JPH0625005Y2 - 圧接型半導体装置 - Google Patents

圧接型半導体装置

Info

Publication number
JPH0625005Y2
JPH0625005Y2 JP1987007183U JP718387U JPH0625005Y2 JP H0625005 Y2 JPH0625005 Y2 JP H0625005Y2 JP 1987007183 U JP1987007183 U JP 1987007183U JP 718387 U JP718387 U JP 718387U JP H0625005 Y2 JPH0625005 Y2 JP H0625005Y2
Authority
JP
Japan
Prior art keywords
support plate
semiconductor substrate
ring
pressure contact
outer peripheral
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1987007183U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63115218U (enrdf_load_stackoverflow
Inventor
維豊 矢島
剛三 塚田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP1987007183U priority Critical patent/JPH0625005Y2/ja
Publication of JPS63115218U publication Critical patent/JPS63115218U/ja
Application granted granted Critical
Publication of JPH0625005Y2 publication Critical patent/JPH0625005Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1987007183U 1987-01-21 1987-01-21 圧接型半導体装置 Expired - Lifetime JPH0625005Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Publications (2)

Publication Number Publication Date
JPS63115218U JPS63115218U (enrdf_load_stackoverflow) 1988-07-25
JPH0625005Y2 true JPH0625005Y2 (ja) 1994-06-29

Family

ID=30790404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987007183U Expired - Lifetime JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Country Status (1)

Country Link
JP (1) JPH0625005Y2 (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1014451A4 (en) * 1997-03-26 2000-11-15 Hitachi Ltd FLAT SEMICONDUCTOR ARRANGEMENT AND RECTIFIER WITH THE SAME
CN111653554A (zh) * 2020-05-20 2020-09-11 常州博瑞电力自动化设备有限公司 一种二极管组件压装单元

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152049U (enrdf_load_stackoverflow) * 1979-04-18 1980-11-01
DE3308661A1 (de) * 1983-03-11 1984-09-20 SEMIKRON Gesellschaft für Gleichrichterbau u. Elektronik mbH, 8500 Nürnberg Halbleiterelement
JPH0216534Y2 (enrdf_load_stackoverflow) * 1985-09-17 1990-05-08

Also Published As

Publication number Publication date
JPS63115218U (enrdf_load_stackoverflow) 1988-07-25

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