JPH0586066B2 - - Google Patents

Info

Publication number
JPH0586066B2
JPH0586066B2 JP59114051A JP11405184A JPH0586066B2 JP H0586066 B2 JPH0586066 B2 JP H0586066B2 JP 59114051 A JP59114051 A JP 59114051A JP 11405184 A JP11405184 A JP 11405184A JP H0586066 B2 JPH0586066 B2 JP H0586066B2
Authority
JP
Japan
Prior art keywords
boat
wafer
carrier
wafers
quartz boat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59114051A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60258459A (ja
Inventor
Takatoshi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Disco Corp
Original Assignee
Disco Abrasive Systems Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Disco Abrasive Systems Ltd filed Critical Disco Abrasive Systems Ltd
Priority to JP11405184A priority Critical patent/JPS60258459A/ja
Publication of JPS60258459A publication Critical patent/JPS60258459A/ja
Publication of JPH0586066B2 publication Critical patent/JPH0586066B2/ja
Granted legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F27—FURNACES; KILNS; OVENS; RETORTS
    • F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
    • F27D3/00—Charging; Discharging; Manipulation of charge
    • F27D3/0084—Charging; Manipulation of SC or SC wafers

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Chemical Vapour Deposition (AREA)
JP11405184A 1984-06-04 1984-06-04 縦型熱処理装置 Granted JPS60258459A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11405184A JPS60258459A (ja) 1984-06-04 1984-06-04 縦型熱処理装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11405184A JPS60258459A (ja) 1984-06-04 1984-06-04 縦型熱処理装置

Publications (2)

Publication Number Publication Date
JPS60258459A JPS60258459A (ja) 1985-12-20
JPH0586066B2 true JPH0586066B2 (enrdf_load_stackoverflow) 1993-12-09

Family

ID=14627803

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11405184A Granted JPS60258459A (ja) 1984-06-04 1984-06-04 縦型熱処理装置

Country Status (1)

Country Link
JP (1) JPS60258459A (enrdf_load_stackoverflow)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE33341E (en) * 1983-05-23 1990-09-18 ASQ Technology, Inc. Wafer transfer apparatus
JPS615541A (ja) * 1984-06-20 1986-01-11 Hitachi Electronics Eng Co Ltd 移し替え装置
US4770590A (en) * 1986-05-16 1988-09-13 Silicon Valley Group, Inc. Method and apparatus for transferring wafers between cassettes and a boat
US4869636A (en) * 1987-06-24 1989-09-26 Reid-Ashman Manufacturing, Inc. Handler for IC packages
JP2651859B2 (ja) * 1987-12-12 1997-09-10 東京エレクトロン株式会社 半導体ウエハー処理装置
JP2640750B2 (ja) * 1988-03-10 1997-08-13 東京エレクトロン株式会社 縦型熱処理装置用移送装置
JP2670503B2 (ja) * 1988-04-01 1997-10-29 東京エレクトロン株式会社 半導体ウエハの熱処理装置
JPH01302817A (ja) * 1988-05-31 1989-12-06 Tel Sagami Ltd 縦型熱処理装置への被処理体の挿入方法
JPH01319968A (ja) * 1988-06-21 1989-12-26 Matsushita Electric Ind Co Ltd 基板保持装置
JP2683595B2 (ja) * 1988-10-11 1997-12-03 東京エレクトロン株式会社 縦型熱処理装置
JP2683675B2 (ja) * 1989-01-26 1997-12-03 東京エレクトロン株式会社 搬送装置
JP3069575B2 (ja) * 1990-03-09 2000-07-24 東京エレクトロン株式会社 縦型熱処理装置
US5110248A (en) * 1989-07-17 1992-05-05 Tokyo Electron Sagami Limited Vertical heat-treatment apparatus having a wafer transfer mechanism
JPH03125453A (ja) * 1989-10-09 1991-05-28 Toshiba Corp 半導体ウエハ移送装置
JPH0797564B2 (ja) * 1990-02-21 1995-10-18 国際電気株式会社 縦型半導体製造装置
JPH05217928A (ja) * 1991-11-29 1993-08-27 Nec Corp 縦型熱処理装置
DE102017217304B4 (de) * 2017-09-28 2020-08-27 Jonas & Redmann Automationstechnik Gmbh Verfahren und Vorrichtung zum Transport von Substraten

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5945219B2 (ja) * 1976-05-17 1984-11-05 株式会社日立製作所 ウェハ処理装置
JPS5646262A (en) * 1979-09-25 1981-04-27 Fuji Xerox Co Ltd Prevention for dewing on lens
JPS5812439U (ja) * 1981-07-20 1983-01-26 株式会社明光商会 ラミネ−ト用フイルム
JPH0650756B2 (ja) * 1982-08-27 1994-06-29 東京応化工業株式会社 薄板状被処理物の加熱処理装置
JPS5860552A (ja) * 1981-10-05 1983-04-11 Tokyo Denshi Kagaku Kabushiki 縦型自動プラズマ処理装置
JPS5860553A (ja) * 1981-10-05 1983-04-11 Tokyo Denshi Kagaku Kabushiki 縦型自動プラズマ処理装置

Also Published As

Publication number Publication date
JPS60258459A (ja) 1985-12-20

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