JPH0587017B2 - - Google Patents

Info

Publication number
JPH0587017B2
JPH0587017B2 JP60218417A JP21841785A JPH0587017B2 JP H0587017 B2 JPH0587017 B2 JP H0587017B2 JP 60218417 A JP60218417 A JP 60218417A JP 21841785 A JP21841785 A JP 21841785A JP H0587017 B2 JPH0587017 B2 JP H0587017B2
Authority
JP
Japan
Prior art keywords
copper
alkali metals
wire
bonding
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP60218417A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6278862A (ja
Inventor
Sukehito Iga
Kenichi Kurihara
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to JP60218417A priority Critical patent/JPS6278862A/ja
Publication of JPS6278862A publication Critical patent/JPS6278862A/ja
Publication of JPH0587017B2 publication Critical patent/JPH0587017B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/522—
    • H10W72/5525—
    • H10W72/553—
    • H10W72/555—

Landscapes

  • Wire Bonding (AREA)
JP60218417A 1985-09-30 1985-09-30 半導体素子のボンデイング用銅線 Granted JPS6278862A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60218417A JPS6278862A (ja) 1985-09-30 1985-09-30 半導体素子のボンデイング用銅線

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60218417A JPS6278862A (ja) 1985-09-30 1985-09-30 半導体素子のボンデイング用銅線

Publications (2)

Publication Number Publication Date
JPS6278862A JPS6278862A (ja) 1987-04-11
JPH0587017B2 true JPH0587017B2 (esLanguage) 1993-12-15

Family

ID=16719585

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60218417A Granted JPS6278862A (ja) 1985-09-30 1985-09-30 半導体素子のボンデイング用銅線

Country Status (1)

Country Link
JP (1) JPS6278862A (esLanguage)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2836692B2 (ja) * 1988-09-30 1998-12-14 田中電子工業株式会社 半導体素子のボーディング用線
JPH03165044A (ja) * 1989-11-22 1991-07-17 Tanaka Denshi Kogyo Kk 被覆線
US8610291B2 (en) 2006-08-31 2013-12-17 Nippon Steel & Sumikin Materials Co., Ltd. Copper alloy bonding wire for semiconductor device
JP5152897B2 (ja) * 2006-11-21 2013-02-27 タツタ電線株式会社 銅ボンディングワイヤ
JP5665956B2 (ja) * 2013-12-11 2015-02-04 日鉄住金マイクロメタル株式会社 ボンディングワイヤ及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59167044A (ja) * 1983-03-11 1984-09-20 Mitsubishi Metal Corp 半導体装置のワイヤ・ボンデイング用金または金合金細線
JPS60124959A (ja) * 1983-12-09 1985-07-04 Sumitomo Electric Ind Ltd 半導体素子結線用線

Also Published As

Publication number Publication date
JPS6278862A (ja) 1987-04-11

Similar Documents

Publication Publication Date Title
US4498121A (en) Copper alloys for suppressing growth of Cu-Al intermetallic compounds
JPH0471975B2 (esLanguage)
JP7032239B2 (ja) リードフレーム材およびその製造方法ならびに半導体パッケージ
JPH0587017B2 (esLanguage)
JPS59155161A (ja) 半導体素子のボンデイング用ワイヤ
JPH0291944A (ja) 金バンプ用金合金細線
JP2000307051A (ja) 銅及び銅基合金とその製造方法
JPH0216579B2 (esLanguage)
JPH0564224B2 (esLanguage)
JP3090549B2 (ja) 半導体素子用ボンディング線
JP2000273560A (ja) ワイアーボンディング性およびダイボンディング性に優れた銅及び銅基合金とその製造方法
JPS645459B2 (esLanguage)
JPS5826662B2 (ja) 半導体素子のボンデイング用金線
JPH06112257A (ja) 半導体素子用Ｐｔ合金極細線
KR930002806B1 (ko) 반도체 소자의 본딩(bonding)용 금선(金線)
JPS60248862A (ja) ボンデイングワイヤ用アルミニウム合金
JPH0423826B2 (esLanguage)
JPS5887841A (ja) 半導体素子のボンデイング用Ａｌ線
JPH0325498B2 (esLanguage)
JP2728216B2 (ja) 半導体素子のボンディング用金線
JPS6081853A (ja) ボンデイングワイヤ用アルミニウム合金
JPS60100644A (ja) ボンデイングワイヤ用アルミニウム合金
JP2003023030A (ja) ボンディングワイヤ及びその製造方法
JPS5961939A (ja) 半導体素子のボンデイング用Ａｌ線
JPS6278861A (ja) 半導体素子のボンデイング用銅線

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees