JPH0617082Y2 - コンタクトプローブユニットにおけるコンタクトピンの廻り止め構造 - Google Patents
コンタクトプローブユニットにおけるコンタクトピンの廻り止め構造Info
- Publication number
- JPH0617082Y2 JPH0617082Y2 JP4862589U JP4862589U JPH0617082Y2 JP H0617082 Y2 JPH0617082 Y2 JP H0617082Y2 JP 4862589 U JP4862589 U JP 4862589U JP 4862589 U JP4862589 U JP 4862589U JP H0617082 Y2 JPH0617082 Y2 JP H0617082Y2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- contact pin
- sleeve
- contact probe
- probe unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000523 sample Substances 0.000 title claims description 40
- 230000002265 prevention Effects 0.000 title 1
- 238000003780 insertion Methods 0.000 claims description 13
- 230000037431 insertion Effects 0.000 claims description 12
- 239000012212 insulator Substances 0.000 claims description 7
- 238000005259 measurement Methods 0.000 description 6
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 229910001369 Brass Inorganic materials 0.000 description 2
- 239000010951 brass Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000010137 moulding (plastic) Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002250 progressing effect Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical group [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Landscapes
- Measuring Leads Or Probes (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4862589U JPH0617082Y2 (ja) | 1989-04-25 | 1989-04-25 | コンタクトプローブユニットにおけるコンタクトピンの廻り止め構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4862589U JPH0617082Y2 (ja) | 1989-04-25 | 1989-04-25 | コンタクトプローブユニットにおけるコンタクトピンの廻り止め構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0327360U JPH0327360U (enExample) | 1991-03-19 |
| JPH0617082Y2 true JPH0617082Y2 (ja) | 1994-05-02 |
Family
ID=31565602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4862589U Expired - Lifetime JPH0617082Y2 (ja) | 1989-04-25 | 1989-04-25 | コンタクトプローブユニットにおけるコンタクトピンの廻り止め構造 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0617082Y2 (enExample) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016125943A (ja) * | 2015-01-06 | 2016-07-11 | オムロン株式会社 | ケルビンプローブ、および、これを備えたケルビン検査ユニット |
-
1989
- 1989-04-25 JP JP4862589U patent/JPH0617082Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0327360U (enExample) | 1991-03-19 |
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