JPH056582B2 - - Google Patents
Info
- Publication number
- JPH056582B2 JPH056582B2 JP59201964A JP20196484A JPH056582B2 JP H056582 B2 JPH056582 B2 JP H056582B2 JP 59201964 A JP59201964 A JP 59201964A JP 20196484 A JP20196484 A JP 20196484A JP H056582 B2 JPH056582 B2 JP H056582B2
- Authority
- JP
- Japan
- Prior art keywords
- parts
- particle size
- viscosity
- volume
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20196484A JPS6181422A (ja) | 1984-09-28 | 1984-09-28 | 注型用エポキシ樹脂組成物 |
US06/717,111 US4617330A (en) | 1984-03-30 | 1985-03-28 | Epoxy resin composition for cast molding |
DE8585103820T DE3564440D1 (en) | 1984-03-30 | 1985-03-29 | Epoxy resin composition for cast molding |
EP85103820A EP0160829B1 (en) | 1984-03-30 | 1985-03-29 | Epoxy resin composition for cast molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20196484A JPS6181422A (ja) | 1984-09-28 | 1984-09-28 | 注型用エポキシ樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6181422A JPS6181422A (ja) | 1986-04-25 |
JPH056582B2 true JPH056582B2 (enrdf_load_stackoverflow) | 1993-01-26 |
Family
ID=16449679
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20196484A Granted JPS6181422A (ja) | 1984-03-30 | 1984-09-28 | 注型用エポキシ樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6181422A (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63254122A (ja) * | 1987-04-10 | 1988-10-20 | Toshiba Corp | エポキシ樹脂組成物 |
JP3474726B2 (ja) * | 1997-05-19 | 2003-12-08 | 株式会社東芝 | エポキシ樹脂組成物およびこれを用いたモールド真空バルブ |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS492837A (enrdf_load_stackoverflow) * | 1972-04-20 | 1974-01-11 | ||
JPS5137176B2 (enrdf_load_stackoverflow) * | 1973-02-24 | 1976-10-14 | ||
JPS5610947A (en) * | 1979-07-10 | 1981-02-03 | Toshiba Corp | Semiconductor sealing resin composition |
JPS58164250A (ja) * | 1982-03-24 | 1983-09-29 | Nitto Electric Ind Co Ltd | 半導体封止用樹脂組成物 |
JPS59168043A (ja) * | 1983-03-15 | 1984-09-21 | Matsushita Electric Works Ltd | 樹脂組成物 |
-
1984
- 1984-09-28 JP JP20196484A patent/JPS6181422A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6181422A (ja) | 1986-04-25 |
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