JPH0581399B2 - - Google Patents
Info
- Publication number
- JPH0581399B2 JPH0581399B2 JP61081837A JP8183786A JPH0581399B2 JP H0581399 B2 JPH0581399 B2 JP H0581399B2 JP 61081837 A JP61081837 A JP 61081837A JP 8183786 A JP8183786 A JP 8183786A JP H0581399 B2 JPH0581399 B2 JP H0581399B2
- Authority
- JP
- Japan
- Prior art keywords
- thin plate
- protective film
- cutter
- blade
- along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001681 protective effect Effects 0.000 claims description 42
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000003028 elevating effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081837A JPS62236738A (ja) | 1986-04-07 | 1986-04-07 | 薄板保護用フイルムの切抜き方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61081837A JPS62236738A (ja) | 1986-04-07 | 1986-04-07 | 薄板保護用フイルムの切抜き方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4011342A Division JPH0782977B2 (ja) | 1992-01-24 | 1992-01-24 | 薄板保護用フィルムの切抜き装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62236738A JPS62236738A (ja) | 1987-10-16 |
| JPH0581399B2 true JPH0581399B2 (ko) | 1993-11-12 |
Family
ID=13757580
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61081837A Granted JPS62236738A (ja) | 1986-04-07 | 1986-04-07 | 薄板保護用フイルムの切抜き方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62236738A (ko) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03208596A (ja) * | 1989-12-29 | 1991-09-11 | Iyozo Sano | 自動円形裁断装置 |
| JPH0753357B2 (ja) * | 1990-12-20 | 1995-06-07 | ソマール株式会社 | 薄膜切り抜き方法とその実施装置 |
| JP4640763B2 (ja) * | 2004-07-01 | 2011-03-02 | 日東電工株式会社 | 半導体ウエハの保護テープ切断方法および保護テープ切断装置 |
| JP4890868B2 (ja) * | 2006-01-18 | 2012-03-07 | リンテック株式会社 | シート切断装置及び切断方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329858A (en) * | 1976-08-31 | 1978-03-20 | Matsushita Electric Works Ltd | Certificate containing box |
| JPS5627796A (en) * | 1979-08-16 | 1981-03-18 | Yec Kk | Trimming device |
-
1986
- 1986-04-07 JP JP61081837A patent/JPS62236738A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5329858A (en) * | 1976-08-31 | 1978-03-20 | Matsushita Electric Works Ltd | Certificate containing box |
| JPS5627796A (en) * | 1979-08-16 | 1981-03-18 | Yec Kk | Trimming device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62236738A (ja) | 1987-10-16 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |