JPH0572103B2 - - Google Patents
Info
- Publication number
- JPH0572103B2 JPH0572103B2 JP63031594A JP3159488A JPH0572103B2 JP H0572103 B2 JPH0572103 B2 JP H0572103B2 JP 63031594 A JP63031594 A JP 63031594A JP 3159488 A JP3159488 A JP 3159488A JP H0572103 B2 JPH0572103 B2 JP H0572103B2
- Authority
- JP
- Japan
- Prior art keywords
- axis
- axis direction
- frame
- moved
- motor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000001360 synchronised effect Effects 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003111 delayed effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3159488A JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3159488A JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH01206637A JPH01206637A (ja) | 1989-08-18 |
JPH0572103B2 true JPH0572103B2 (zh) | 1993-10-08 |
Family
ID=12335520
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3159488A Granted JPH01206637A (ja) | 1988-02-13 | 1988-02-13 | Xy駆動機構 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01206637A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007173264A (ja) * | 2005-12-19 | 2007-07-05 | Tanaka Seiki Kk | 多軸巻線機 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58141A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 自動インナ−リ−ドボンデイング方法 |
JPS58120448A (ja) * | 1981-12-29 | 1983-07-18 | Fanuc Ltd | 工作機械のテ−ブル制御方式 |
-
1988
- 1988-02-13 JP JP3159488A patent/JPH01206637A/ja active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58141A (ja) * | 1981-06-25 | 1983-01-05 | Shinkawa Ltd | 自動インナ−リ−ドボンデイング方法 |
JPS58120448A (ja) * | 1981-12-29 | 1983-07-18 | Fanuc Ltd | 工作機械のテ−ブル制御方式 |
Also Published As
Publication number | Publication date |
---|---|
JPH01206637A (ja) | 1989-08-18 |
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