic component formed in rows at appropriate pitch intervals on at least one of the upper surfaces of the circuit board. A structure of a circuit board for electronic component solder mounting, characterized in that a raised portion made of a heat-resistant insulator having an appropriate height is provided at a portion between the respective electrode pads.
JP5709593A 1993-03-17 1993-03-17 Structure of circuit board for electronic component soldering mount Pending JPH06268362A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5709593A JPH06268362A (en) 1993-03-17 1993-03-17 Structure of circuit board for electronic component soldering mount

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5709593A JPH06268362A (en) 1993-03-17 1993-03-17 Structure of circuit board for electronic component soldering mount

Publications (1)

Publication Number Publication Date
JPH06268362A true JPH06268362A (en) 1994-09-22

Family

ID=13045954

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5709593A Pending JPH06268362A (en) 1993-03-17 1993-03-17 Structure of circuit board for electronic component soldering mount

Country Status (1)

Country Link
JP (1) JPH06268362A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218552A (en) * 2007-03-01 2008-09-18 Nec Corp Mounting substrate and mounting method for electronic part

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218552A (en) * 2007-03-01 2008-09-18 Nec Corp Mounting substrate and mounting method for electronic part
US8168525B2 (en) 2007-03-01 2012-05-01 Nec Corporation Electronic part mounting board and method of mounting the same

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