JPH056347B2 - - Google Patents

Info

Publication number
JPH056347B2
JPH056347B2 JP58045653A JP4565383A JPH056347B2 JP H056347 B2 JPH056347 B2 JP H056347B2 JP 58045653 A JP58045653 A JP 58045653A JP 4565383 A JP4565383 A JP 4565383A JP H056347 B2 JPH056347 B2 JP H056347B2
Authority
JP
Japan
Prior art keywords
resin
tablet
semiconductor
encapsulation
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58045653A
Other languages
English (en)
Japanese (ja)
Other versions
JPS59172241A (ja
Inventor
Kazuhide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP4565383A priority Critical patent/JPS59172241A/ja
Publication of JPS59172241A publication Critical patent/JPS59172241A/ja
Publication of JPH056347B2 publication Critical patent/JPH056347B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/462—Injection of preformed charges of material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP4565383A 1983-03-18 1983-03-18 半導体樹脂封止装置 Granted JPS59172241A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4565383A JPS59172241A (ja) 1983-03-18 1983-03-18 半導体樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4565383A JPS59172241A (ja) 1983-03-18 1983-03-18 半導体樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS59172241A JPS59172241A (ja) 1984-09-28
JPH056347B2 true JPH056347B2 (enrdf_load_stackoverflow) 1993-01-26

Family

ID=12725331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4565383A Granted JPS59172241A (ja) 1983-03-18 1983-03-18 半導体樹脂封止装置

Country Status (1)

Country Link
JP (1) JPS59172241A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793892B (zh) * 2021-12-03 2023-02-21 日商山田尖端科技股份有限公司 樹脂封裝裝置

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6248050A (ja) * 1985-08-28 1987-03-02 Seiei Kosan Kk 半導体デバイス等のパツケ−ジング方法
JP6137227B2 (ja) * 2015-03-12 2017-05-31 トヨタ自動車株式会社 樹脂モールド方法及び樹脂モールド装置
JP7461043B2 (ja) * 2020-09-10 2024-04-03 アピックヤマダ株式会社 樹脂封止装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS55132231A (en) * 1979-04-04 1980-10-14 Hitachi Ltd Tablet feeder and molding machine having it
JPS5922035B2 (ja) * 1980-09-26 1984-05-23 国産金属工業株式会社 自動車用電子錠

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI793892B (zh) * 2021-12-03 2023-02-21 日商山田尖端科技股份有限公司 樹脂封裝裝置

Also Published As

Publication number Publication date
JPS59172241A (ja) 1984-09-28

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