JPS63115218U - - Google Patents

Info

Publication number
JPS63115218U
JPS63115218U JP718387U JP718387U JPS63115218U JP S63115218 U JPS63115218 U JP S63115218U JP 718387 U JP718387 U JP 718387U JP 718387 U JP718387 U JP 718387U JP S63115218 U JPS63115218 U JP S63115218U
Authority
JP
Japan
Prior art keywords
support plate
semiconductor substrate
insulating ring
annular resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP718387U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0625005Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987007183U priority Critical patent/JPH0625005Y2/ja
Publication of JPS63115218U publication Critical patent/JPS63115218U/ja
Application granted granted Critical
Publication of JPH0625005Y2 publication Critical patent/JPH0625005Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
JP1987007183U 1987-01-21 1987-01-21 圧接型半導体装置 Expired - Lifetime JPH0625005Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Publications (2)

Publication Number Publication Date
JPS63115218U true JPS63115218U (enrdf_load_stackoverflow) 1988-07-25
JPH0625005Y2 JPH0625005Y2 (ja) 1994-06-29

Family

ID=30790404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987007183U Expired - Lifetime JPH0625005Y2 (ja) 1987-01-21 1987-01-21 圧接型半導体装置

Country Status (1)

Country Link
JP (1) JPH0625005Y2 (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (fr) * 1997-03-26 1998-10-01 Hitachi, Ltd. Dispositif plat a semi-conducteur et convertisseur de courant utilisant ce dernier
CN111653554A (zh) * 2020-05-20 2020-09-11 常州博瑞电力自动化设备有限公司 一种二极管组件压装单元

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152049U (enrdf_load_stackoverflow) * 1979-04-18 1980-11-01
JPS59169145A (ja) * 1983-03-11 1984-09-25 ゼミクロン　エレクトローニク　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 半導体装置
JPS6258872U (enrdf_load_stackoverflow) * 1985-09-17 1987-04-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152049U (enrdf_load_stackoverflow) * 1979-04-18 1980-11-01
JPS59169145A (ja) * 1983-03-11 1984-09-25 ゼミクロン　エレクトローニク　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング 半導体装置
JPS6258872U (enrdf_load_stackoverflow) * 1985-09-17 1987-04-11

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (fr) * 1997-03-26 1998-10-01 Hitachi, Ltd. Dispositif plat a semi-conducteur et convertisseur de courant utilisant ce dernier
CN111653554A (zh) * 2020-05-20 2020-09-11 常州博瑞电力自动化设备有限公司 一种二极管组件压装单元

Also Published As

Publication number Publication date
JPH0625005Y2 (ja) 1994-06-29

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