JPH0571139B2 - - Google Patents

Info

Publication number
JPH0571139B2
JPH0571139B2 JP59270443A JP27044384A JPH0571139B2 JP H0571139 B2 JPH0571139 B2 JP H0571139B2 JP 59270443 A JP59270443 A JP 59270443A JP 27044384 A JP27044384 A JP 27044384A JP H0571139 B2 JPH0571139 B2 JP H0571139B2
Authority
JP
Japan
Prior art keywords
wiring
chip
multilayer
polyimide
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP59270443A
Other languages
English (en)
Japanese (ja)
Other versions
JPS61148847A (ja
Inventor
Teruyuki Nabeta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP59270443A priority Critical patent/JPS61148847A/ja
Publication of JPS61148847A publication Critical patent/JPS61148847A/ja
Publication of JPH0571139B2 publication Critical patent/JPH0571139B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W70/611—
    • H10W70/685—
    • H10W70/60—
    • H10W72/381—
    • H10W72/536—
    • H10W72/5363—
    • H10W72/874—
    • H10W72/884—
    • H10W90/734—
    • H10W90/754—

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP59270443A 1984-12-21 1984-12-21 半導体装置 Granted JPS61148847A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59270443A JPS61148847A (ja) 1984-12-21 1984-12-21 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59270443A JPS61148847A (ja) 1984-12-21 1984-12-21 半導体装置

Publications (2)

Publication Number Publication Date
JPS61148847A JPS61148847A (ja) 1986-07-07
JPH0571139B2 true JPH0571139B2 (cg-RX-API-DMAC10.html) 1993-10-06

Family

ID=17486352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59270443A Granted JPS61148847A (ja) 1984-12-21 1984-12-21 半導体装置

Country Status (1)

Country Link
JP (1) JPS61148847A (cg-RX-API-DMAC10.html)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3214470B2 (ja) * 1998-11-16 2001-10-02 日本電気株式会社 マルチチップモジュール及びその製造方法
JP2001332859A (ja) 2000-05-22 2001-11-30 Murata Mfg Co Ltd 積層型セラミック電子部品およびその製造方法ならびに電子装置

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856451U (ja) * 1981-10-07 1983-04-16 三菱電機株式会社 半導体装置

Also Published As

Publication number Publication date
JPS61148847A (ja) 1986-07-07

Similar Documents

Publication Publication Date Title
US5051865A (en) Multi-layer semiconductor device
US6380048B1 (en) Die paddle enhancement for exposed pad in semiconductor packaging
US4866501A (en) Wafer scale integration
EP0222144B1 (en) A wafer-scale semiconductor device
RU2146067C1 (ru) Органический кристаллодержатель для интегральных схем с проволочными соединениями
US4692839A (en) Multiple chip interconnection system and package
US20020038908A1 (en) Thermal enhanced ball grid array package
US20030151139A1 (en) Semiconductor device
US4646126A (en) Semiconductor device
JPH0573079B2 (cg-RX-API-DMAC10.html)
JP3284969B2 (ja) 多層配線基板
JPS6250981B2 (cg-RX-API-DMAC10.html)
JPH03195053A (ja) インバータ装置
JPH0571139B2 (cg-RX-API-DMAC10.html)
JPH0513610A (ja) 半導体集積回路チツプ実装用基板
JPH10209332A (ja) 金属基板を含む回路パッケージ及び実装方法
JPH03195083A (ja) 混成集積回路およびその製造方法
JPH05218226A (ja) 多層配線基板
JP2755587B2 (ja) 回路基板
JPH06169031A (ja) 半導体装置及びその製造方法
US20010000156A1 (en) Package board structure and manufacturing method thereof
JPH0462457B2 (cg-RX-API-DMAC10.html)
JP2831864B2 (ja) 半導体パッケージ及びその製造方法
JP4356196B2 (ja) 半導体装置組立体
JP2601640B2 (ja) 電気的導体構造を作成する方法と大規模集積回路

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees