JPH0216745A - ワイヤクランプ板 - Google Patents
ワイヤクランプ板Info
- Publication number
- JPH0216745A JPH0216745A JP16649988A JP16649988A JPH0216745A JP H0216745 A JPH0216745 A JP H0216745A JP 16649988 A JP16649988 A JP 16649988A JP 16649988 A JP16649988 A JP 16649988A JP H0216745 A JPH0216745 A JP H0216745A
- Authority
- JP
- Japan
- Prior art keywords
- clamp plate
- wire
- tin
- tic
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 22
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910010271 silicon carbide Inorganic materials 0.000 claims abstract description 12
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 abstract description 14
- 239000011248 coating agent Substances 0.000 abstract description 12
- 230000005611 electricity Effects 0.000 abstract description 9
- 230000003068 static effect Effects 0.000 abstract description 9
- 229910001750 ruby Inorganic materials 0.000 description 7
- 239000010979 ruby Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 150000002500 ions Chemical class 0.000 description 3
- 239000011195 cermet Substances 0.000 description 2
- 238000010891 electric arc Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/049—Nitrides composed of metals from groups of the periodic table
- H01L2924/0494—4th Group
- H01L2924/04941—TiN
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16649988A JPH0216745A (ja) | 1988-07-04 | 1988-07-04 | ワイヤクランプ板 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16649988A JPH0216745A (ja) | 1988-07-04 | 1988-07-04 | ワイヤクランプ板 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0216745A true JPH0216745A (ja) | 1990-01-19 |
| JPH0576182B2 JPH0576182B2 (enExample) | 1993-10-22 |
Family
ID=15832498
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16649988A Granted JPH0216745A (ja) | 1988-07-04 | 1988-07-04 | ワイヤクランプ板 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216745A (enExample) |
-
1988
- 1988-07-04 JP JP16649988A patent/JPH0216745A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0576182B2 (enExample) | 1993-10-22 |
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