JPH0577180B2 - - Google Patents

Info

Publication number
JPH0577180B2
JPH0577180B2 JP60082309A JP8230985A JPH0577180B2 JP H0577180 B2 JPH0577180 B2 JP H0577180B2 JP 60082309 A JP60082309 A JP 60082309A JP 8230985 A JP8230985 A JP 8230985A JP H0577180 B2 JPH0577180 B2 JP H0577180B2
Authority
JP
Japan
Prior art keywords
gripped
shape memory
gripping
memory alloy
bodies
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60082309A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61241940A (ja
Inventor
Juji Hosoda
Masakatsu Fuje
Kazuo Pponma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8230985A priority Critical patent/JPS61241940A/ja
Priority to US06/853,450 priority patent/US4715637A/en
Priority to DE8686105342T priority patent/DE3685835T2/de
Priority to EP86105342A priority patent/EP0198501B1/en
Publication of JPS61241940A publication Critical patent/JPS61241940A/ja
Publication of JPH0577180B2 publication Critical patent/JPH0577180B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Automatic Assembly (AREA)
  • Manipulator (AREA)
JP8230985A 1985-04-17 1985-04-19 把持装置 Granted JPS61241940A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP8230985A JPS61241940A (ja) 1985-04-19 1985-04-19 把持装置
US06/853,450 US4715637A (en) 1985-04-17 1986-04-17 Grip device for sheet-like objects
DE8686105342T DE3685835T2 (de) 1985-04-17 1986-04-17 Greiferwerkzeug.
EP86105342A EP0198501B1 (en) 1985-04-17 1986-04-17 Gripping device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8230985A JPS61241940A (ja) 1985-04-19 1985-04-19 把持装置

Publications (2)

Publication Number Publication Date
JPS61241940A JPS61241940A (ja) 1986-10-28
JPH0577180B2 true JPH0577180B2 (enrdf_load_stackoverflow) 1993-10-26

Family

ID=13770953

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8230985A Granted JPS61241940A (ja) 1985-04-17 1985-04-19 把持装置

Country Status (1)

Country Link
JP (1) JPS61241940A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6474712B1 (en) * 1999-05-15 2002-11-05 Applied Materials, Inc. Gripper for supporting substrate in a vertical orientation
FR2932272B1 (fr) * 2008-06-09 2011-02-25 Stago Diagnostica Dispositif de prehension d'une cuvette de reaction

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS568185Y2 (enrdf_load_stackoverflow) * 1975-12-10 1981-02-23
JPS59695A (ja) * 1982-06-26 1984-01-05 原子燃料工業株式会社 異物回収装置
JPS591583U (ja) * 1982-06-28 1984-01-07 オムロン株式会社 産業用ロボツト腕
JPS59156763U (ja) * 1983-04-06 1984-10-20 三洋電機株式会社 半導体装置用ピンセツト
JPS6044270A (ja) * 1983-08-15 1985-03-09 セイコーエプソン株式会社 半導体装置製造用の円形基板の取扱い治具

Also Published As

Publication number Publication date
JPS61241940A (ja) 1986-10-28

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