JPH0587180B2 - - Google Patents
Info
- Publication number
- JPH0587180B2 JPH0587180B2 JP63230612A JP23061288A JPH0587180B2 JP H0587180 B2 JPH0587180 B2 JP H0587180B2 JP 63230612 A JP63230612 A JP 63230612A JP 23061288 A JP23061288 A JP 23061288A JP H0587180 B2 JPH0587180 B2 JP H0587180B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit
- lower substrate
- cavity recess
- adhesive layer
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 claims description 60
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 238000010030 laminating Methods 0.000 claims description 5
- 239000010410 layer Substances 0.000 description 18
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000000969 carrier Substances 0.000 description 4
- 239000011888 foil Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004840 adhesive resin Substances 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23061288A JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23061288A JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0278252A JPH0278252A (ja) | 1990-03-19 |
| JPH0587180B2 true JPH0587180B2 (zh) | 1993-12-15 |
Family
ID=16910491
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23061288A Granted JPH0278252A (ja) | 1988-09-14 | 1988-09-14 | 多層プラスチックチップキャリア |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0278252A (zh) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5818114A (en) * | 1995-05-26 | 1998-10-06 | Hewlett-Packard Company | Radially staggered bond pad arrangements for integrated circuit pad circuitry |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59201449A (ja) * | 1983-03-09 | 1984-11-15 | プリンテツド・サ−キツツ・インタ−ナシヨナル・インコ−ポレイテツド | ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法 |
| JPS614456B2 (zh) * | 1975-05-23 | 1986-02-10 | Nyuujiirando Inbenshonzu Dev Oosoritei |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614456U (ja) * | 1984-06-13 | 1986-01-11 | イビデン株式会社 | プラグインパツケ−ジ基板 |
-
1988
- 1988-09-14 JP JP23061288A patent/JPH0278252A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS614456B2 (zh) * | 1975-05-23 | 1986-02-10 | Nyuujiirando Inbenshonzu Dev Oosoritei | |
| JPS59201449A (ja) * | 1983-03-09 | 1984-11-15 | プリンテツド・サ−キツツ・インタ−ナシヨナル・インコ−ポレイテツド | ヒ−トシンクを有する半導体チツプ担体パツケ−ジ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0278252A (ja) | 1990-03-19 |
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