JPH056660Y2 - - Google Patents

Info

Publication number
JPH056660Y2
JPH056660Y2 JP1986195655U JP19565586U JPH056660Y2 JP H056660 Y2 JPH056660 Y2 JP H056660Y2 JP 1986195655 U JP1986195655 U JP 1986195655U JP 19565586 U JP19565586 U JP 19565586U JP H056660 Y2 JPH056660 Y2 JP H056660Y2
Authority
JP
Japan
Prior art keywords
bonding
lead
tip
gigantic
present
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1986195655U
Other languages
English (en)
Japanese (ja)
Other versions
JPS63100834U (enrdf_load_html_response
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986195655U priority Critical patent/JPH056660Y2/ja
Publication of JPS63100834U publication Critical patent/JPS63100834U/ja
Application granted granted Critical
Publication of JPH056660Y2 publication Critical patent/JPH056660Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP1986195655U 1986-12-19 1986-12-19 Expired - Lifetime JPH056660Y2 (enrdf_load_html_response)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986195655U JPH056660Y2 (enrdf_load_html_response) 1986-12-19 1986-12-19

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986195655U JPH056660Y2 (enrdf_load_html_response) 1986-12-19 1986-12-19

Publications (2)

Publication Number Publication Date
JPS63100834U JPS63100834U (enrdf_load_html_response) 1988-06-30
JPH056660Y2 true JPH056660Y2 (enrdf_load_html_response) 1993-02-19

Family

ID=31153738

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986195655U Expired - Lifetime JPH056660Y2 (enrdf_load_html_response) 1986-12-19 1986-12-19

Country Status (1)

Country Link
JP (1) JPH056660Y2 (enrdf_load_html_response)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02205334A (ja) * 1989-02-03 1990-08-15 Orient Watch Co Ltd 半導体装置の製造方法

Also Published As

Publication number Publication date
JPS63100834U (enrdf_load_html_response) 1988-06-30

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