JPH0578950B2 - - Google Patents
Info
- Publication number
- JPH0578950B2 JPH0578950B2 JP60293543A JP29354385A JPH0578950B2 JP H0578950 B2 JPH0578950 B2 JP H0578950B2 JP 60293543 A JP60293543 A JP 60293543A JP 29354385 A JP29354385 A JP 29354385A JP H0578950 B2 JPH0578950 B2 JP H0578950B2
- Authority
- JP
- Japan
- Prior art keywords
- insulating film
- film
- electrode
- forming
- pressure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 24
- 238000000034 method Methods 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 2
- 239000010408 film Substances 0.000 description 53
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 30
- 239000010409 thin film Substances 0.000 description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 20
- 229910052814 silicon oxide Inorganic materials 0.000 description 20
- 229910052697 platinum Inorganic materials 0.000 description 15
- 229910052581 Si3N4 Inorganic materials 0.000 description 10
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 10
- 238000001514 detection method Methods 0.000 description 9
- 238000000206 photolithography Methods 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 5
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 4
- 238000004364 calculation method Methods 0.000 description 4
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 239000011800 void material Substances 0.000 description 4
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910017604 nitric acid Inorganic materials 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- ZXEYZECDXFPJRJ-UHFFFAOYSA-N $l^{3}-silane;platinum Chemical compound [SiH3].[Pt] ZXEYZECDXFPJRJ-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 229910021339 platinum silicide Inorganic materials 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- -1 boron ion Chemical class 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Pressure Sensors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29354385A JPS62156879A (ja) | 1985-12-28 | 1985-12-28 | 半導体圧力検知装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29354385A JPS62156879A (ja) | 1985-12-28 | 1985-12-28 | 半導体圧力検知装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62156879A JPS62156879A (ja) | 1987-07-11 |
| JPH0578950B2 true JPH0578950B2 (zh) | 1993-10-29 |
Family
ID=17796106
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29354385A Granted JPS62156879A (ja) | 1985-12-28 | 1985-12-28 | 半導体圧力検知装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62156879A (zh) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0750789B2 (ja) * | 1986-07-18 | 1995-05-31 | 日産自動車株式会社 | 半導体圧力変換装置の製造方法 |
| JP3567094B2 (ja) | 1999-02-09 | 2004-09-15 | 株式会社日立製作所 | 回路内蔵型センサおよびそれを用いた圧力検出装置 |
| JP4710147B2 (ja) * | 2000-06-13 | 2011-06-29 | 株式会社デンソー | 半導体圧力センサ |
| JP5127210B2 (ja) * | 2006-11-30 | 2013-01-23 | 株式会社日立製作所 | Ｍｅｍｓセンサが混載された半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029629A (ja) * | 1983-07-27 | 1985-02-15 | Yokogawa Hokushin Electric Corp | 半導体容量形圧力センサ |
| JPS60138977A (ja) * | 1983-12-27 | 1985-07-23 | Fuji Electric Co Ltd | 半導体形静電容量式圧力センサ |
-
1985
- 1985-12-28 JP JP29354385A patent/JPS62156879A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6029629A (ja) * | 1983-07-27 | 1985-02-15 | Yokogawa Hokushin Electric Corp | 半導体容量形圧力センサ |
| JPS60138977A (ja) * | 1983-12-27 | 1985-07-23 | Fuji Electric Co Ltd | 半導体形静電容量式圧力センサ |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62156879A (ja) | 1987-07-11 |
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