JPH0581077B2 - - Google Patents
Info
- Publication number
- JPH0581077B2 JPH0581077B2 JP60189835A JP18983585A JPH0581077B2 JP H0581077 B2 JPH0581077 B2 JP H0581077B2 JP 60189835 A JP60189835 A JP 60189835A JP 18983585 A JP18983585 A JP 18983585A JP H0581077 B2 JPH0581077 B2 JP H0581077B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating layer
- polyimide
- conductor
- multilayer wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18983585A JPS6251294A (ja) | 1985-08-30 | 1985-08-30 | 多層配線板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18983585A JPS6251294A (ja) | 1985-08-30 | 1985-08-30 | 多層配線板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6251294A JPS6251294A (ja) | 1987-03-05 |
JPH0581077B2 true JPH0581077B2 (enrdf_load_stackoverflow) | 1993-11-11 |
Family
ID=16248003
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18983585A Granted JPS6251294A (ja) | 1985-08-30 | 1985-08-30 | 多層配線板の製造方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6251294A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69105753T2 (de) * | 1990-11-15 | 1995-05-24 | Ibm | Herstellungsmethode einer dünnschichtmehrlagenstruktur. |
JP2710581B2 (ja) * | 1995-04-26 | 1998-02-10 | 茨城日本電気株式会社 | 銅配線上のポリイミド膜及びその形成方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5617041A (en) * | 1979-07-20 | 1981-02-18 | Toshiba Corp | Manufacture of semiconductor device |
JPS56138993A (en) * | 1980-04-01 | 1981-10-29 | Nippon Telegraph & Telephone | Method of producing multilayer printed cirucit board |
JPS6044338A (ja) * | 1983-08-19 | 1985-03-09 | 株式会社日立製作所 | 複合成形品 |
-
1985
- 1985-08-30 JP JP18983585A patent/JPS6251294A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6251294A (ja) | 1987-03-05 |
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