JPH0363202B2 - - Google Patents

Info

Publication number
JPH0363202B2
JPH0363202B2 JP56062463A JP6246381A JPH0363202B2 JP H0363202 B2 JPH0363202 B2 JP H0363202B2 JP 56062463 A JP56062463 A JP 56062463A JP 6246381 A JP6246381 A JP 6246381A JP H0363202 B2 JPH0363202 B2 JP H0363202B2
Authority
JP
Japan
Prior art keywords
taping
tape
width
taped
tapes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP56062463A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57177503A (en
Inventor
Masami Matsui
Takao Naito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56062463A priority Critical patent/JPS57177503A/ja
Publication of JPS57177503A publication Critical patent/JPS57177503A/ja
Publication of JPH0363202B2 publication Critical patent/JPH0363202B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP56062463A 1981-04-27 1981-04-27 Taping method Granted JPS57177503A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56062463A JPS57177503A (en) 1981-04-27 1981-04-27 Taping method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56062463A JPS57177503A (en) 1981-04-27 1981-04-27 Taping method

Publications (2)

Publication Number Publication Date
JPS57177503A JPS57177503A (en) 1982-11-01
JPH0363202B2 true JPH0363202B2 (enrdf_load_stackoverflow) 1991-09-30

Family

ID=13200920

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56062463A Granted JPS57177503A (en) 1981-04-27 1981-04-27 Taping method

Country Status (1)

Country Link
JP (1) JPS57177503A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS57177503A (en) 1982-11-01

Similar Documents

Publication Publication Date Title
JP3147666B2 (ja) 積層電子部品およびその製造方法
JP3512655B2 (ja) 半導体装置およびその製造方法並びに該半導体装置の製造に使用される補強用テープ
US4859614A (en) Method for manufacturing semiconductor device with leads adhered to supporting insulator sheet
JPH054479A (ja) 集積回路モジユール支持体を用いた識別カード
EP0113763B1 (en) Lead frame and method
JPS5923100B2 (ja) 電子部品群の製造方法
JP3609539B2 (ja) 電子部品の製造方法、電子部品の出荷形態化方法、電子部品集合体、およびこの電子部品集合体の使用方法
US3978516A (en) Lead frame assembly for a packaged semiconductor microcircuit
US3961413A (en) Method and apparatus for the assembly of semiconductor devices
JPH0363202B2 (enrdf_load_stackoverflow)
JP3451301B2 (ja) フィルムデバイスの製造方法
JPS6223477B2 (enrdf_load_stackoverflow)
JP2637369B2 (ja) 電子部品のテーピング方法
EP0143441A2 (en) Lead frame and the method of manufacturing the same
JPS6035527A (ja) 半導体装置の製造法およびそれに用いるテ−プ
JPS6219573Y2 (enrdf_load_stackoverflow)
JPS60121797A (ja) テ−ピング電子部品連
JP2637370B2 (ja) 電子部品のテーピング方法
JPH029194A (ja) フレキシブルプリント回路基板配列構造体およびフレシキブルプリント回路基板の製造方法
JPS59113618A (ja) 電子部品連
JP3367511B2 (ja) テープキャリアの実装方法および液晶表示装置の製造方法
JPS63204735A (ja) 半導体装置のパツケ−ジ構造
JPH01153415A (ja) チップ部品連の製造方法
JPS61287563A (ja) テ−ピング部品のリ−ド
JPH0779194B2 (ja) フレキシブル基板への電気部品の実装方法