JPH0625008Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH0625008Y2 JPH0625008Y2 JP1988128673U JP12867388U JPH0625008Y2 JP H0625008 Y2 JPH0625008 Y2 JP H0625008Y2 JP 1988128673 U JP1988128673 U JP 1988128673U JP 12867388 U JP12867388 U JP 12867388U JP H0625008 Y2 JPH0625008 Y2 JP H0625008Y2
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- semiconductor element
- support link
- lead
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988128673U JPH0625008Y2 (ja) | 1988-09-30 | 1988-09-30 | 半導体装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988128673U JPH0625008Y2 (ja) | 1988-09-30 | 1988-09-30 | 半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0252337U JPH0252337U (sv) | 1990-04-16 |
JPH0625008Y2 true JPH0625008Y2 (ja) | 1994-06-29 |
Family
ID=31382233
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988128673U Expired - Lifetime JPH0625008Y2 (ja) | 1988-09-30 | 1988-09-30 | 半導体装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0625008Y2 (sv) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5345568Y2 (sv) * | 1973-11-07 | 1978-10-31 |
-
1988
- 1988-09-30 JP JP1988128673U patent/JPH0625008Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0252337U (sv) | 1990-04-16 |
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