JPS61125144A - ワイヤボンデイング用キヤピラリチツプ - Google Patents

ワイヤボンデイング用キヤピラリチツプ

Info

Publication number
JPS61125144A
JPS61125144A JP59247654A JP24765484A JPS61125144A JP S61125144 A JPS61125144 A JP S61125144A JP 59247654 A JP59247654 A JP 59247654A JP 24765484 A JP24765484 A JP 24765484A JP S61125144 A JPS61125144 A JP S61125144A
Authority
JP
Japan
Prior art keywords
hard coating
capillary chip
wire bonding
thin metal
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59247654A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0527980B2 (enExample
Inventor
Noriko Watanabe
渡辺　訓子
Minoru Kobayashi
実 小林
Saneyasu Hirota
弘田　実保
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP59247654A priority Critical patent/JPS61125144A/ja
Publication of JPS61125144A publication Critical patent/JPS61125144A/ja
Publication of JPH0527980B2 publication Critical patent/JPH0527980B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP59247654A 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ Granted JPS61125144A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59247654A JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59247654A JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Publications (2)

Publication Number Publication Date
JPS61125144A true JPS61125144A (ja) 1986-06-12
JPH0527980B2 JPH0527980B2 (enExample) 1993-04-22

Family

ID=17166693

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59247654A Granted JPS61125144A (ja) 1984-11-22 1984-11-22 ワイヤボンデイング用キヤピラリチツプ

Country Status (1)

Country Link
JP (1) JPS61125144A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62158335A (ja) * 1985-12-28 1987-07-14 Kyocera Corp ワイヤボンディング用キャピラリ−

Also Published As

Publication number Publication date
JPH0527980B2 (enExample) 1993-04-22

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