JPH0563936B2 - - Google Patents
Info
- Publication number
- JPH0563936B2 JPH0563936B2 JP3042377A JP4237791A JPH0563936B2 JP H0563936 B2 JPH0563936 B2 JP H0563936B2 JP 3042377 A JP3042377 A JP 3042377A JP 4237791 A JP4237791 A JP 4237791A JP H0563936 B2 JPH0563936 B2 JP H0563936B2
- Authority
- JP
- Japan
- Prior art keywords
- support plate
- strip
- resin
- small cross
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H10W72/5449—
-
- H10W90/756—
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3042377A JPH04211138A (ja) | 1991-02-15 | 1991-02-15 | 樹脂封止形半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3042377A JPH04211138A (ja) | 1991-02-15 | 1991-02-15 | 樹脂封止形半導体装置の製造方法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1086909A Division JPH01309338A (ja) | 1989-04-07 | 1989-04-07 | 樹脂封止形半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04211138A JPH04211138A (ja) | 1992-08-03 |
| JPH0563936B2 true JPH0563936B2 (cg-RX-API-DMAC10.html) | 1993-09-13 |
Family
ID=12634365
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3042377A Granted JPH04211138A (ja) | 1991-02-15 | 1991-02-15 | 樹脂封止形半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04211138A (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5091832B2 (ja) * | 2008-10-28 | 2012-12-05 | 新電元工業株式会社 | リードフレーム及び半導体装置 |
| CN107845575A (zh) * | 2017-11-03 | 2018-03-27 | 浙江人和光伏科技有限公司 | 一种薄片二极管的生产方法 |
-
1991
- 1991-02-15 JP JP3042377A patent/JPH04211138A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04211138A (ja) | 1992-08-03 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7781262B2 (en) | Method for producing semiconductor device and semiconductor device | |
| US7410834B2 (en) | Method of manufacturing a semiconductor device | |
| US20070262462A1 (en) | Manufacturing method of resin-molding type semiconductor device, and wiring board therefor | |
| JP7144157B2 (ja) | 半導体装置およびその製造方法 | |
| US20080122048A1 (en) | Stamped leadframe and method of manufacture thereof | |
| KR19980067735A (ko) | 반도체 패키지의 제조방법 | |
| JPH0254665B2 (cg-RX-API-DMAC10.html) | ||
| JPH0563936B2 (cg-RX-API-DMAC10.html) | ||
| US6410980B1 (en) | Electronic part with groove in lead | |
| JPH0563937B2 (cg-RX-API-DMAC10.html) | ||
| JPH0739241Y2 (ja) | 樹脂封止型半導体装置用リードフレーム | |
| JPH0451975B2 (cg-RX-API-DMAC10.html) | ||
| JPH0249445A (ja) | 樹脂封止形半導体装置の製造方法 | |
| JPH0451976B2 (cg-RX-API-DMAC10.html) | ||
| US20030098503A1 (en) | Frame for semiconductor package | |
| JPH0451974B2 (cg-RX-API-DMAC10.html) | ||
| KR20200001803U (ko) | 예비성형 리드 프레임 및 그것으로 제조된 리드 프레임 패키지 | |
| EP4425537A2 (en) | Hybrid multi-die qfp-qfn package | |
| KR100266646B1 (ko) | 반도체 패키지의 제조방법 | |
| JPH0318741B2 (cg-RX-API-DMAC10.html) | ||
| KR200331874Y1 (ko) | 반도체의다핀형태패키지 | |
| KR19980073905A (ko) | 합성수지 댐바가 구비된 리드 프레임 및 그 제조방법 | |
| JP4493170B2 (ja) | プラスチックパッケージの製造方法 | |
| JPH08204082A (ja) | 半導体装置 | |
| JPS6194349A (ja) | 樹脂封止形半導体装置の製造方法及びその製造方法に使用するリ−ドフレ−ム |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |