JPH0573272B2 - - Google Patents

Info

Publication number
JPH0573272B2
JPH0573272B2 JP1268187A JP1268187A JPH0573272B2 JP H0573272 B2 JPH0573272 B2 JP H0573272B2 JP 1268187 A JP1268187 A JP 1268187A JP 1268187 A JP1268187 A JP 1268187A JP H0573272 B2 JPH0573272 B2 JP H0573272B2
Authority
JP
Japan
Prior art keywords
output
power
circuits
pad
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP1268187A
Other languages
English (en)
Japanese (ja)
Other versions
JPS63179560A (ja
Inventor
Makoto Myazawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC IC Microcomputer Systems Co Ltd
Original Assignee
NEC IC Microcomputer Systems Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC IC Microcomputer Systems Co Ltd filed Critical NEC IC Microcomputer Systems Co Ltd
Priority to JP1268187A priority Critical patent/JPS63179560A/ja
Publication of JPS63179560A publication Critical patent/JPS63179560A/ja
Publication of JPH0573272B2 publication Critical patent/JPH0573272B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Design And Manufacture Of Integrated Circuits (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP1268187A 1987-01-21 1987-01-21 集積回路記憶装置 Granted JPS63179560A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1268187A JPS63179560A (ja) 1987-01-21 1987-01-21 集積回路記憶装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1268187A JPS63179560A (ja) 1987-01-21 1987-01-21 集積回路記憶装置

Publications (2)

Publication Number Publication Date
JPS63179560A JPS63179560A (ja) 1988-07-23
JPH0573272B2 true JPH0573272B2 (enrdf_load_stackoverflow) 1993-10-14

Family

ID=11812121

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1268187A Granted JPS63179560A (ja) 1987-01-21 1987-01-21 集積回路記憶装置

Country Status (1)

Country Link
JP (1) JPS63179560A (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01139437U (enrdf_load_stackoverflow) * 1988-03-18 1989-09-22

Also Published As

Publication number Publication date
JPS63179560A (ja) 1988-07-23

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