KR100307074B1 - Deposition chamber having a separator to protect target surfaces from contamination and a shutter for multi-substrates - Google Patents

Abstract

PURPOSE: A deposition chamber having a separator for preventing contamination of target surfaces and a shutter for preventing contamination of substrates for multi-component deposition is provided to increase quality of a thin film by simply solving demerits generated during working process in a physical vapor deposition equipment. CONSTITUTION: The deposition chamber having a separator for preventing contamination of target surfaces and a shutter for preventing contamination of substrates for multi-component deposition comprises a substrate holder(44) which is rotated using a driving handle(41) of the outer part of a deposition tank(45), both ends of which are fastened and closely adhered to the upper ends of the deposition tank(45) by screws, and into which a plurality of holes are perforated so as to use a plurality of substrates, wherein a substrate shaped groove having a certain depth is formed on a part to be contacted with a substrate(43) so as to fix the substrate(43) into the groove; a shutter(10) which is mounted on underneath the substrate holder(44) inside the deposition tank, and at the central part of which a screw hole is formed for mounting and dismounting a driving shaft and a cover of the deposition tank, and a deposition hole for depositing a desired material by exposing a substrate to be deposited is formed so that the shutter(10) is rotated by a driving unit(42) coupled to the driving shaft; and a separator(20) which separates two or more cathode bodies(46) so as to prevent contamination of target surfaces of the cathode bodies(46) using a lower partition, and in which a hole having a diameter slightly larger than a target diameter is perforated into an upper cover in such a way that the hole is on the line perpendicular to the target surface.

Description

Deposition chamber having a separator to protect target surfaces from contamination and a shutter for multi-substrates}

The present invention relates to a deposition tank equipped with a target surface contamination prevention divider and a substrate contamination prevention shield for plural-based deposition. In particular, the present invention can be used in a multi-element ionizer deposition apparatus, and has two cathodes. In the case of abnormal mounting, a separator and a plurality of substrates may be used at the same time to prevent the target surface of one anode from being contaminated by the ionizer generated from the target surface of the other cathode when the ion is generated. It can also deposit multiple layers on one substrate, eliminating the hassle of breaking a vacuum or exchanging targets and avoiding the deposition of unwanted materials. It relates to a device equipped with a deposition hole shutter mounted directly underneath.

In the present invention, an ion deposition apparatus technology used for research purposes has been a trend to investigate the characteristics by depositing a multi-layered thin film on one substrate.

However, when forming a multi-layered thin film using the existing equipment, there are some problems and inconveniences in the process as follows.

1) In the case where a plurality of cathode bodies are installed in the deposition tank, since there is a shield on the cathode body, a sufficient space for moving the shield to cover the target surface during deposition is required. Therefore, the diameter of the deposition tank depends on the number of cathode bodies installed. Must grow accordingly.

2) Even if the unused cathode body is closed with a shade during deposition, the ionosphere is affected by the gap between the shade and the cathode body, which contaminates the target surface.

3) In the case of using a plurality of substrates for the substrate support, since deposition is performed on all the substrates by the generated ionizer, it is difficult to deposit only on the desired substrate.

4) In case of putting the boards one by one, there is a waste of time and material because the work of breaking the vacuum and forming the vacuum again is repeated every time the substrate is changed.

An object of the present invention for solving the above problems is to simply solve the shortcomings during the work process of the physical vapor deposition equipment to improve the quality and research efficiency of the thin film, and to increase the number of cathode bodies in the same diameter deposition tank It can be installed and used efficiently, and the divider is used to completely shield between the cathode body and the cathode body to prevent contamination of the target surface of the cathode body which is not used during the deposition process, and to use multiple substrates, It is to provide equipment that prevents time and material waste while improving the efficiency of research by installing the desired material on the desired substrate without breaking the vacuum by installing a screen with a single deposition hole under the substrate support.

1 is a plan view of the shade of the present invention,

2 is a plan view of the present invention divider,

3 is a cross-sectional view of the present invention divider,

4 is an assembled cross-sectional view of a deposition tank equipped with a shade and a divider of the present invention.

<Description of the symbols for the main parts of the drawings>

(10): shade (11): screw hole

(12): hole for deposition 20: dividing

21: hole 22: top cover

23: partition 41: drive knob

42: drive device 43: substrate

44: substrate support 45: vapor deposition tank

(46): Cathode Body 47: Window

Embodiment of the present invention to achieve the object as described above and to perform the problem for eliminating the conventional defects will be described in detail in connection with the configuration and operation results in the accompanying drawings.

FIG. 1 is a shade 10 mounted directly under the substrate support 44 in the deposition tank shown in FIG. 4, and a screw hole 11 for attaching and detaching the drive shaft and the deposition tank lid to a central portion thereof, and the substrate to be deposited. Is a deposition hole 12 for depositing a desired material by exposing the material, and the material is made of a corrosion resistant material (eg, stainless steel) that has been electrolytically treated.

The shade 10 can be rotated forward and backward by 360 ° using the drive device 42 and the speed can be adjusted.

FIG. 2 is a divider 20 used to prevent contamination of the target surface of the cathode body 46, which is not operated by the ionizer during deposition.

It can be used in a deposition apparatus equipped with two or more cathode bodies 46. A hole 21 having a diameter slightly smaller than the target diameter in the upper cover 22 of the divider 20 is perpendicular to the target surface. It is drilled in and has a partition 23 as shown in FIG. 3, and the material is an electrolytically treated corrosion resistant material (for example, stainless steel).

Since the dividing 20 is located higher than the cathode body 46 (see FIG. 4), the ionizing body spreading on both sides does not contaminate the target surface mounted on the other cathode body 46 by the partition 23. Since the width of the hole 21 is smaller than the target diameter, only the ionizing region having a relatively straightness can reach the substrate.

4 is an assembled cross-sectional view of the deposition tank in which the shade 10 and the divider 20 are installed.

The substrate support 44 may be rotated by using the driving knob 41 on the outside of the deposition tank 45, and both ends of the substrate support 44 may be screwed to the top of the deposition tank 45, and a plurality of substrates 43 may be used. Several holes are drilled and the part contacting the substrate 43 has a groove having a little depth in the shape of the substrate 43 so that a part of the substrate 43 touching the substrate support 44 can be fixed to the groove. The shade 10 was mounted directly below the substrate support 44.

The distance between the target surface and the substrate 43 is adjustable by moving the position of the cathode body 46 up and down, and the dividing 20 is positioned above the cathode body 46, and the deposition tank 45 in a vacuum state. The window 47 for checking the internal situation of the) and the position of the substrate 43 during the deposition operation is provided.

When four cathode bodies 46 are mounted in the deposition tank 45 and four metal targets such as Cu, Ti, Al, and Ag are used in each of the cathode bodies 46 with reference to the accompanying drawings, Look at the embodiment of the deposition operation after attaching the) and the divider 20 in detail.

Example 1

When one substrate is used and Ag, Al, Ti, and Cu are sequentially deposited on the substrate 43 to form a multilayer film of Cu / Ti / Al / Ag / substrate, the substrate 43 is fixed to the substrate support 44. After mounting the shade 10 on the top of the deposition tank 45, the Cu, Ti, Al, Ag targets are installed on the cathode body 46 and shielded between the cathode body 46 with a divider 20 The substrate support 44 is rotated by the driving knob 41 to adjust the substrate 43 and the Ag target to face each other.

At this time, after confirming that the shade 10 is in the state of covering the substrate, it enters the vacuum operation.

In order to form a high vacuum, open the coarse adjustment valve between the deposition tank and the rotary vacuum machine, lower the vacuum in the deposition tank to 4m Torr using the rotary vacuum machine, lock the coarse control valve, open the face control valve, and then A high vacuum vacuum is used to maintain the interior of the deposition tank in a high vacuum state.

First, the power source is connected to the cathode body 46 in which the Ag target is installed to form an ionizer. 43) and the target face to face through the deposition hole 12 of the shade 10.

After the deposition for a desired time, the applied power is cut off, the shade 10 is moved slightly to cover the substrate 43, and a voltage is applied to the cathode body 46 provided with the Al target.

When it is determined that the surface of the Al target has been cleaned to some extent, the substrate support 44 is rotated by using the driving knob 41 for the substrate support 44 so that the substrate 43 and the target face each other, and the shade 10 is moved. It rotates to expose the board | substrate 42, and vapor deposition is performed.

After Al deposition is finished, the substrate is covered with a shade 10 and the applied power is cut off. After the power is connected to the cathode 46 provided with the Ti target, and the surface of the Ti target is determined to be cleaned to some extent, the substrate support 44 Rotate to position the substrate and the Ti target to face, rotate the shade 10 to expose the substrate 43 and then deposit.

After the Ti deposition is completed, the substrate is covered with the shade 10 and the connected power is disconnected. When the voltage is applied to the cathode 46 provided with the Cu target and the surface of the Cu target is cleaned to some extent, the substrate support 44 is removed. The substrate is rotated to face the Cu target, and the shade 10 is rotated to expose the substrate 43 and then deposited.

Example 2

Four substrates 43 (substrate 1, substrate 2, substrate 3 and substrate 4) are used, Ti / Cu on substrate 1, Cu / Al on substrate 2, Cu / Ti / Al on substrate 3, Cu / on substrate 4 In the case of forming Ti / Al / Ag, the process of forming a vacuum is the same as in Example 1 which can be implemented.

After connecting the power supply to the cathode 46, the Ti target is installed to form an ionizer, and rotate the substrate support 44 so that the substrate 1 facing the Ti target, and then move the shade 10 to move the shade 10 The substrate 1 is opened through the deposition hole 12 to deposit Ti.

At this time, the board | substrate 2, the board | substrate 3, and the board | substrate 4 are in the state completely interrupted | blocked by the surface of the shade 10.

After the shield 10 is moved slightly to shield the substrate 1 from the ionizer, the power is cut off and the power source is connected to the cathode 46 provided with the Cu target to generate an ion, and the substrate support 44 is rotated to rotate the substrate 1. After making it face to the target, moving the shade 10 to open the substrate 1 through the deposition hole 12 of the shade 10 to deposit Cu.

Subsequently, desired multilayer films are deposited on the substrates 2, 3, and 4 in the same manner.

Example 3

In the case where five or more substrates 43 are used and five or more layers are put on one substrate 43 in a deposition tank to which five or more cathode bodies 46 are attached, the number of substrates is five or more. The same procedure is sequentially performed according to the deposition process of Example 1 and Example 2.

In the present invention as described above, since the screen 10 installed with one deposition hole 12 is formed on the top of the deposition tank 45, the screen 10 and the screen on the cathode body 46, as in the existing equipment Since it is not necessary to secure the space necessary for the movement of the leakage (leak) can be reduced and the diameter of the deposition tank 45 can be made smaller than the conventional deposition tank 45 can reduce the manufacturing cost.

In addition, since a larger number of cathode bodies 46 can be installed in the deposition tanks 45 having the same diameter, they are not only efficient for depositing multilayer thin films, but each substrate can be used without breaking the vacuum even if a plurality of substrates 43 are used. Since only 43 desired materials can be deposited for each (43), there is an advantage that can be deposited under different conditions.

A negative electrode body which is not used by an ionizer by the negative electrode body 46 in use by providing a divider 20 provided with partitions 31 as many as the number of negative electrode bodies 46 between the negative electrode bodies 46 is used. There is also an effect of preventing the target surface of (46) from being contaminated.

Claims (1)

In the ion deposition apparatus, It rotates using the drive knob 41 outside the deposition tank 45, and screwed both ends to the top of the deposition tank 45 to be in close contact with each other, a plurality of holes 43 are drilled and the substrate ( 43 is a part of the substrate support 44 for fixing the substrate 43 by making a groove having a predetermined depth in the shape of the substrate 43; Is mounted directly under the substrate support 44 in the deposition tank, a screw hole 11 for mounting and detachment of the drive shaft and the deposition tank lid in the center portion is formed, exposing the substrate to be deposited to deposit the desired material A shade 10 which is formed by a deposition hole 12 for rotation by the driving device 42 coupled with the driving shaft; The two or more cathode bodies 46 are separated and separated to prevent contamination of the target surface of the non-operating cathode body 46 using the lower partition 23, and the upper lid 22 has a size slightly smaller than the target diameter. A divider 20 in which a hole 21 having a diameter of is drilled on a vertical line with a target surface; When two or more cathode bodies 46 are mounted, the target surface of one cathode body is prevented from being contaminated by the ionizers generated on the target surface of the other anode body when the ionizer is generated, and a plurality of substrates can be used at the same time. A deposition tank having a target surface contamination prevention divider and a substrate contamination prevention shield for plural-based deposition, characterized in that a multilayer film can be deposited on a substrate.