JPH06232343A - 指紋認識のためのセンサ装置およびその製造方法 - Google Patents

指紋認識のためのセンサ装置およびその製造方法

Info

Publication number
JPH06232343A
JPH06232343A JP5287247A JP28724793A JPH06232343A JP H06232343 A JPH06232343 A JP H06232343A JP 5287247 A JP5287247 A JP 5287247A JP 28724793 A JP28724793 A JP 28724793A JP H06232343 A JPH06232343 A JP H06232343A
Authority
JP
Japan
Prior art keywords
sio
polysilicon
substrate
layer
sensor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5287247A
Other languages
English (en)
Japanese (ja)
Inventor
Thomas Scheiter
シヤイター トーマス
Markus Biebl
ビーブル マルクス
Helmut Klose
クローゼ ヘルムート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Siemens Corp
Original Assignee
Siemens Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Corp filed Critical Siemens Corp
Publication of JPH06232343A publication Critical patent/JPH06232343A/ja
Pending legal-status Critical Current

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP5287247A 1992-10-26 1993-10-25 指紋認識のためのセンサ装置およびその製造方法 Pending JPH06232343A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE4236133.8 1992-10-26
DE4236133A DE4236133C1 (de) 1992-10-26 1992-10-26 Sensoranordnung zur Erfassung von Fingerabdrücken und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
JPH06232343A true JPH06232343A (ja) 1994-08-19

Family

ID=6471388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5287247A Pending JPH06232343A (ja) 1992-10-26 1993-10-25 指紋認識のためのセンサ装置およびその製造方法

Country Status (6)

Country Link
US (1) US5373181A (en, 2012)
EP (1) EP0595107B1 (en, 2012)
JP (1) JPH06232343A (en, 2012)
KR (1) KR100237460B1 (en, 2012)
DE (2) DE4236133C1 (en, 2012)
TW (1) TW231348B (en, 2012)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300610A (ja) * 1997-04-17 1998-11-13 Commiss Energ Atom 圧力センサのための可撓膜を備えたマイクロシステムとその製造法
US7194113B2 (en) 2000-04-14 2007-03-20 Infineon Technologies Ag Capacitive biometric sensor
US7360293B2 (en) 2001-01-23 2008-04-22 Nippon Telegraph And Telephone Corporation Method of manufacturing recognition sensor

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW303441B (en, 2012) * 1995-03-29 1997-04-21 Trw Inc
FR2736205B1 (fr) * 1995-06-30 1997-09-19 Motorola Semiconducteurs Dispositif detecteur a semiconducteur et son procede de formation
FR2739977B1 (fr) * 1995-10-17 1998-01-23 France Telecom Capteur monolithique d'empreintes digitales
US6049620A (en) 1995-12-15 2000-04-11 Veridicom, Inc. Capacitive fingerprint sensor with adjustable gain
US5841888A (en) * 1996-01-23 1998-11-24 Harris Corporation Method for fingerprint indexing and searching
US5956415A (en) * 1996-01-26 1999-09-21 Harris Corporation Enhanced security fingerprint sensor package and related methods
US5828773A (en) * 1996-01-26 1998-10-27 Harris Corporation Fingerprint sensing method with finger position indication
US5963679A (en) * 1996-01-26 1999-10-05 Harris Corporation Electric field fingerprint sensor apparatus and related methods
EP0790479B1 (en) 1996-02-14 2002-01-16 STMicroelectronics S.r.l. Capacitive distance sensor, particularly for acquiring fingerprints
US6320394B1 (en) 1996-02-14 2001-11-20 Stmicroelectronics S.R.L. Capacitive distance sensor
US6114862A (en) 1996-02-14 2000-09-05 Stmicroelectronics, Inc. Capacitive distance sensor
US5778089A (en) * 1996-03-04 1998-07-07 Dew Engineering And Development Limited Driver circuit for a contact imaging array
WO1998011499A1 (en) * 1996-09-10 1998-03-19 Personal Biometric Encoders Ltd. Fingerprint digitizer with continuous conductive membrane
EP0943078A1 (de) * 1996-12-04 1999-09-22 Siemens Aktiengesellschaft Mikromechanisches bauelement zur erfassung von fingerabdrücken
US5864296A (en) * 1997-05-19 1999-01-26 Trw Inc. Fingerprint detector using ridge resistance sensor
US6011859A (en) * 1997-07-02 2000-01-04 Stmicroelectronics, Inc. Solid state fingerprint sensor packaging apparatus and method
US6240199B1 (en) * 1997-07-24 2001-05-29 Agere Systems Guardian Corp. Electronic apparatus having improved scratch and mechanical resistance
US6483931B2 (en) 1997-09-11 2002-11-19 Stmicroelectronics, Inc. Electrostatic discharge protection of a capacitve type fingerprint sensing array
US6909419B2 (en) 1997-10-31 2005-06-21 Kopin Corporation Portable microdisplay system
US6552704B2 (en) 1997-10-31 2003-04-22 Kopin Corporation Color display with thin gap liquid crystal
US6476784B2 (en) 1997-10-31 2002-11-05 Kopin Corporation Portable display system with memory card reader
US6191593B1 (en) 1997-12-17 2001-02-20 Stmicroelectronics, Inc. Method for the non-invasive sensing of physical matter on the detection surface of a capacitive sensor
US6091082A (en) * 1998-02-17 2000-07-18 Stmicroelectronics, Inc. Electrostatic discharge protection for integrated circuit sensor passivation
UA46173C2 (uk) * 1998-07-09 2002-05-15 Інфінеон Текнолоджіз Аг Напівпровідниковий конструктивний елемент
US6870946B1 (en) 1998-08-06 2005-03-22 Secugen Corporation Compact optical fingerprint capturing and recognition system
US6381347B1 (en) 1998-11-12 2002-04-30 Secugen High contrast, low distortion optical acquistion system for image capturing
US6310371B1 (en) * 1999-10-08 2001-10-30 United Microelectronics Corp. Fingerprint sensor chip
US7239227B1 (en) 1999-12-30 2007-07-03 Upek, Inc. Command interface using fingerprint sensor input system
US6512381B2 (en) 1999-12-30 2003-01-28 Stmicroelectronics, Inc. Enhanced fingerprint detection
US20020149571A1 (en) * 2001-04-13 2002-10-17 Roberts Jerry B. Method and apparatus for force-based touch input
KR100393191B1 (ko) * 2001-05-12 2003-07-31 삼성전자주식회사 압전체 박막을 이용한 지문인식 센서
KR100432490B1 (ko) 2001-09-17 2004-05-22 (주)니트 젠 광학식 지문취득 장치
KR100480450B1 (ko) * 2002-10-31 2005-04-07 한국전력공사 배전선 공통 연결 케이블 밴드
RU2265396C1 (ru) * 2004-04-20 2005-12-10 Общество с ограниченной ответственностью "СОНДА" Устройство для регистрации папиллярного узора
EP1605240A1 (de) * 2004-06-09 2005-12-14 ETH Zürich, ETH Transfer Textiler Drucksensor
US7584068B2 (en) * 2007-02-22 2009-09-01 Teradyne, Inc. Electrically stimulated fingerprint sensor test method
CA2695489A1 (en) * 2007-04-23 2008-11-06 Sierra Scientific Instruments, Inc. Suspended membrane pressure sensing array
US8115497B2 (en) * 2007-11-13 2012-02-14 Authentec, Inc. Pixel sensing circuit with common mode cancellation
CN111780896B (zh) * 2020-05-15 2021-09-28 北京他山科技有限公司 一种地理皮肤
JP7576418B2 (ja) * 2020-09-16 2024-10-31 株式会社ジャパンディスプレイ 圧力センサ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440873A (en) * 1967-05-23 1969-04-29 Corning Glass Works Miniature pressure transducer
US4203128A (en) * 1976-11-08 1980-05-13 Wisconsin Alumni Research Foundation Electrostatically deformable thin silicon membranes
US4353056A (en) * 1980-06-05 1982-10-05 Siemens Corporation Capacitive fingerprint sensor
US4394773A (en) * 1980-07-21 1983-07-19 Siemens Corporation Fingerprint sensor
US4429413A (en) * 1981-07-30 1984-01-31 Siemens Corporation Fingerprint sensor
JPS58158778A (ja) * 1982-03-16 1983-09-21 Nippon Telegr & Teleph Corp <Ntt> 表面凹凸情報入力方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10300610A (ja) * 1997-04-17 1998-11-13 Commiss Energ Atom 圧力センサのための可撓膜を備えたマイクロシステムとその製造法
US7194113B2 (en) 2000-04-14 2007-03-20 Infineon Technologies Ag Capacitive biometric sensor
US7360293B2 (en) 2001-01-23 2008-04-22 Nippon Telegraph And Telephone Corporation Method of manufacturing recognition sensor

Also Published As

Publication number Publication date
DE4236133C1 (de) 1994-03-10
US5373181A (en) 1994-12-13
EP0595107B1 (de) 1998-05-20
EP0595107A2 (de) 1994-05-04
DE59308575D1 (de) 1998-06-25
KR940008658A (ko) 1994-05-16
TW231348B (en, 2012) 1994-10-01
KR100237460B1 (ko) 2000-01-15
EP0595107A3 (de) 1995-03-29

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