JPH0575015B2 - - Google Patents
Info
- Publication number
- JPH0575015B2 JPH0575015B2 JP6416286A JP6416286A JPH0575015B2 JP H0575015 B2 JPH0575015 B2 JP H0575015B2 JP 6416286 A JP6416286 A JP 6416286A JP 6416286 A JP6416286 A JP 6416286A JP H0575015 B2 JPH0575015 B2 JP H0575015B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- parts
- styrene
- weight
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6416286A JPS62220539A (ja) | 1986-03-24 | 1986-03-24 | 難燃化樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6416286A JPS62220539A (ja) | 1986-03-24 | 1986-03-24 | 難燃化樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62220539A JPS62220539A (ja) | 1987-09-28 |
| JPH0575015B2 true JPH0575015B2 (enFirst) | 1993-10-19 |
Family
ID=13250094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6416286A Granted JPS62220539A (ja) | 1986-03-24 | 1986-03-24 | 難燃化樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62220539A (enFirst) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
-
1986
- 1986-03-24 JP JP6416286A patent/JPS62220539A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7061120B2 (en) | 1999-05-20 | 2006-06-13 | Amkor Technology, Inc. | Stackable semiconductor package having semiconductor chip within central through hole of substrate |
| US7633144B1 (en) | 2006-05-24 | 2009-12-15 | Amkor Technology, Inc. | Semiconductor package |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62220539A (ja) | 1987-09-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0767204B1 (en) | Flame-retardant resin composition | |
| KR0163445B1 (ko) | 수지조성물 | |
| KR100564920B1 (ko) | 난연성 수지 조성물 | |
| JPS619450A (ja) | 難燃性樹脂組成物 | |
| JPH068371B2 (ja) | 難燃性樹脂組成物 | |
| JP4790804B2 (ja) | 難燃性成形組成物 | |
| JP4219454B2 (ja) | 難燃性樹脂組成物 | |
| JPWO2000046298A1 (ja) | 熱可塑性樹脂組成物 | |
| JP3735966B2 (ja) | 樹脂組成物およびその製法 | |
| JPH0575015B2 (enFirst) | ||
| JP3565593B2 (ja) | 高剛性難燃性樹脂組成物 | |
| JP3923764B2 (ja) | ポリフェニレンエーテル樹脂組成物 | |
| JPH06184357A (ja) | 樹脂組成物 | |
| JP3745121B2 (ja) | ポリフェニレンエーテル樹脂組成物 | |
| JP3923763B2 (ja) | ポリフェニレンエーテル系難燃樹脂組成物 | |
| KR20020007814A (ko) | 열가소성 난연성 수지 조성물 | |
| JP3500390B2 (ja) | 難燃樹脂電気部品 | |
| JPH06228426A (ja) | 樹脂組成物 | |
| JPH0820717A (ja) | 良流動性難燃樹脂組成物 | |
| JP3363594B2 (ja) | 難燃性樹脂組成物 | |
| JP3537187B2 (ja) | 難燃性樹脂ハウジング材料 | |
| JPH0987511A (ja) | ポリフェニレンエーテル系難燃性樹脂組成物 | |
| JP2521962B2 (ja) | 難燃性ポリフェニレンエ−テル系樹脂組成物 | |
| JPH09188791A (ja) | 難燃性スチレン系樹脂組成物 | |
| JP4100729B2 (ja) | 難燃性熱可塑性樹脂組成物 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |