JPH0595052U - Heat sink - Google Patents

Abstract

(57) [Abstract] [Purpose] When disposing of electronic equipment, use a general tool to remove the heat sink and the heat sink mounting leg from the fitting / caulking connection to easily separate the heat sink from the electronic board. The material of the heat sink can be reused. [Structure] A recess 5a that allows a general tool to be easily inserted into a gap in contact with the heat sink 3 on the heat sink mounting leg 5 that is fitted and caulked.
By providing the tool, the tool can be inserted into the gap where the radiator plate 3 and the radiator plate mounting leg are in contact with each other through this portion 5a, and by prying the inserted tool, the radiator plate 3 and the radiator plate mounting leg 5 can be fitted together. The heat radiating plate 3 and the heat radiating plate mounting leg 5 can be separated by removing the caulking connection, and the effect of easily separating the heat radiating plate 3 from the electronic board 7 is provided.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 This invention aims at easily disassembling and disassembling the heat sink, which is soldered to the electronic board using the heat sink mounting legs, from the electronic board using a general tool when disposing of the electronic equipment. The present invention relates to a heat radiating plate capable of reusing resources of the radiated heat radiating plate.

[0002]

[Prior Art]

 In recent years, in electronic equipment composed of electronic boards on which electronic components are mounted with high density and high density, in order to prevent malfunction and destruction of semiconductor elements due to heat, Sufficient heat dissipation of the semiconductor element that causes heat generation cannot be ignored, and as a general heat dissipation plate, an extruded heat dissipation plate made of aluminum, which has good thermal conductivity and good workability, is often used. There is.

Conventionally, as shown in FIG. 3, a semiconductor element 10 that requires heat dissipation is fixed to a heat dissipation plate 30 with screws 40 via an insulating sheet 20 such as mica, and is directly soldered to an electronic board 70. A heat sink 30 made of aluminum or the like that cannot be fixed is provided with one or more metal plate-like heat sink mounting legs 50 that can be solder-welded by fitting / caulking connection 30a at one or more places. It has been customary to fix the electronic substrate 70 by soldering it to the electronic substrate 70.

[0004]

[Problems to be solved by the device]

 However, considering the disassembly and disassembly of parts when disposing of electronic boards of electronic devices composed of composite materials, the heat dissipation fixed by the heat dissipation plate mounting legs that was attached by conventional fitting and caulking When disposing of the electronic device, the semiconductor element fixed to the heat sink can be removed with a general tool by using a general tool to remove the screw that locks the semiconductor element to the heat sink. It is difficult to separate and disassemble from the electronic board by using it, and the heat sink that cannot be removed must be discarded together with other electronic components together with the electronic board, and the material of the heat sink can be reused. I had a problem that I could not.

In view of the above problems, the present invention has a shape in which a general tool can be easily inserted into a gap in contact with the heat sink above the heat sink mounting leg, and through this shape, the tool can be mounted on the heat sink and the heat sink mounting leg. The heatsink can be easily separated from the electronic board by inserting it in the gap where the It is intended to provide a heat sink mounting leg for the purpose of reusing the plate material.

[0006]

[Means for Solving the Problems]

 The heat dissipation plate mounting leg of the present invention is provided with a shape that allows a general tool to be easily inserted into a gap formed by contacting the heat dissipation plate on the heat dissipation plate mounting leg, and the tool is inserted into this space and the heat dissipation plate is twisted by prying the tool. The heatsink mounting legs are fitted and caulked so that the heatsink can be separated from the electronic board and disassembled.

[0007]

[Action]

 According to the heat dissipation plate mounting leg of the present invention, by providing the heat dissipation plate mounting leg with a shape that allows a general tool to be easily inserted into a gap in contact with the heat dissipation plate, a general tool can be inserted through this shape to the heat dissipation plate and the heat dissipation plate mounting leg. It is possible to insert the heat sink into the gap where it touches, and by prying the general tool inserted into this gap, the heat sink and the heat sink mounting legs are removed from the electronic board by fitting and caulking the heat sink. It becomes possible to easily separate, and it is possible to reuse the separated material of the heat sink.

[0008]

【Example】

 Hereinafter, the heat sink of the present invention will be described with reference to the drawings. FIG. 1 shows an embodiment of the present invention, which schematically shows the configuration thereof. FIG. 2 shows a process of removing the heat sink from the electronic board in the present invention.

In FIG. 1, a semiconductor element 1 is fixed to a heat radiating plate 3 made of aluminum and extruded through an insulating sheet 2 with a screw 4 having a small diameter. The heat dissipation plate 3 is caulked with the heat dissipation plate mounting legs 5 provided at the front and rear two places in the figure in the U-shaped grooves 3a provided on both sides. The heat sink mounting legs 5 are respectively provided at two places near the portion where the heat sink 3 is fitted with the groove portion 3a so that a flat-blade screwdriver 6 of a general tool can be easily inserted into a gap where the heat sink 3 and the heat sink mounting leg 5 are in contact with each other. A flat fuchlin-shaped recess 5a is provided with a wide gap. The heat sink 3 is fixed by soldering the heat sink mounting legs 5 to the electronic board 7.

The case where the heat sink 3 having the heat sink mounting legs 5 of the present invention constructed on the electronic board 7 as described above is separated and disassembled from the electronic board 7 will be described below with reference to FIGS. 1 and 2. The invention will be described.

When the heat dissipation plate 3 configured as shown in FIG. 1 is separated and disassembled from the electronic board 7, first, the small-diameter screw 4 for fixing the semiconductor element 1 is removed using a general tool 8 such as a screwdriver. 1 and the heat sink 3 are separated. Next, insert the general tool 6 such as a flat-blade screwdriver into the fuchlin-shaped recess 5a provided by partially widening the gap between the heat sink 3 and the heat sink 3 provided on the heat sink mounting leg 5. Then, by prying the tool 6, it is possible to remove the fitting / caulking connection between the heat dissipation plate 3 and the heat dissipation plate mounting leg 5. By repeating this for another portion 5a, the heat dissipation plate 3 and the heat dissipation plate mounting leg 5 can be separated. By performing the same operation on the radiator plate mounting leg on the opposite side of the radiator plate 3 in the drawing, the radiator plate 3 can be easily separated from the electronic board 7.

[0012]

[Effect of the device]

 As described above, according to the present invention, by providing the heat dissipation plate mounting leg with a shape that allows a general tool to be easily inserted into a gap in contact with the heat dissipation plate, a tool can be used to connect the heat dissipation plate and the heat dissipation plate mounting leg through this shape. It is possible to insert the heat sink into the contacting gap, and by prying this tool, the heat sink can be easily separated from the electronic board by removing the fitting and crimping of the heat sink and the heat sink mounting leg. is there. In addition, it is possible to reuse the separated heat sink material.

[Brief description of drawings]

FIG. 1 is a diagram of a heat sink attached to an electronic board according to an embodiment of the present invention.

FIG. 2 is a view of separating a heat sink from an electronic board according to an embodiment of the present invention.

FIG. 3 is a diagram of a heat sink fixed to an electronic board using a conventional heat sink mounting leg.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 3 Heat sink 5 Heat sink mounting leg 5a Fukulin-shaped recess 6 Slotted screwdriver 7 Electronic board

Claims (1)

[Scope of utility model registration request] 1. A heat dissipation plate on which an electronic component to be dissipated is mounted, and a heat dissipation plate mounting leg which is fixed by soldering to an electronic board and has a recess for allowing a tool to be inserted are integrally combined. The heat sink plate is characterized in that a gap allowing insertion of a tool is provided on a surface where the heat sink plate and the heat sink plate mounting leg come into contact with each other.