JPH0216745A - ワイヤクランプ板 - Google Patents

ワイヤクランプ板

Info

Publication number
JPH0216745A
JPH0216745A JP63166499A JP16649988A JPH0216745A JP H0216745 A JPH0216745 A JP H0216745A JP 63166499 A JP63166499 A JP 63166499A JP 16649988 A JP16649988 A JP 16649988A JP H0216745 A JPH0216745 A JP H0216745A
Authority
JP
Japan
Prior art keywords
clamp plate
wire
tin
tic
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP63166499A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0576182B2 (enExample
Inventor
Yoshihiko Yuzawa
湯沢　慶彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Original Assignee
Showa Denko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK filed Critical Showa Denko KK
Priority to JP63166499A priority Critical patent/JPH0216745A/ja
Publication of JPH0216745A publication Critical patent/JPH0216745A/ja
Publication of JPH0576182B2 publication Critical patent/JPH0576182B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member

Landscapes

  • Wire Bonding (AREA)
JP63166499A 1988-07-04 1988-07-04 ワイヤクランプ板 Granted JPH0216745A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63166499A JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63166499A JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Publications (2)

Publication Number Publication Date
JPH0216745A true JPH0216745A (ja) 1990-01-19
JPH0576182B2 JPH0576182B2 (enExample) 1993-10-22

Family

ID=15832498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63166499A Granted JPH0216745A (ja) 1988-07-04 1988-07-04 ワイヤクランプ板

Country Status (1)

Country Link
JP (1) JPH0216745A (enExample)

Also Published As

Publication number Publication date
JPH0576182B2 (enExample) 1993-10-22

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