JPH0527980B2 - - Google Patents

Info

Publication number
JPH0527980B2
JPH0527980B2 JP24765484A JP24765484A JPH0527980B2 JP H0527980 B2 JPH0527980 B2 JP H0527980B2 JP 24765484 A JP24765484 A JP 24765484A JP 24765484 A JP24765484 A JP 24765484A JP H0527980 B2 JPH0527980 B2 JP H0527980B2
Authority
JP
Japan
Prior art keywords
tip
capillary
hard coating
thin metal
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP24765484A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61125144A (ja
Inventor
Noriko Watanabe
Minoru Kobayashi
Miho Hirota
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59247654A priority Critical patent/JPS61125144A/ja
Publication of JPS61125144A publication Critical patent/JPS61125144A/ja
Publication of JPH0527980B2 publication Critical patent/JPH0527980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59247654A 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ Granted JPS61125144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59247654A JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59247654A JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Publications (2)

Publication Number Publication Date
JPS61125144A JPS61125144A (ja) 1986-06-12
JPH0527980B2 true JPH0527980B2 (enExample) 1993-04-22

Family

ID=17166693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59247654A Granted JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Country Status (1)

Country Link
JP (1) JPS61125144A (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−

Also Published As

Publication number Publication date
JPS61125144A (ja) 1986-06-12

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