JPS63115218U - - Google Patents

Info

Publication number
JPS63115218U
JPS63115218U JP718387U JP718387U JPS63115218U JP S63115218 U JPS63115218 U JP S63115218U JP 718387 U JP718387 U JP 718387U JP 718387 U JP718387 U JP 718387U JP S63115218 U JPS63115218 U JP S63115218U
Authority
JP
Japan
Prior art keywords
support plate
semiconductor substrate
insulating ring
annular resin
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP718387U
Other languages
Japanese (ja)
Other versions
JPH0625005Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987007183U priority Critical patent/JPH0625005Y2/en
Publication of JPS63115218U publication Critical patent/JPS63115218U/ja
Application granted granted Critical
Publication of JPH0625005Y2 publication Critical patent/JPH0625005Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図ａ，ｂは本考案の一実施例を示し、ａは
半導体基板と支持板の組立て後、ｂは容器に組込
み後の断面図、第２図は従来の半導体装置の断面
図、第３図ａ，ｂは本考案の別の実施例の半導体
基板と支持板の組立て後を示し、ａは断面図、ｂ
は平面図である。 １：絶縁環、３：電極体、４：シリコン基板、
５：Ｍｏ支持板、７：環状絶縁体。 1a and 1b show an embodiment of the present invention, a is a sectional view after the semiconductor substrate and the support plate are assembled, b is a sectional view after it is assembled into a container, FIG. 2 is a sectional view of a conventional semiconductor device, and FIG. Figures 3a and 3b show another embodiment of the present invention after the semiconductor substrate and support plate are assembled, where a is a sectional view and b is a cross-sectional view.
is a plan view. 1: Insulating ring, 3: Electrode body, 4: Silicon substrate,
5: Mo support plate, 7: Annular insulator.

Claims (1)

【実用新案登録請求の範囲】 (1) 絶縁環とその両端面に可撓性部分を介して
固着された電極体とからなる容器内に半導体基板
と支持板とが収容され、容器外から両電極体間に
加えられる圧力により半導体基板と支持板、支持
板と電極体が相互に加圧接触するものにおいて、
半導体基板と支持板とが支持板の板面に垂直方向
の変位を制限する伸縮性、絶縁性を持つた環状樹
脂体に囲まれたことを特徴とする半導体装置。 (2) 実用新案登録請求の範囲第１項記載の装置
において、環状樹脂体が半円形の二分割体からな
ることを特徴とする半導体装置。[Claims for Utility Model Registration] (1) A semiconductor substrate and a support plate are housed in a container consisting of an insulating ring and an electrode body fixed to both end faces of the insulating ring via flexible parts, and both sides can be accessed from outside the container. In a device in which the semiconductor substrate and the support plate, and the support plate and the electrode body come into pressure contact with each other due to the pressure applied between the electrode bodies,
A semiconductor device characterized in that a semiconductor substrate and a support plate are surrounded by an annular resin body having elasticity and insulating properties that limits displacement in a direction perpendicular to the surface of the support plate. (2) A semiconductor device according to claim 1, wherein the annular resin body is composed of two semicircular halves.
JP1987007183U 1987-01-21 1987-01-21 Pressure contact type semiconductor device Expired - Lifetime JPH0625005Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (en) 1987-01-21 1987-01-21 Pressure contact type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987007183U JPH0625005Y2 (en) 1987-01-21 1987-01-21 Pressure contact type semiconductor device

Publications (2)

Publication Number Publication Date
JPS63115218U true JPS63115218U (en) 1988-07-25
JPH0625005Y2 JPH0625005Y2 (en) 1994-06-29

Family

ID=30790404

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987007183U Expired - Lifetime JPH0625005Y2 (en) 1987-01-21 1987-01-21 Pressure contact type semiconductor device

Country Status (1)

Country Link
JP (1) JPH0625005Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (en) * 1997-03-26 1998-10-01 Hitachi, Ltd. Flat semiconductor device and power converter employing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152049U (en) * 1979-04-18 1980-11-01
JPS59169145A (en) * 1983-03-11 1984-09-25 ゼミクロン　エレクトローニク　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Semiconductor element
JPS6258872U (en) * 1985-09-17 1987-04-11

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55152049U (en) * 1979-04-18 1980-11-01
JPS59169145A (en) * 1983-03-11 1984-09-25 ゼミクロン　エレクトローニク　ゲゼルシャフト　ミット　ベシュレンクテル　ハフツング Semiconductor element
JPS6258872U (en) * 1985-09-17 1987-04-11

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998043301A1 (en) * 1997-03-26 1998-10-01 Hitachi, Ltd. Flat semiconductor device and power converter employing the same

Also Published As

Publication number Publication date
JPH0625005Y2 (en) 1994-06-29

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