JPH0622224B2 - パーティクルが少ないか又は含まない液化二酸化炭素の供給 - Google Patents

パーティクルが少ないか又は含まない液化二酸化炭素の供給

Info

Publication number
JPH0622224B2
JPH0622224B2 JP63051870A JP5187088A JPH0622224B2 JP H0622224 B2 JPH0622224 B2 JP H0622224B2 JP 63051870 A JP63051870 A JP 63051870A JP 5187088 A JP5187088 A JP 5187088A JP H0622224 B2 JPH0622224 B2 JP H0622224B2
Authority
JP
Japan
Prior art keywords
particles
liquefied
few
gas
cleaned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63051870A
Other languages
English (en)
Other versions
JPH01225322A (ja
Inventor
晃三 守屋
正 大勝
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Osaka Oxygen Industries Ltd
Original Assignee
Osaka Oxygen Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osaka Oxygen Industries Ltd filed Critical Osaka Oxygen Industries Ltd
Priority to JP63051870A priority Critical patent/JPH0622224B2/ja
Priority to US07/308,856 priority patent/US4972677A/en
Priority to EP89302176A priority patent/EP0332356B1/en
Priority to DE8989302176T priority patent/DE68906293T2/de
Publication of JPH01225322A publication Critical patent/JPH01225322A/ja
Publication of JPH0622224B2 publication Critical patent/JPH0622224B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0064—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes
    • B08B7/0092—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by temperature changes by cooling
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C7/00—Methods or apparatus for discharging liquefied, solidified, or compressed gases from pressure vessels, not covered by another subclass
    • F17C7/02—Discharging liquefied gases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2205/00—Vessel construction, in particular mounting arrangements, attachments or identifications means
    • F17C2205/03—Fluid connections, filters, valves, closure means or other attachments
    • F17C2205/0302—Fittings, valves, filters, or components in connection with the gas storage device
    • F17C2205/0341—Filters
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2221/00—Handled fluid, in particular type of fluid
    • F17C2221/01—Pure fluids
    • F17C2221/013—Carbone dioxide
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/01—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the phase
    • F17C2223/0146—Two-phase
    • F17C2223/0153—Liquefied gas, e.g. LPG, GPL
    • F17C2223/0161—Liquefied gas, e.g. LPG, GPL cryogenic, e.g. LNG, GNL, PLNG
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/03—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by the pressure level
    • F17C2223/033—Small pressure, e.g. for liquefied gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2223/00—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel
    • F17C2223/04—Handled fluid before transfer, i.e. state of fluid when stored in the vessel or before transfer from the vessel characterised by other properties of handled fluid before transfer
    • F17C2223/042—Localisation of the removal point
    • F17C2223/046—Localisation of the removal point in the liquid
    • F17C2223/047—Localisation of the removal point in the liquid with a dip tube
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2225/00—Handled fluid after transfer, i.e. state of fluid after transfer from the vessel
    • F17C2225/01—Handled fluid after transfer, i.e. state of fluid after transfer from the vessel characterised by the phase
    • F17C2225/0146—Two-phase
    • F17C2225/0153—Liquefied gas, e.g. LPG, GPL
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2225/00—Handled fluid after transfer, i.e. state of fluid after transfer from the vessel
    • F17C2225/04—Handled fluid after transfer, i.e. state of fluid after transfer from the vessel characterised by other properties of handled fluid after transfer
    • F17C2225/042—Localisation of the filling point
    • F17C2225/043—Localisation of the filling point in the gas
    • F17C2225/044—Localisation of the filling point in the gas at several points, e.g. with a device for recondensing gas
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
    • F17C2227/03—Heat exchange with the fluid
    • F17C2227/0302—Heat exchange with the fluid by heating
    • F17C2227/0304—Heat exchange with the fluid by heating using an electric heater
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
    • F17C2227/03—Heat exchange with the fluid
    • F17C2227/0337—Heat exchange with the fluid by cooling
    • F17C2227/0341—Heat exchange with the fluid by cooling using another fluid
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2227/00—Transfer of fluids, i.e. method or means for transferring the fluid; Heat exchange with the fluid
    • F17C2227/03—Heat exchange with the fluid
    • F17C2227/0367—Localisation of heat exchange
    • F17C2227/0388—Localisation of heat exchange separate
    • F17C2227/039—Localisation of heat exchange separate on the pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F17—STORING OR DISTRIBUTING GASES OR LIQUIDS
    • F17C—VESSELS FOR CONTAINING OR STORING COMPRESSED, LIQUEFIED OR SOLIDIFIED GASES; FIXED-CAPACITY GAS-HOLDERS; FILLING VESSELS WITH, OR DISCHARGING FROM VESSELS, COMPRESSED, LIQUEFIED, OR SOLIDIFIED GASES
    • F17C2265/00—Effects achieved by gas storage or gas handling
    • F17C2265/01—Purifying the fluid
    • F17C2265/012—Purifying the fluid by filtering

Description

【発明の詳細な説明】 発明の分野 本発明は、パーティクルの少ない液化炭酸ガスの供給方
法及びその液化炭酸ガスを使用しての被洗浄物の表面上
のパーティクル等を除去する方法に関する。
発明が解決すべき課題 半導体工業に使用されるウェーハーは、最近は超小型化
され、線と線との間隔はサブミクロン以下となってい
る。従って、ウェーハー上にパーティクルが存在すると
短絡を起こす。それがためウェーハーを排除しなければ
ならない。
液体ＣＯ２は溶剤としてすぐれた性質を有し、被洗浄物
の表面のパーティクル等を容易に除去することができる
ことは知られている。しかしながら、本発明者は市販の
５ナイン（Ｎ）高純度液化ＣＯ２中には以下の表−１に
示すような多量のパーティクルが混入していることを発
見した。
このようなＣＯ２のドライアイススノーによるウェーハ
ー等洗浄では、パーティクルを除去すると同時にパーテ
ィクルを新たに付着させてしまう為使用できなかった。
課題を解決すべき手段 一般に液化ＣＯ２中のパーティクルはフィルターで除去
するのが一般的である。液化ＣＯ２を液体のままフィル
ターに通じてみた結果を表−２に示す。すなわち液化Ｃ
Ｏ２中のパーティクルはフィルターではほとんど除去で
きない。
そこで本発明者は液化ＣＯ２を蒸発させた後ガス状にて
フィルターを通した結果を表−３に示す。液化ＣＯ２と
は異なり、ＣＯ２ガスの状態イはパーティクルをほぼ 1
00％除去できることを発見した。
すなわち液化ＣＯ２を一度蒸発させた後ＣＯ２ガスとし
てフィルターに通じパーティクルをほぼ100 ％除去した
後、再液化すればパーティクルの少い液化ＣＯ２を得る
ことが出来る。
本発明は上記発見に基づいてなされた。
本発明は、液化ＣＯ２を蒸発させ、ＣＯ２ガスとした
後、そのＣＯ２ガスをフィルターに通しＣＯ２ガス中の
パーティクルを除去した後、冷却して再液化を行ない、
そのパーティクルの少い又はパーティクルを含まない液
化ＣＯ２をノズルより噴出させ、微細なドライアイスス
ノーを含むＣＯ２ガス及び／又は液化ＣＯ２を吹きつけ
ることにより被洗浄物の表面上のパーティクル等を除去
する方法に関する。
本発明の方法を第１図により説明する。第１図にパーテ
ィクルの少い液化炭酸ガスの供給方法を示す。
液化ＣＯ２貯槽１よりの液化ＣＯ２は蒸発器２によりＣ
Ｏ２ガスとなりフィルター３によりパーティクルを除去
された後、液化器４により再液化されニードル弁５、フ
ィルター６を通りノズル７より噴出された微細なドライ
アイススノーとなりウェーハー等上に吹きつけられ、ウ
ェーハー等上のパーティクルを除去する。
フィルター３以後の配管、弁、ノズルはパーティクルの
発生を抑える為、内面が平滑で清浄な電解又は化学研磨
管を使用する。
ＣＯ２貯槽１の代りに、市販のＣＯ２収用容器（ガス取
り用又は液取り用）を使用しても良い。
本発明において被洗浄物とはウェーハー、コンパクトデ
ィスク、レーザーディスク、レンズ等である。
一般に、ウェーハー等の表面に液体ＣＯ２を吹きつける
とウェーハー等に急冷され表面に露ができて、ウェーハ
ー等は水で濡れる。これはこのような水を乾燥するのに
時間がかかり、又このような水分の附着によってウェー
ハー等の表面が汚れる可能性もある。このような不備を
避けるためにウェーハー等をＮ２雰囲気の室に置き、液
化ＣＯ２を吹きかけても良い。又ウェーハー等を電気ヒ
ーターによって加熱しても良い。上記両方の手段を同時
に採用しても良い。
このパーティクルの少い液化ＣＯ２を清浄な容器に充填
し供給すれば同一の目的を達成できるように思われる
が、この場合液化ＣＯ２保存タンクの内面を複合電解研
磨した後超純水洗浄をする必要があり、容器の製作に多
くの費用がかかり実際的でない。第１図に示す様にウェ
ーハー洗浄を行う現場に液化器４を設置しそのまま液化
ＣＯ２を供給すれば費用もかかわらず実際的である。液
化器４を電解研磨管にて製作するのは容易である。本方
法によりウェーハー洗浄等に使用するパーティクルの少
い液化ＣＯ２を現場にて安く供給できる。
【図面の簡単な説明】
第１図は本発明方法を実施するための好ましい態様の装
置を示す。 １……液化ＣＯ２貯槽、２……ＣＯ２蒸発器 ３……フィルター、４……液化器 ５……ニードル弁、６……フィルター ７……ノズル

Claims (4)

    【特許請求の範囲】
  1. 【請求項１】液化ＣＯ２を蒸発させ、ＣＯ２ガスとした
    後、そのＣＯ２ガスをフイルターに通してＣＯ２ガス中
    のパーティクルを除去した後、冷却して再液化すること
    によって得られたパーティクルの少ない又はパーティク
    ルを含まない液化ＣＯ２を使用して被洗浄物の表面上の
    パーティクル等を除去する方法。
  2. 【請求項２】特許請求の範囲第１項記載のパーティクル
    の少ない又はパーティクルを含まない液化ＣＯ２をノズ
    ルより噴出させ、ドライアイススノーを含むＣＯ２ガス
    及び／又は液化ＣＯ２を吹きつけることにより被洗浄物
    の表面上のパーティクル等を除去する方法。
  3. 【請求項３】その被洗浄物が窒素雰囲気中で保持された
    状態でドライアイススノーを吹きつける特許請求の範囲
    第２項記載の方法。
  4. 【請求項４】その被洗浄物が加熱された状態で、ドライ
    アイススノーを吹きつける特許請求の範囲第２又は３項
    記載の方法。
JP63051870A 1988-03-05 1988-03-05 パーティクルが少ないか又は含まない液化二酸化炭素の供給 Expired - Lifetime JPH0622224B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63051870A JPH0622224B2 (ja) 1988-03-05 1988-03-05 パーティクルが少ないか又は含まない液化二酸化炭素の供給
US07/308,856 US4972677A (en) 1988-03-05 1989-02-09 Method of cleaning wafers or the like
EP89302176A EP0332356B1 (en) 1988-03-05 1989-03-03 Supply of carbon dioxide
DE8989302176T DE68906293T2 (de) 1988-03-05 1989-03-03 Zufuhr von kohlendioxid.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63051870A JPH0622224B2 (ja) 1988-03-05 1988-03-05 パーティクルが少ないか又は含まない液化二酸化炭素の供給

Publications (2)

Publication Number Publication Date
JPH01225322A JPH01225322A (ja) 1989-09-08
JPH0622224B2 true JPH0622224B2 (ja) 1994-03-23

Family

ID=12898914

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63051870A Expired - Lifetime JPH0622224B2 (ja) 1988-03-05 1988-03-05 パーティクルが少ないか又は含まない液化二酸化炭素の供給

Country Status (4)

Country Link
US (1) US4972677A (ja)
EP (1) EP0332356B1 (ja)
JP (1) JPH0622224B2 (ja)
DE (1) DE68906293T2 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001248963A (ja) * 2000-01-05 2001-09-14 Boc Group Inc:The 加圧された高純度液体二酸化炭素流を生成する方法及び装置
US11981995B2 (en) 2019-10-31 2024-05-14 Semes Co., Ltd. Chemical supply apparatus, method for removing particles from chemical, nozzle unit, and substrate treating apparatus

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH037984U (ja) * 1989-06-06 1991-01-25
US5179840A (en) * 1989-10-16 1993-01-19 The Boc Group Plc Cryogenic treatment methods
US5062898A (en) * 1990-06-05 1991-11-05 Air Products And Chemicals, Inc. Surface cleaning using a cryogenic aerosol
US5140822A (en) * 1991-02-08 1992-08-25 The Coca-Cola Company Method and apparatus for chilling and carbonating a liquid using liquid carbon dioxide
US5470154A (en) * 1991-04-18 1995-11-28 Osaka Sanso Kogyo Ltd. Method of cleaning the reflector mirror in an optical dew point meter and an optical dew point meter equipped with a cleaning device
US5482371A (en) * 1991-04-18 1996-01-09 Osaka Sanso Kogyo Ltd. Method and apparatus for measuring the dew point and/or frost point of a gas having low water content
JP2863663B2 (ja) * 1991-04-18 1999-03-03 大阪酸素工業株式会社 光学式露点計の反射鏡の洗浄方法及び洗浄装置付き光学式露点計
US5315793A (en) † 1991-10-01 1994-05-31 Hughes Aircraft Company System for precision cleaning by jet spray
US5294261A (en) * 1992-11-02 1994-03-15 Air Products And Chemicals, Inc. Surface cleaning using an argon or nitrogen aerosol
US5354384A (en) * 1993-04-30 1994-10-11 Hughes Aircraft Company Method for cleaning surface by heating and a stream of snow
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DE68906293T2 (de) 1993-08-12
EP0332356A3 (en) 1990-04-04
EP0332356A2 (en) 1989-09-13
US4972677A (en) 1990-11-27
DE68906293D1 (de) 1993-06-09
EP0332356B1 (en) 1993-05-05
JPH01225322A (ja) 1989-09-08

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