JPH0576182B2 - - Google Patents

Info

Publication number
JPH0576182B2
JPH0576182B2 JP16649988A JP16649988A JPH0576182B2 JP H0576182 B2 JPH0576182 B2 JP H0576182B2 JP 16649988 A JP16649988 A JP 16649988A JP 16649988 A JP16649988 A JP 16649988A JP H0576182 B2 JPH0576182 B2 JP H0576182B2
Authority
JP
Japan
Prior art keywords
wire
tin
clamp plate
tic
silicon carbide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP16649988A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0216745A (ja
Inventor
Yoshihiko Yuzawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
OGURA HOSEKI SEIKI KOGYO KK
Original Assignee
Showa Denko KK
OGURA HOSEKI SEIKI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, OGURA HOSEKI SEIKI KOGYO KK filed Critical Showa Denko KK
Priority to JP16649988A priority Critical patent/JPH0216745A/ja
Publication of JPH0216745A publication Critical patent/JPH0216745A/ja
Publication of JPH0576182B2 publication Critical patent/JPH0576182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/049—Nitrides composed of metals from groups of the periodic table
    • H01L2924/0494—4th Group
    • H01L2924/04941—TiN

Landscapes

  • Wire Bonding (AREA)
JP16649988A 1988-07-04 1988-07-04 ワイヤクランプ板 Granted JPH0216745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16649988A JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16649988A JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Publications (2)

Publication Number Publication Date
JPH0216745A JPH0216745A (ja) 1990-01-19
JPH0576182B2 true JPH0576182B2 (enExample) 1993-10-22

Family

ID=15832498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16649988A Granted JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Country Status (1)

Country Link
JP (1) JPH0216745A (enExample)

Also Published As

Publication number Publication date
JPH0216745A (ja) 1990-01-19

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