JPS6251759U - - Google Patents

Info

Publication number
JPS6251759U
JPS6251759U JP14373685U JP14373685U JPS6251759U JP S6251759 U JPS6251759 U JP S6251759U JP 14373685 U JP14373685 U JP 14373685U JP 14373685 U JP14373685 U JP 14373685U JP S6251759 U JPS6251759 U JP S6251759U
Authority
JP
Japan
Prior art keywords
pellet
pair
drawn out
package
source leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14373685U
Other languages
Japanese (ja)
Other versions
JPH0432761Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1985143736U priority Critical patent/JPH0432761Y2/ja
Publication of JPS6251759U publication Critical patent/JPS6251759U/ja
Application granted granted Critical
Publication of JPH0432761Y2 publication Critical patent/JPH0432761Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Wire Bonding (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案の一実施例における蓋を除いた
平面図、第２図は従来の超高周波電界効果トラン
ジスタ用パツケージのパツケージの蓋を除いた平
面図、第３図は本考案のパツケージに収納される
超高周波電界効果トランジスタペレツトの平面図
である。 １……セラミツク基体、２……ペレツトマウン
ト部（金属層）、３ａ，３ｂ……ソース用リード
、４……ゲートリード、５……ドレイン用リード
、６……ソース電極用端子ランド、７……ソース
電極、８……ゲート電極、９……ドレイン電極。 Fig. 1 is a plan view of an embodiment of the present invention with the lid removed, Fig. 2 is a plan view of a conventional package for ultra-high frequency field effect transistors with the lid removed, and Fig. 3 is a plan view of the package of the present invention. FIG. 3 is a plan view of a super high frequency field effect transistor pellet to be housed. DESCRIPTION OF SYMBOLS 1... Ceramic substrate, 2... Pellet mount part (metal layer), 3a, 3b... Lead for source, 4... Gate lead, 5... Lead for drain, 6... Terminal land for source electrode, 7 ... Source electrode, 8 ... Gate electrode, 9 ... Drain electrode.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] セラミツク基体凹所底面に半導体ペレツトマウ
ント部を有し、さらに、このペレツトマウント部
を間に置いて、互いに反対方向に引き出された一
対のソース用リードとこれと直角方向で互いに反
対方向に引き出されたゲートリードおよびドレイ
ン用リードとを有する半導体装置用パツケージに
おいて、さらに、前記ペレツトマウント部とゲー
トリードの内端部との間に、前記一対のソース用
リードと導電接続されていて、かつ、前記ペレツ
トマウント部に固着される超高周波電界効果トラ
ンジスタペレツトのソース電極と接続される端子
ランドが設けられていることを特徴とする半導体
装置用パツケージ。 The ceramic substrate has a semiconductor pellet mount part on the bottom surface of the recess, and a pair of source leads drawn out in opposite directions and a pair of source leads drawn out in opposite directions with this pellet mount part in between. A package for a semiconductor device having a gate lead and a drain lead that are drawn out, further comprising a conductive connection to the pair of source leads between the pellet mount portion and an inner end of the gate lead; A package for a semiconductor device, further comprising a terminal land connected to a source electrode of an ultra-high frequency field effect transistor pellet fixed to the pellet mount.
JP1985143736U 1985-09-19 1985-09-19 Expired JPH0432761Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1985143736U JPH0432761Y2 (en) 1985-09-19 1985-09-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1985143736U JPH0432761Y2 (en) 1985-09-19 1985-09-19

Publications (2)

Publication Number Publication Date
JPS6251759U true JPS6251759U (en) 1987-03-31
JPH0432761Y2 JPH0432761Y2 (en) 1992-08-06

Family

ID=31053690

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1985143736U Expired JPH0432761Y2 (en) 1985-09-19 1985-09-19

Country Status (1)

Country Link
JP (1) JPH0432761Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036454U (en) * 1973-07-30 1975-04-17

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5036454U (en) * 1973-07-30 1975-04-17

Also Published As

Publication number Publication date
JPH0432761Y2 (en) 1992-08-06

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