JP2006179610A - Heat sink fixing structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for surely fixing a heat sink without any change of pattern wiring on a substrate using a heat sink fixing member. <P>SOLUTION: The heat sink fixing structure is provided with a board 2, an integrated circuit 3, a heat sink 1, a heat sink fixing member 4 for fixing the heat sink 1, a small-screw 5 for fixing the heat sink 1 by screwing the heat sink fixing member 4 to the board 2, and a hole 6 for screwing formed to the heat sink fixing member 4. A plurality of patterns are guided from many groups of pins of an integrated circuit 3 on the board 2, and many patterns are also closely formed on the board 2 in the shape of cross around the integrated circuit 3. In the four corners in the outside of the cross-shape on the board 2, the patterns are roughly formed and the holes 7 for screwing are also formed to the two corners among four corners of the integrated circuit 3 in order to fix the heat sink 1. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a heat sink fixing structure, and more particularly, to a heat sink fixing structure including a mechanism for securely fixing a heat sink to an integrated circuit without being affected by a pattern wiring on a substrate.

Conventionally, a heat sink fixing structure for fixing a heat sink mounted on an integrated circuit to a substrate is known. (For example, see Patent Document 1 and Patent Document 2)
The above-mentioned Patent Document 1 is provided with a protruding edge that horizontally protrudes outward from at least a pair of opposite edges of the bottom surface of the heat sink, and a groove is formed on the protruding edge over the entire length in the length direction. Place the heat sink on the semiconductor unit installed on the substrate and fold the legs that are urged outward or inward on both sides. There is disclosed a structure that is fixed together with the semiconductor unit by fitting into the premises of the heat radiating plate protruding edge and inserting and fitting the leading ends of both legs of the clip into holes formed at predetermined positions of the substrate.

Further, in Patent Document 2, a simple spring clip is used for an attachment device (socket, frame, etc.) for fixing the heat sink to the device package, and both ends of the clip protruding from the heat sink are used. A structure is disclosed in which a heat sink is fixed to an attachment device that supports an integrated circuit.
Noto 3087769 Japanese Patent Laid-Open No. 07-153879

  However, in the structure disclosed in Patent Document 1, a protruding edge that horizontally protrudes outward from at least a pair of opposite edges of the bottom surface of the heat sink is provided, and the protruding edge has a groove extending over the entire length in the length direction. Therefore, there is a problem that it takes time for processing. In addition, when there is a lot of pattern wiring on the substrate, it is necessary to provide a space on the substrate for fixing the horizontally protruding protrusion with a clip, and the pattern wiring must be changed. was there.

  Further, in the structure disclosed in Patent Document 2, in order to fix the integrated circuit, a mounting frame is required in addition to the spring clip. For this reason, when fixing a heat sink to an integrated circuit of various sizes, a mounting frame must be separately prepared in addition to the heat sink and the spring clip, which is costly and troublesome for processing. There is a point. In addition, since the shaft portion of the spring clip for fixing the heat radiating plate has an elongated structure, there remains anxiety about the certainty of fixing the integrated circuit and the heat radiating plate.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a structure capable of securely fixing a heat sink without changing the wiring of a pattern on a substrate. .

  Another object of the present invention is to securely fix the heat sink to the integrated circuit with the minimum number of components.

In order to solve the above problems, according to one aspect of the present invention, an integrated circuit having a large number of pin groups on four sides of a rectangular parallelepiped and a pattern drawn from the large number of pin groups are mixed in a cross shape with the integrated circuit as a center. A substrate on which the integrated circuit is formed, and a pattern is formed sparsely at the four corners that are formed together and deviated from the cross shape, and aluminum or aluminum mounted on the integrated circuit to cool the integrated circuit A heat sink fixing structure comprising a heat sink having a plurality of parallel fins made of an alloy material, and a heat sink fixing member made of an iron plate for fixing the heat sink to the substrate. The plate portion is fitted in the groove of the parallel fin, has a thickness of 1.5 mm or more, and is formed with end plate portions extending in opposite directions at right angles to both ends of the center plate portion, Two-stage bending processing is applied to each tip of the plate portion, a tip plate portion that can be screwed to the substrate is provided in parallel with the end plate portion, and a screw-fastening hole is formed, the screw-fastening hole Are combined with screw fixing holes provided at two diagonal corners out of the four corners, and are screwed to the substrate.

  The aluminum or aluminum alloy material includes a heat radiating plate made of a metal material having a thermal conductivity equal to or higher than that of aluminum.

  The iron plate includes a heat radiating plate fixing member made of a metal material having strength equal to or higher than that of the iron plate.

  According to the heat sink fixing structure according to the present invention, screw fixing holes are provided at two corners located diagonally out of the portions where the pattern of the four corners deviating from the cross shape is sparse, and the heat sink fixing member is mounted on the substrate. Secure the heat sink with screws. That is, the heat sink can be fixed without changing the pattern on the substrate. The heat sink fixing member is made of an iron plate having a thickness of about 1.5 mm or more, and can securely fix the heat sink and the integrated circuit in the vertical direction with respect to the substrate. Moreover, since the heat sink fixing member has end plate portions extending in opposite directions at right angles to both ends of the center plate portion, the heat sink can be positioned in the horizontal direction with respect to the substrate. Further, since the heat sink fixing member is screwed to the substrate, and the heat sink is grounded to the housing-side bottom chassis located under the substrate through the screw, static electricity of the heat sink and the heat sink fixing member can be removed.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is a perspective view for explaining a heat sink fixing structure when the heat sink 1 is attached to the integrated circuit 3 on the substrate 2. The heat radiating plate is a small heat radiating device for radiating and cooling the heat emitted from the integrated circuit mounted on the substrate. The present invention is used to fix a heat sink to a substrate. This heat sink fixing structure includes a substrate 2, an integrated circuit 3, a heat sink 1 having a plurality of parallel fins, and a heat sink 1. A heat sink fixing member 4 for fixing the heat sink, a screw for fixing the heat sink 1 by fixing the heat sink fixing member 4 to the substrate 2, and a screw fixing hole 6 formed in the heat sink fixing member 4. And screw fixing holes 7 facing the screw holes 6 formed on the substrate 2.

  The heat radiating plate 1 is made of a heat conductive material of aluminum or aluminum alloy, and has a structure in which a plurality of fins are arranged in parallel at regular intervals. Since the structure of the heat radiating plate 2 is not complicated, it is easy to process various sizes according to the size of the integrated circuit 3 and the heat radiation amount of the integrated circuit 3.

  The heat radiating plate 1 is desirable from the viewpoint that the heat conductive material of aluminum or aluminum alloy is lightweight, but may be a metal material having a heat conductivity equal to or higher than that of aluminum.

  The heat sink fixing member 4 has a center plate portion 4a and end plate portions 4b extending in opposite directions at right angles to both ends of the center plate portion 4a. A two-stage bending process is performed using a pressing process, and a tip plate portion 4c that can be screwed to the substrate 2 is provided in parallel to the end plate portion 4b. Is formed.

  When fixing the heat radiating plate, the center plate portion 4a of the heat radiating plate fixing member 4 is fitted into the groove of the parallel fin of the heat radiating plate 1, and screw fixing holes 6 formed in the front end plate portion 4c are connected to the substrate 2 The screw-fixing hole 7 formed on the housing 2 and the bottom chassis 8 on the housing side located at the bottom of the substrate 2 are fixed by using a screw 5 by a screwdriver or a screwdriver capable of controlling torque.

  FIG. 2 is a plan view of the heat sink fixing member 4 attached to the substrate 2 with respect to the integrated circuit 3. The heat sink fixing member 4 is formed with end plate portions 4b extending in opposite directions at right angles to both ends of the center plate portion 4a, and positions the heat sink 1 and the substrate 2 in the direction of arrow A in the figure. It has a function.

  The heat sink fixing member 4 has a width substantially equal to the groove width of the parallel fins, and the heat sink fixing member 4 is fitted along the groove of the parallel fin located at the center of the heat sink 1. In addition to fixing the heat sink 1 to the circuit 3 in the direction perpendicular to the substrate 2, it also has a function of positioning the heat sink 1 and the heat sink fixing member 4.

  Although the heat sink fixing member 4 is an inexpensive iron plate in the embodiment, it may be a metal material having a strength equal to or higher than that of the iron plate.

  The integrated circuit 3 is fixed to the substrate 2 by a large number of pins protruding from the four side surfaces of the rectangular parallelepiped. A plurality of patterns are drawn from a large number of pins of the integrated circuit 3 on the substrate 2, and the patterns are formed in a cross shape around the integrated circuit 3.

  Patterns are formed sparsely at four corners on the substrate 2 that deviate from the cross shape. Screw fixing holes 7 are formed at two corners of the four corners of the integrated circuit 3 to fix the heat sink 1. Thereby, in order to attach the heat sink 1, the trouble of changing the wiring of the pattern is saved.

  FIG. 3 is a cross-sectional view for explaining a heat sink fixing structure when the heat sink 1 is attached to the integrated circuit 3 on the substrate 2. The radiator plate fixing member 1, the substrate 2, and the bottom chassis 8 on the housing side are completely fixed from the direction of the arrow B by screws 5. Further, since the heat sink fixing member 4 is screwed to the bottom chassis 8 of the housing, the entire system of the heat sink fixing structure is grounded to remove static electricity generated under conditions such as friction and drying. Can do.

  In the embodiment, the heat sink fixing member 4 is screwed and fixed at two corners of the four corners of the integrated circuit 3, but the end plate portion of the heat sink fixing member 4 is required when more fixing strength is required. It is also possible to add 4b and fix three places and four places.

  The embodiment disclosed this time should be considered as illustrative in all points and not restrictive. The scope of the present invention is indicated not only by the claims, but also by all modifications that can be easily understood by those skilled in the art from the present invention without being limited to the above description within the scope equivalent to the claims. Is intended to be included.

It is a perspective view explaining the heat sink fixing structure at the time of attaching a heat sink to the integrated circuit on a board | substrate. It is a top view when a heat sink fixing member is attached to a board | substrate with respect to the integrated circuit. It is sectional drawing of the heat sink fixed structure of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Heat sink 2 Board | substrate 3 Integrated circuit 4 Heat sink fixing member 4a Center plate part 4b End plate part 4c End plate part 5 Screw 6 Screw stop hole (tip plate part)
7 Screw fixing hole (substrate)
8 Bottom chassis

Claims (3)

An integrated circuit having a plurality of pin groups on four sides of a rectangular parallelepiped;
A pattern drawn from the multiple pin group is formed in a cross shape around the integrated circuit,
A substrate for mounting the integrated circuit, in which patterns are formed sparsely at four corners deviating from the cross shape,
A heat sink having a plurality of parallel fins made of aluminum or aluminum alloy material mounted on the integrated circuit to cool the integrated circuit;
A heat sink fixing member for fixing the heat sink to the substrate, comprising an iron plate,
In the heat sink fixing structure consisting of
The center plate portion of the heat sink fixing member is fitted into the groove of the parallel fin, and has a thickness of 1.5 mm or more,
End plate portions extending in opposite directions at right angles to both ends of the center plate portion are formed,
A two-stage bending process is applied to each end of the end plate portion,
A tip plate that can be screwed to the substrate is provided in parallel with the end plate,
And screw fixing holes are formed,
The screw fixing holes are combined with screw fixing holes provided at two corners located diagonally out of the four corners,
A heat sink fixing structure, wherein the substrate is screwed.
The heat sink fixing structure according to claim 1, wherein the aluminum or aluminum alloy material is a metal material having a thermal conductivity equal to or higher than that of aluminum.
  The heat sink fixing structure according to claim 1, wherein the iron plate is a metal material having a strength equal to or higher than that of the iron plate.