JPH0567487B2 - - Google Patents
Info
- Publication number
- JPH0567487B2 JPH0567487B2 JP61038036A JP3803686A JPH0567487B2 JP H0567487 B2 JPH0567487 B2 JP H0567487B2 JP 61038036 A JP61038036 A JP 61038036A JP 3803686 A JP3803686 A JP 3803686A JP H0567487 B2 JPH0567487 B2 JP H0567487B2
- Authority
- JP
- Japan
- Prior art keywords
- electronic components
- tape
- leads
- tie bar
- taping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 claims description 13
- 238000010586 diagram Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61038036A JPS62208317A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61038036A JPS62208317A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62208317A JPS62208317A (ja) | 1987-09-12 |
| JPH0567487B2 true JPH0567487B2 (enrdf_load_stackoverflow) | 1993-09-27 |
Family
ID=12514310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61038036A Granted JPS62208317A (ja) | 1986-02-21 | 1986-02-21 | 電子部品のテ−ピング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62208317A (enrdf_load_stackoverflow) |
-
1986
- 1986-02-21 JP JP61038036A patent/JPS62208317A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS62208317A (ja) | 1987-09-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0567487B2 (enrdf_load_stackoverflow) | ||
| JP2637370B2 (ja) | 電子部品のテーピング方法 | |
| JP2637369B2 (ja) | 電子部品のテーピング方法 | |
| JPH0442260B2 (enrdf_load_stackoverflow) | ||
| JPS5915075Y2 (ja) | フイルムキヤリヤテ−プ | |
| JPS62208318A (ja) | 電子部品のテ−ピング方法 | |
| JPS6219573Y2 (enrdf_load_stackoverflow) | ||
| JPH0124959Y2 (enrdf_load_stackoverflow) | ||
| JPH01189992A (ja) | プリント基板実装方法 | |
| JPH06349899A (ja) | 半導体装置 | |
| JPH04267709A (ja) | テーピング電子部品連の接続方法 | |
| JP3367511B2 (ja) | テープキャリアの実装方法および液晶表示装置の製造方法 | |
| JP2542125Y2 (ja) | 分割回路基板 | |
| JPS588696Y2 (ja) | 電子部品の保持テ−プ | |
| JPH0127551B2 (enrdf_load_stackoverflow) | ||
| JPS6119025A (ja) | ヒユ−ズの製造方法 | |
| JPH03224725A (ja) | プラスチック・キャリアテープの接続方法 | |
| JPH0225245Y2 (enrdf_load_stackoverflow) | ||
| JPH01145892A (ja) | フレキシブルプリント基板 | |
| JP2513203B2 (ja) | 混成集積回路の実装方法 | |
| JP3102114B2 (ja) | リードフレーム | |
| JPH0142365Y2 (enrdf_load_stackoverflow) | ||
| JPH0343367A (ja) | 部品集合体 | |
| JPH0363202B2 (enrdf_load_stackoverflow) | ||
| JPS60143687A (ja) | 半田形成方法 |