TW231348B - - Google Patents

Info

Publication number
TW231348B
TW231348B TW082106784A TW82106784A TW231348B TW 231348 B TW231348 B TW 231348B TW 082106784 A TW082106784 A TW 082106784A TW 82106784 A TW82106784 A TW 82106784A TW 231348 B TW231348 B TW 231348B
Authority
TW
Taiwan
Application number
TW082106784A
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of TW231348B publication Critical patent/TW231348B/zh

Links

Classifications

    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00—Measuring for diagnostic purposes; Identification of persons
    • A61B5/117—Identification of persons
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/146—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors for measuring force distributions, e.g. using force arrays
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L1/00—Measuring force or stress, in general
    • G01L1/14—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators
    • G01L1/142—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors
    • G01L1/148—Measuring force or stress, in general by measuring variations in capacitance or inductance of electrical elements, e.g. by measuring variations of frequency of electrical oscillators using capacitors using semiconductive material, e.g. silicon
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
    • G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
    • G06V40/12—Fingerprints or palmprints
    • G06V40/13—Sensors therefor
    • G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Human Computer Interaction (AREA)
  • Multimedia (AREA)
  • Theoretical Computer Science (AREA)
  • Molecular Biology (AREA)
  • Public Health (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Medical Informatics (AREA)
  • Biophysics (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Pathology (AREA)
  • Veterinary Medicine (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
  • Image Input (AREA)
  • Pressure Sensors (AREA)
  • Micromachines (AREA)
  • Semiconductor Integrated Circuits (AREA)
TW082106784A 1992-10-26 1993-08-23 TW231348B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4236133A DE4236133C1 (de) 1992-10-26 1992-10-26 Sensoranordnung zur Erfassung von Fingerabdrücken und Verfahren zu deren Herstellung

Publications (1)

Publication Number Publication Date
TW231348B true TW231348B (zh) 1994-10-01

Family

ID=6471388

Family Applications (1)

Application Number Title Priority Date Filing Date
TW082106784A TW231348B (zh) 1992-10-26 1993-08-23

Country Status (6)

Country Link
US (1) US5373181A (zh)
EP (1) EP0595107B1 (zh)
JP (1) JPH06232343A (zh)
KR (1) KR100237460B1 (zh)
DE (2) DE4236133C1 (zh)
TW (1) TW231348B (zh)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW303441B (zh) * 1995-03-29 1997-04-21 Trw Inc
FR2736205B1 (fr) * 1995-06-30 1997-09-19 Motorola Semiconducteurs Dispositif detecteur a semiconducteur et son procede de formation
FR2739977B1 (fr) * 1995-10-17 1998-01-23 France Telecom Capteur monolithique d'empreintes digitales
US6049620A (en) 1995-12-15 2000-04-11 Veridicom, Inc. Capacitive fingerprint sensor with adjustable gain
US5841888A (en) * 1996-01-23 1998-11-24 Harris Corporation Method for fingerprint indexing and searching
US5963679A (en) * 1996-01-26 1999-10-05 Harris Corporation Electric field fingerprint sensor apparatus and related methods
US5956415A (en) * 1996-01-26 1999-09-21 Harris Corporation Enhanced security fingerprint sensor package and related methods
US5828773A (en) * 1996-01-26 1998-10-27 Harris Corporation Fingerprint sensing method with finger position indication
US6114862A (en) 1996-02-14 2000-09-05 Stmicroelectronics, Inc. Capacitive distance sensor
DE69618559T2 (de) 1996-02-14 2002-08-14 Stmicroelectronics S.R.L., Agrate Brianza Kapazitiver Abstandssensor, insbesondere zur Erfassung von Fingerabdrücken
US6320394B1 (en) 1996-02-14 2001-11-20 Stmicroelectronics S.R.L. Capacitive distance sensor
US5778089A (en) * 1996-03-04 1998-07-07 Dew Engineering And Development Limited Driver circuit for a contact imaging array
DE69732149T2 (de) * 1996-09-10 2005-12-15 Personal Biometric Encoders Ltd. Fingerabdruckdigitalisierer mit verformbarem substrat
WO1998025115A1 (de) * 1996-12-04 1998-06-11 Siemens Aktiengesellschaft Mikromechanisches bauelement zur erfassung von fingerabdrücken
FR2762389B1 (fr) * 1997-04-17 1999-05-21 Commissariat Energie Atomique Microsysteme a membrane souple pour capteur de pression et procede de realisation
US5864296A (en) * 1997-05-19 1999-01-26 Trw Inc. Fingerprint detector using ridge resistance sensor
US6011859A (en) * 1997-07-02 2000-01-04 Stmicroelectronics, Inc. Solid state fingerprint sensor packaging apparatus and method
US6240199B1 (en) * 1997-07-24 2001-05-29 Agere Systems Guardian Corp. Electronic apparatus having improved scratch and mechanical resistance
US6483931B2 (en) 1997-09-11 2002-11-19 Stmicroelectronics, Inc. Electrostatic discharge protection of a capacitve type fingerprint sensing array
US6552704B2 (en) 1997-10-31 2003-04-22 Kopin Corporation Color display with thin gap liquid crystal
US6476784B2 (en) 1997-10-31 2002-11-05 Kopin Corporation Portable display system with memory card reader
US6909419B2 (en) 1997-10-31 2005-06-21 Kopin Corporation Portable microdisplay system
US6191593B1 (en) 1997-12-17 2001-02-20 Stmicroelectronics, Inc. Method for the non-invasive sensing of physical matter on the detection surface of a capacitive sensor
US6091082A (en) * 1998-02-17 2000-07-18 Stmicroelectronics, Inc. Electrostatic discharge protection for integrated circuit sensor passivation
EP1103031A1 (de) * 1998-07-09 2001-05-30 Infineon Technologies AG Halbleiterbauelement mit passivierung
US6310371B1 (en) * 1999-10-08 2001-10-30 United Microelectronics Corp. Fingerprint sensor chip
US7239227B1 (en) 1999-12-30 2007-07-03 Upek, Inc. Command interface using fingerprint sensor input system
US6512381B2 (en) 1999-12-30 2003-01-28 Stmicroelectronics, Inc. Enhanced fingerprint detection
EP1146471B1 (de) * 2000-04-14 2005-11-23 Infineon Technologies AG Kapazitiver biometrischer Sensor
US7123026B2 (en) 2001-01-23 2006-10-17 Nippon Telegraph And Telephone Corporation Surface shape recognition sensor and method of manufacturing the same
US20020149571A1 (en) * 2001-04-13 2002-10-17 Roberts Jerry B. Method and apparatus for force-based touch input
KR100393191B1 (ko) * 2001-05-12 2003-07-31 삼성전자주식회사 압전체 박막을 이용한 지문인식 센서
KR100432490B1 (ko) 2001-09-17 2004-05-22 (주)니트 젠 광학식 지문취득 장치
KR100480450B1 (ko) * 2002-10-31 2005-04-07 한국전력공사 배전선 공통 연결 케이블 밴드
EP1605240A1 (de) * 2004-06-09 2005-12-14 ETH Zürich, ETH Transfer Textiler Drucksensor
US7584068B2 (en) * 2007-02-22 2009-09-01 Teradyne, Inc. Electrically stimulated fingerprint sensor test method
EP2150791B1 (en) * 2007-04-23 2016-03-16 Given Imaging (Los Angeles) LLC Suspended membrane pressure sensing array
US8115497B2 (en) * 2007-11-13 2012-02-14 Authentec, Inc. Pixel sensing circuit with common mode cancellation
CN111780896B (zh) * 2020-05-15 2021-09-28 北京他山科技有限公司 一种地理皮肤
JP2022049511A (ja) * 2020-09-16 2022-03-29 株式会社ジャパンディスプレイ 圧力センサ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3440873A (en) * 1967-05-23 1969-04-29 Corning Glass Works Miniature pressure transducer
US4203128A (en) * 1976-11-08 1980-05-13 Wisconsin Alumni Research Foundation Electrostatically deformable thin silicon membranes
US4353056A (en) * 1980-06-05 1982-10-05 Siemens Corporation Capacitive fingerprint sensor
US4394773A (en) * 1980-07-21 1983-07-19 Siemens Corporation Fingerprint sensor
US4429413A (en) * 1981-07-30 1984-01-31 Siemens Corporation Fingerprint sensor
JPS58158778A (ja) * 1982-03-16 1983-09-21 Nippon Telegr & Teleph Corp <Ntt> 表面凹凸情報入力方法

Also Published As

Publication number Publication date
US5373181A (en) 1994-12-13
JPH06232343A (ja) 1994-08-19
EP0595107A3 (de) 1995-03-29
KR100237460B1 (ko) 2000-01-15
EP0595107B1 (de) 1998-05-20
DE59308575D1 (de) 1998-06-25
EP0595107A2 (de) 1994-05-04
DE4236133C1 (de) 1994-03-10
KR940008658A (ko) 1994-05-16

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