JPH0623014Y2 - 混成集積回路用基板 - Google Patents
混成集積回路用基板Info
- Publication number
- JPH0623014Y2 JPH0623014Y2 JP1986078278U JP7827886U JPH0623014Y2 JP H0623014 Y2 JPH0623014 Y2 JP H0623014Y2 JP 1986078278 U JP1986078278 U JP 1986078278U JP 7827886 U JP7827886 U JP 7827886U JP H0623014 Y2 JPH0623014 Y2 JP H0623014Y2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- lead terminal
- lead
- mounting
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 36
- 230000015572 biosynthetic process Effects 0.000 claims description 14
- 238000000034 method Methods 0.000 description 9
- 230000002950 deficient Effects 0.000 description 7
- 210000000078 claw Anatomy 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000000007 visual effect Effects 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986078278U JPH0623014Y2 (ja) | 1986-05-23 | 1986-05-23 | 混成集積回路用基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1986078278U JPH0623014Y2 (ja) | 1986-05-23 | 1986-05-23 | 混成集積回路用基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62190370U JPS62190370U (enrdf_load_stackoverflow) | 1987-12-03 |
JPH0623014Y2 true JPH0623014Y2 (ja) | 1994-06-15 |
Family
ID=30927067
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1986078278U Expired - Lifetime JPH0623014Y2 (ja) | 1986-05-23 | 1986-05-23 | 混成集積回路用基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0623014Y2 (enrdf_load_stackoverflow) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6068671U (ja) * | 1983-10-17 | 1985-05-15 | 矢崎総業株式会社 | プリント配線板 |
-
1986
- 1986-05-23 JP JP1986078278U patent/JPH0623014Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPS62190370U (enrdf_load_stackoverflow) | 1987-12-03 |
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