JPH06224139A - Total wafer deposition apparatus - Google Patents

Abstract

PURPOSE: To provide a full wafer deposition device a capable of extending the replacement lifetime for process kits with a simple structure. CONSTITUTION: A deposition shield 1 can be attached so as to be easily detached and includes a cylindrical shield 10, having an interval from the periphery of a substrate supporter 16. A shield ring 23 is detachably loaded, and its center is automatically positioned on a substrate 14. These constitutional elements can prevent the generation of depositions in a chamber 2 or a mechanical part arranging outside a treatment region. A peripheral groove can be formed on the substrate supporter, arranged on the periphery of the substrate, so that a material deposited in the peripheral part of the substrate supporter is not stuck to the substrate. A gap between the substrate and the supporter acts so that the material deposited on the supporter is not stuck to the substrate.

Description

Detailed Description of the Invention

[0001]

FIELD OF THE INVENTION This invention generally relates to deposition shields for process chambers including, for example, physical vapor deposition or sputtering chambers, chemical vapor deposition chambers, and ion implantation chambers. Regarding Further, the present invention relates to chambers used to form integrated circuits or integrated circuit elements on substrates such as semiconductor wafers.

[0002]

2. Description of the Prior Art In a deposition process, species from a source such as a target or a gas inlet are exposed to an exposed internal chamber surface (internal chamber) including chamber walls and hardware. s
urfaces). Shields designed to prevent the deposition of such species have been utilized.

[0003]

However, to the inventor's knowledge, the available shields have not been successful in completely preventing unwanted deposition. Also, although such shields are difficult and time consuming to replace, they must be replaced relatively often. When using an automatic substrate exchange system with moving elements within the chamber, it becomes increasingly difficult to provide adequate shielding and easy exchange.

Therefore, an object of the present invention is to provide a shield device which is easy to replace and can be replaced in a short time.

[0005]

SUMMARY OF THE INVENTION In one aspect, the present invention embodies a shield apparatus for preventing deposition onto a chamber peripheral region during processing of a substrate within the chamber. The shield device includes a wall-shaped member surrounding the substrate, a substrate support that extends laterally beyond the substrate, and a shield ring that overlaps the substrate support and the wall-shaped member. Shield the chamber outside the chamber from deposition. These components are adapted for easy removal from the chamber. For example, the shield ring is placed at a removable position between the wall-shaped member and the substrate. Further, in the preferred embodiment, the shield member and the shield ring can be integrally removed and replaced. In another aspect, the shield ring includes an inwardly extending roof to shield a region of the substrate support near the substrate edge from deposition.

In another aspect, the substrate is supported by the spacing means mounted on the substrate support in order to maintain the spacing between the substrate and the substrate support. This spacing removes the deposited material and the bond between the substrate and the substrate and substrate support, facilitating deposition and processing along the entire top surface of the substrate.

Further, in another aspect, the present invention is embodied by the following combinations. That is, a chamber having an inner wall that surrounds the processing region, a substrate support that supports the substrate at a predetermined substrate supporting position within the processing region, and a substrate support to prevent deposition on the chamber inner wall during substrate processing and to shield the chamber inner wall. A shield including a wall surrounding the location is provided. This shield includes a vertical flange located near the periphery of the substrate mounting position and spaced from the edge of the substrate support by a predetermined distance, and a shield ring having the following configuration. That is, the shield ring is a downwardly extending flange that centrally releasably positions the ring itself in the gap between the shield flange (= vertical flange) and the substrate support, and inward to shield the area near the substrate edge from deposition. It has a roof that extends to.

The substrate support may include substrate positioning means or substrate centering means. The substrate positioning means is provided along the periphery of the substrate so as to engage with the peripheral portion of the substrate for centering the substrate at a predetermined substrate mounting position. The substrate support may include grooves or depressions. The groove or depression extends along the perimeter of the substrate mounting position to allow deposition on the substrate support around the substrate without disturbing deposition on the substrate support. When this groove is used, the positioning means is preferably a plurality of elongated pins spaced along the groove.

Materials that can be used for this shield system include stainless steel, aluminum, titanium, and copper.

The shield system including this shield ring can be effectively and easily removed for cleaning and replacement. A feature of the grooved substrate support, etc., is the increased processing time between cleanings. Further, the other components including the substrate centering means and the shield component including the detachable ring provide a shielded substrate support system specifically tailored to remove deposits that interfere with substrate support. provide. What is more unique is the feature of spacing between the substrate and the substrate support allows deposition and processing of the entire surface of the substrate.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.

FIG. 1 is a simplified configuration diagram showing a first embodiment of the present invention incorporated in a deposition chamber. The present invention effectively shields the chamber and its internal mechanisms from deposition, and further allows the shield element to be easily removed for cleaning or replacement. The present invention is directed to full wafer deposition, ie
The deposition on the entire surface of the substrate 14 such as a semiconductor wafer is achieved. The present invention is generally applicable to deposition chambers. Here, the deposition chamber includes, for example, a chamber for physical vapor deposition or sputtering, a chamber for chemical vapor deposition, a chamber for ion implantation, and the like.

As an example, FIG. 1 shows a sputtering chamber 2. The substrate 14 is positioned in the vicinity of the chamber processing area 8 on a substrate support member 16 such as a susceptor or pedestal. As an example,
The diameter of the substrate support member 16 is larger than the diameter of the wafer 14. In this device example, as shown in FIG. 2, the support member 16 has a conventional vertically movable lift mechanism.
attached to the elevator system) 18 by a plurality of screws 9-9 (hardware such as gas supply port and sputtering target are omitted for clarity).

The example sputtering chamber 2 includes a cylindrical chamber wall 3 and a support ring 4 provided on the chamber wall 3 by welding. Chamber 2
An adaptor plate 5 forming the upper wall of the upper part is attached to the support ring 4 by a plurality of screws 6-6.
The O-ring 7 is provided with a seal for sealing. A deposition source (not shown) such as a sputtering target device or gas inlet is mounted in the recess 90 and sealed from the atmosphere. The wall-shaped cylindrical shield member 10 is attached to the support ring 4. That is, the cylindrical shield 10 includes an outwardly extending upper lip (up) attached to the bottom surface of the matching plate 5 by a plurality of screws 12-12.
per lip) 11. A flange 15 extending upward from the annular bottom wall 13 of the shield member 10 surrounds the periphery of the substrate support 16, and the shield flange 15 and the substrate support 16 are provided.
A gap 17 remains between them.

The deposition shield 1 includes a substrate 14
It also includes an annular shield ring 20 having an inner diameter to fit the upper peripheral edge of the substrate support member 16 in the vicinity of. The ring 20 includes a downwardly extending tapered centering flange 22 and a second outer flange 23 generally parallel to the flange 22. The centering flange 22 is adapted to fit in the opening 17 between the flange 15 and the side edge of the substrate supporting member 16. The shield ring 20 is removably installed around the substrate 14 by covering the mating flange 15 of the cylindrical shield member 10 with two flanges having tapered flanges 22 extending into the openings 17. . The shield ring 20 also includes an inwardly extending roof 25 that protects the substrate periphery from chemical species carried inward, eg, in direction 56, the surface on which the shield ring 20 rests and the mating ring surface. It prevents the deposition on the interface.

As mentioned above, this shield is uniquely
It provides sufficient and effective shielding of the chamber as well as unique ease of removal. In particular, the effective shielding action is a cylindrical shield member 10, a relatively wide substrate support member 16 (ie, a support that extends laterally beyond the substrate).
And the shield ring 20. The shield ring 20 straddles both the substrate support member 16 and the bottom portion extending inside the shield member 10. These overlapping components make the processing area of the chamber 8 the rest of the chamber interior.
rior) to shield other areas from deposition, such as chamber walls 3 and internal chamber features such as the movable elevator 18 below the substrate support member 16. The shield element includes a fitting plate mounting means such as a screw 6-6, a fitting plate 5, a shield member 10 fixed to the fitting plate 5, and a shield ring 20 detachably supported by the shield member 10. It can be easily removed by lifting and removing it integrally. Next, the dual-function substrate support member (dual-function subs)
The trate support member) and the shield component 16 can be easily removed by removing the three mounting screws 9-9 shown in FIG. Instead of this, the shield ring 20 is
It can be removed by simply lifting it from the locating space 17. That is, if desired, the shield ring 20 can be removed to remove the substrate support member 16 without removing the shield 10. Obviously, the shield component may be, for example, a screw 9-
It is replaced by attaching the substrate support member 16 using 9 and inserting the shield unit and attaching the unit via screws 6-6.

According to another aspect of the invention, a protru
sions) or bumps 35-35 (FIGS. 1 and 4)
Substrate positioning means or centering means, such as a substrate support member 16 around the mounting position of the substrate 14
Is formed on the upper surface of the substrate to accurately center the substrate 14 on the support member 16. As shown in FIG. 4, the four positioning bumps 35-35 are arranged in a rectangular arrangement at angular intervals of 90 degrees so that the positioning function can be exerted with respect to the circumference 360 degrees of the wafer 14. The position designating means limits the lateral movement of the wafer 14 relative to the substrate support member 16. This ensures that the wafer is positioned at the desired position on the substrate support member 16 for wafer processing, and further that the wafer is placed on the support member at a position where it can be picked up by the robot blade 34. . This position specification function enables the deposition of the entire wafer. That is, without using the edge clamp, that is, without using the stator, the wafer 14
The above-mentioned deposition is allowed to cover the entire surface of the substrate. Preferably, the locating bumps 35-35 are round, eg, hemispherical, to avoid sharp corners that can cause dust to fall off in the processing environment.

In the illustrated chamber system 2, as shown in FIGS. 1, 2, and 4, the substrate support member 16 is shown.
Is mounted on the elevator 18 and moves vertically relative to the arrangement of the pins 30-30 vertically moved by the second vertical elevator or the elevator mechanism 32. The board supporting member 16 and the board supporting pin 30 that are interlocked with the controlled horizontal movement of the board carrying blade 34 shown in FIG.
The controlled vertical movement of 30 (pins extending into the substrate support 16 through the openings 33-33) causes the substrate to go in and out of the chamber 2 and the placement of the substrate in and out of the substrate support member 16. Pull up (onto and off). Further, vertical movement of the substrate support member 16 by the elevator 18 allows for high precision positioning relative to a gas inlet and / or a source of material such as a sputtering target. Automatic substrate exchange / positioning systems of this type are known in the art, eg, 1990.
U.S. Pat. No. 4,951,601 by Inventor Maydan et al., Issued Aug. 28, 1996.

Despite the complexity introduced by the moving parts described above, this deposition shield system 1
Provides an effective shield against unwanted deposition and allows easy removal and replacement. It should be noted that although the illustrated cylindrical shield system 1 is formed for a circular semiconductor wafer, other shield shapes are also required to match other substrate and chamber shapes. Can be used.

According to another aspect of the invention, the substrate support 1
Spacer means provided in the form of a plurality of pins 36-36 pierced through six corresponding openings 37-37 support the substrate 14 just above the substrate support 16. By providing a small gap 50 between the substrate support member 16 and the wafer 14, the spacing means allows the material deposited along the perimeter of the substrate support member exposed at the substrate edge to adhere to the substrate, and The support member is prevented from adhering to the substrate. The interval holding means is
In this way, all wafer deposition is facilitated. Pin 3
The height of 6-36 is preferably such that it provides a gap of about 0.5 to 1 millimeter between the substrate and the substrate support 16. Spacings greater than about 1 millimeter may allow the deposited material to reach the backside of the substrate.

FIG. 3 shows another shielded substrate support 1
6A, this substrate support 16A is suitable for higher rate deposition, typically relatively low stress materials such as aluminum, aluminum containing compounds and materials. Notably, a typical process deposits about 1000 angstroms of material on a wafer, resulting in the processing of approximately 5000 wafers before cleaning the support pedestal 16. However, the aluminum thickness can be 10,000 Angstroms per wafer. The gap 50 cannot be wide enough to increase the thickness of this deposition because of the potential for backside deposition. Instead of this, a recessed groove 38 is formed along the periphery of the substrate 14 in the substrate support 16A. The grooves 38 allow deposition of deposited material (involved in planar geometry) on the support 16 along the edges of the substrate 14 without adhering the material to the substrate and without disturbing the positioning and orientation of the substrate on the support. Allow additional formation.

In the embodiment shown in FIG. 3, the center locating means is located in the groove 38 and includes center locating pins 40-40 which are elongated to an adjusted length. The elongated threaded centering pin 40-40 is
Instead of the smaller (shorter) centering bump or protrusion 35-35 of FIG. 1, it is attached to the substrate support 16A via a through hole. Also, the roof 25
A gap 51 between the substrate and the substrate support thereunder prevents the roof from adhering to the substrate. Furthermore, due to the radial length of the inwardly extending roof, the surface bearing the roof is free of deposited material.

Materials effective as the respective constituent elements of the shield system 1 include stainless steel, aluminum, titanium and copper. Stainless steel is the preferred material because it is relatively easy to clean. Aluminum and copper are desirable when depositing materials such as tungsten that do not adhere to stainless steel.

FIG. 4 is a simplified schematic view of the wafer 14, positioning or centering means (35 or 4).
0), the substrate support member 16 and the robot transport blade 34
Shows the relationship with. In this embodiment, the positioning means comprises four protrusions 35-35 arranged at 90 degree intervals along the near peripheral portion of the substrate support 16 to surround the perimeter 3 of the substrate.
Guarantees positioning over 60 degrees.

The operation of robot blades of the type considered here is well known, but the mode of operation is reexamined,
Ensure understanding of the collaborative relationships between each component. Wafer 1
In order to place the 4 on the support 16, the wafer 14 is positioned on a robot blade 34, which is typically a slit valve control in the chamber wall.
-controlled) openings or other suitable openings (not shown)
Through the chamber. Recessed (ie lowered) substrate support 16 and pin row 30-3
Place the wafer above 0. The pins 30-30 are lifted by the elevator 32 with respect to the substrate support member 16 to lift the substrate 14 from the robot blade 34.
The robot blade 34 is pulled back, and the elevator 32 and the pins 30-30 descend with respect to the substrate support member 16. This causes the substrate to deposit on the spacer support pins 36-36 while being centered by the positioning means 35-35. In the illustrated embodiment, the elevator 18
Is a processing area or sputtering source
) Or the gas inlet, etc., and the vertical position of the support 16 and the substrate 14 can be changed and used to control the manufacturing process.

Conversely, to remove the substrate 14 from the chamber after processing, the pins 30-30 are raised relative to the substrate support member 16 through the openings 33-33, then
A robot blade 34 is inserted between the substrate support member 16 and the substrate 14 to lift the substrate 14 from the spacer support pins 36-36. The elevator 32 uses the lifting pins 30-30.
And the substrate 14 is deposited on the robot blade 34. Then, the robot blade 34 and the substrate 14 are pulled out from the chamber.

Next, an all wafer deposition apparatus according to another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a schematic diagram showing a PVD device according to this embodiment.

This apparatus includes a shield 60, a target 70, a pedestal 80, and a lifter 90 inside the PVD chamber.
It is configured with. The shield 60 has a flange 62 extending downward, and the pedestal 80 has the flange 62.
Is formed with a circumferential groove 82. Circumferential groove 82
Is large enough to allow the pedestal 80 to be detachably inserted. Inside the circumferential groove 82, an ascending / descending hole 84 through which the ascending / descending pin 30 passes, and a hole 86 into which a screw attached to the ascending / descending machine 18 is inserted are formed. The lifting holes 84 are formed at positions corresponding to the lifting pins 30.

The pedestal 80 is fixed to the elevator 18 by screws 9-9 inserted in the mounting holes 86. As the elevator 18 rises, the circumferential groove 8
The flange 62 is inserted into the chamber 2, and the inner wall of the chamber is shielded from the substrate processing region where the target 70 is located.

The operation of this embodiment will be described below. First,
The wafer is transferred by the robot. The wafer carried by the robot is lifted from the lower surface by the lifter 90 and holds the state. In this state, the robot returns. Next, the pedestal 80 is lifted from below and the wafer 14
And the wafer 14 is lifted into the shield 60. Thereafter, the wafer 14 is sputtered in the substrate processing area. The contact during the series of operations is performed by the lifter 9
0 and the bottom surface of the wafer 14 by the pedestal 80 only. This is the minimum contact for carrying the wafer 14, and there is no other contact.

According to this embodiment, since the number of contact portions is small, the generation of foreign matter such as film peeling is reduced, and the structure is simple, so that the replacement life of the internal jig (process kit) is extended.

[0032]

Since the present invention is configured as described above, it is possible to effectively prevent deposition on the chamber or the mechanism portion outside the substrate processing region.

[Brief description of drawings]

FIG. 1 is a simplified partial vertical cross-sectional block diagram of a shielded processing chamber embodying the present invention.

FIG. 2 is a simplified partial vertical cross-sectional configuration diagram of an automatic substrate exchange system.

FIG. 3 is a diagram illustrating another embodiment of the shield arrangement structure shown in FIG.

FIG. 4 is a simplified configuration diagram showing a relationship among a wafer, a wafer supporting member, a wafer center positioning unit, and a robot carrying blade.

FIG. 5 is a simplified configuration diagram showing a relationship among a wafer, a wafer supporting member, a wafer center positioning unit, and a robot carrying blade according to another embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Deposition shield, 2 ... Sputtering chamber, 3 ... Cylindrical chamber wall, 4 ... Support ring, 5 ... Fitting plate, 6, 9, 12 ... Screw, 7 ... O ring, 8 ... Chamber processing area, 10 ... Shield member, 11 ... upper lip, 1
3 ... Bottom wall, 14 ... Substrate, 15 ... Flange, 16, 16A
... substrate support (substrate support member), 17 ... gap, 18 ... vertical movement lifting mechanism, 20 ... shield ring, 22 ... tapered flange, 23 ... outer flange, 25 ... roof, 3
0 ... Board support pins, 32 ... Elevator, 34 ... Robot blade, 35 ... Positioning bumps (positioning means), 3
6 ... Spacer support pins, 33, 37 ... Openings, 38 ... Dimples or grooves, 40 ... Center positioning pins, 51 ... Gap.

 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takeshi Jinbo 14-3 Shinizumi, Narita, Chiba Prefecture Nogedaira Industrial Park Applied Materials Japan Co., Ltd. (72) Hiroyuki Takahama 14-3 Shinizumi, Narita, Chiba Prefecture Inside the Nogedaira Industrial Estate Applied Materials Japan Co., Ltd. (72) Inventor Akihiko Saito 14-3 Shinsen, Narita, Chiba Prefecture Inside the Nogedaira Industrial Park Applied Materials Japan Co., Ltd.

Claims (7)

[Claims] 1. A hermetically-shaped wall means suitable for enclosing a substrate and preventing deposition to a chamber area during substrate processing, and detachable between said wall means and said substrate. (Confining deposition) is performed on a substrate being processed in a chamber, which has a shape that can be arranged (removable) and includes a shield ring that shields a peripheral region of the substrate from deposition. Shield arrangement for (shield arrangement). 2. A chamber having a wall surrounding a processing region, a substrate support for supporting a substrate at a predetermined substrate supporting position, a substrate surrounding the substrate supporting position, and a deposition on an inner wall of the chamber during substrate processing. Wall-shaped shield means (a wa) for shielding the inner wall of the chamber to prevent
ll-like shield means) and a material provided on the substrate support for supporting the substrate with a gap between the substrate and the substrate support, and the material deposited on the substrate support being the substrate. Spacer means for preventing adhesion to the substrate, the wall-shaped shield means further includes a predetermined distance from an edge of the substrate support, and the substrate mounting position.
a vertical flange located at a predetermined distance from the edge of the substrate support near the periphery of the unting position) and detached near the edge of the substrate by being received in the space between the flange and the substrate holder. A deposition apparatus including a downwardly disposed flange that is operably disposed and that overlaps the substrate support and the shield means to prevent deposition outside a processing region. 3. The substrate support includes positioning means provided along the periphery of the substrate, and engages with the peripheral edge of the substrate to center the substrate at a predetermined substrate mounting position. The deposition device described in. 4. The substrate support has a groove or a groove extending along the periphery of the substrate mounting position.
3. The deposition apparatus according to claim 2, further comprising :), and the deposition is performed on the substrate support around the substrate without hindering the positioning of the substrate on the substrate support. 5. The deposition apparatus according to claim 4, further comprising a positioning means that is provided in the groove or the recess and that engages with a periphery of the substrate to position the substrate at a predetermined substrate mounting position. 6. The deposition apparatus according to claim 5, wherein the positioning means includes a plurality of pins arranged at intervals along the groove or the recess. 7. A deposition apparatus for preventing deposition onto a peripheral region of a chamber during processing of a substrate, wherein a mounting portion mounted at one end of the chamber and the substrate are isolated from an inner wall of the chamber. A shield member having an isolation wall and a flange portion extending toward the lifter that moves up and down the substrate, a recess into which the flange portion of the shield member is inserted, and a substrate support member having a substrate mounting portion on which the substrate is mounted. , A deposition device comprising.